List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

991~1035 item / All 4858 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

  • PRエリア.png
  • Other conveying machines

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No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.

  • Other Pumps

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Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!

We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"

High reliability and stable supply! Thyristor diode module

  • diode

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SiC SBD modules that contribute to high efficiency and miniaturization.

  • diode

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SiC SBD modules that contribute to high efficiency and miniaturization.

  • diode

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Contributing to the lightweighting of aerospace equipment through high-frequency operation of high-output power supplies.

  • diode

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Contributing to the improvement of safety in robot control! High-efficiency, compact SiC SBD module.

  • diode

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SiC SBD modules that contribute to high efficiency and miniaturization.

  • diode

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Contributing to high efficiency and miniaturization! Also effective against overvoltage and surge currents!

  • diode

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We propose coating equipment (spray coater) that can meet our customers' needs, utilizing years of prototype coating technology and a database.

  • Other electronic parts
  • Prototype Services
  • Wafer

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The only option to prevent "positioning failure." An SDR receiver for next-generation satellite constellations equipped with independent L5 signal capture and radiation resistance.

  • Other semiconductors
  • Dedicated IC
  • Embedded Board Computers

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A professional in the transportation of precision equipment that supports power supply for data centers.

  • others
  • Other semiconductors

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Efficient heat dissipation is possible with an aluminum heat sink, axial fan, and airflow chamber.

  • la_v_hb1.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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We propose the optimal transportation route for display manufacturing, where temperature management is crucial.

  • others
  • Other semiconductors

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Achieving safe transportation of precision machinery. We propose delivery schedule management and optimal routes.

  • Wafer

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Efficient heat dissipation is possible with a W259mm x H121mm hollow-type heat sink, axial fan, and airflow chamber.

  • la_v_hb2.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Lengths are available in 100, 150, 200, 250, and 300mm, and fan types can be selected from DC24V and AC230V.

  • la_v_hb3.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Solderable heat sink for surface mount devices measuring W13.5mm x H15.24mm x L19mm.

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  • ick_smd_k19tr.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Heat sink for surface mount devices measuring W8mm x H6mm x L8mm.

  • ICKSMDF8SA.png
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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High-frequency, high-current module contributing to the improvement of EV charging efficiency.

  • diode

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If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.

  • Other semiconductor manufacturing equipment
  • Resist Device
  • Wafer

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Chemical reactions caused by dilute gases can also be considered!

  • CVD Equipment
  • Wafer
  • Other semiconductors

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Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

  • Technical and Reference Books
  • Other semiconductors

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20261105 半導体パッケージの基礎と品質管理および最新動向.png

11/5 Webinar: Basics of Semiconductor Packaging and Quality Control

■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors

Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!

  • Wafer

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Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.

  • Wafer
  • Taping Machine

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Supports a variety of circuit configurations and a wide range of current ratings.

  • diode

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Supports a variety of circuit configurations and a wide range of current ratings.

  • diode

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Supports a variety of circuit configurations and a wide range of current ratings.

  • diode

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1/1000 micron dimension management! Providing appropriate processing tailored to customer needs.

  • Other metal materials
  • Other semiconductors

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Supports a wide range of materials! Achieving dimension management at 1/1000 microns and short delivery times.

  • Other semiconductors
  • stainless

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In the semiconductor industry! We aim for low cost and high quality to meet our customers' needs.

  • Other semiconductors
  • aluminum

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Manufacturing in Katsushika Ward! We offer products with dimension management of 1/1000 microns in a short delivery time.

  • Other semiconductors
  • Other metal materials

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Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.

  • diode

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Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.

  • diode

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Supports a variety of circuit configurations and a wide range of current ratings.

  • diode

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Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.

  • diode

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Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.

  • diode

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You can arrange and secure four transistors to the heat sink.

  • thfm.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1401-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1501-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1701-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1801-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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