List of Semiconductors and ICs products
- classification：Semiconductors and ICs
496～540 item / All 4621 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
![[Case Study] Plasma Analysis of "Pa...](https://image.mono.ipros.com/public/product/image/aec/2000679537/IPROS56625809199193232139.jpeg?w=280&h=280){kind=small}
Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case
- Etching Equipment
- Wafer
- Ashing device
The definitive version of the ultra-compact vacuum reflow oven!!
- Other semiconductors
Introducing the ultra-compact vacuum high-power reflow furnace (TR-125VH3) in the world's smallest class of reflow furnace series!
- Other semiconductors
The pSLC technology achieves high performance by innovating the control circuit based on MLC, which allows for miniaturization and high integration!
- Memory
Toshiba and other major manufacturers have alternative products available.
- Other semiconductors
SiC SBD modules that contribute to high efficiency and miniaturization.
- diode
Thyristor diode module that achieves highly reliable power control.
- diode
![[For Base Stations] SiCSBD Module](https://image.mono.ipros.com/public/product/image/388894/IPROS13165741284962301912.png?w=280&h=280){kind=small}
For high frequency and high current applications! SiCSBD module contributing to miniaturization.
- diode
SiC SBD modules contributing to high efficiency and miniaturization.
- diode
You can arrange and secure five transistors to the heat sink.
- Other semiconductors
High reliability and stable supply! Thyristor diode module
- diode
Backflow prevention, dropper, diode stack for rectifier circuit
- diode
SiC SBD modules that contribute to high efficiency and miniaturization.
- diode
SiC SBD modules that contribute to high efficiency and miniaturization.
- diode
Contributing to the lightweighting of aerospace equipment through high-frequency operation of high-output power supplies.
- diode
Contributing to the improvement of safety in robot control! High-efficiency, compact SiC SBD module.
- diode
SiC SBD modules that contribute to high efficiency and miniaturization.
- diode
Contributing to high efficiency and miniaturization! Also effective against overvoltage and surge currents!
- diode
We propose coating equipment (spray coater) that can meet our customers' needs, utilizing years of prototype coating technology and a database.
- Other electronic parts
- Prototype Services
- Wafer
The only option to prevent "positioning failure." An SDR receiver for next-generation satellite constellations equipped with independent L5 signal capture and radiation resistance.
- Other semiconductors
- Dedicated IC
- Embedded Board Computers
A professional in the transportation of precision equipment that supports power supply for data centers.
- others
- Other semiconductors
Efficient heat dissipation is possible with an aluminum heat sink, axial fan, and airflow chamber.
- Other semiconductors
We propose the optimal transportation route for display manufacturing, where temperature management is crucial.
- others
- Other semiconductors
Achieving safe transportation of precision machinery. We propose delivery schedule management and optimal routes.
- Wafer
![[For Power Modules] Axial Flow Fan ...](https://image.mono.ipros.com/public/product/image/2049780/IPROS11447802576667341115.jpg?w=280&h=280){kind=small}
Efficient heat dissipation is possible with a W259mm x H121mm hollow-type heat sink, axial fan, and airflow chamber.
- Other semiconductors
![[For Power Module] Axial Fan Heat S...](https://image.mono.ipros.com/public/product/image/2049780/IPROS5639149101619974518.jpg?w=280&h=280){kind=small}
Lengths are available in 100, 150, 200, 250, and 300mm, and fan types can be selected from DC24V and AC230V.
- Other semiconductors
Ultra-hard alloy pins and shafts optimal for spindles that achieve micron precision.
- Other Auto Parts
- Other semiconductors
- Processing Jig
Introducing guide pins manufactured with micron to sub-micron precision grinding technology!
- Other Auto Parts
- Other semiconductors
- Processing Jig
Ultra-hard alloy rings for bearings that achieve micron-level precision.
- Other Auto Parts
- Other semiconductors
- Processing Jig
Supporting semiconductor manufacturing with micron to sub-micron precision grinding technology!
- Other Auto Parts
- Other semiconductors
- Processing Jig
Support for improving connector quality with micron to sub-micron precision grinding technology!
- Other Auto Parts
- Other semiconductors
- Processing Jig
Micron to submicron precision! Contributing to the miniaturization and high performance of medical devices.
- Other Auto Parts
- Other semiconductors
- Processing Jig
Achieved a high-speed cycle time and access time of 35ns! For replacing SRAM with battery backup.
- Memory
Solderable heat sink for surface mount devices measuring W13.5mm x H15.24mm x L19mm.
- Other semiconductors
Heat sink for surface mount devices measuring W8mm x H6mm x L8mm.
- Other semiconductors
High-frequency, high-current module contributing to the improvement of EV charging efficiency.
- diode
Diode stack for various applications of welding machines.
- diode
![[For Communication] In-house Device...](https://image.mono.ipros.com/public/product/image/388894/IPROS4220873387451312994.png?w=280&h=280){kind=small}
Diode stack with a wide range of current ratings.
- diode
Diode stack equipped with in-house manufactured devices that supports the safe operation of railways.
- diode
Equipped with our own devices! Ideal power supply for laser processing!
- diode
If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.
- Other semiconductor manufacturing equipment
- Resist Device
- Wafer
Chemical reactions caused by dilute gases can also be considered!
- CVD Equipment
- Wafer
- Other semiconductors
Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!
- Technical and Reference Books
- Other semiconductors
5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"
■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)
Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)
- Other semiconductors