List of Semiconductors and ICs products
- classification：Semiconductors and ICs
991～1035 item / All 4820 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Support for the film formation process in display manufacturing.
- Other semiconductors
- Chemicals
- Cleaning agents
High-performance SAD-type shielded room for in-house development of devices, etc.
- Other semiconductors
Aluminum extruded heat sink with a width of 45mm and a height of 85mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 45mm and a height of 80mm - available in various lengths.
- Other semiconductors
I have processed a heat sink for surface mount devices that can be soldered, measuring W8mm x H6mm x L19mm, with taping.
- Other semiconductors
Solderable heat sink for surface mount devices measuring W6.3mm x H4.8mm x L13mm.
- Other semiconductors
Efficiently update software via OTA and provide new value! Contribute to improving the overall system performance with high-speed interfaces.
- Memory
- Memory
Achieving high capacity and low price! High-reliability flash memory for automotive and industrial products.
- Memory
- Memory
Achieving high durability, high reliability, and high-speed reading and writing! High-quality memory suitable for sets requiring long-term data storage and fast, frequent rewriting.
- Memory
- Memory
A diverse product lineup ranging from low capacity to high capacity! Offering cost advantages through pin count reduction and package miniaturization.
- Memory
- Memory
This is an ideal solution for addressing information security issues in the era of IoT!
- Memory
- Memory
We propose Nexperia's high-efficiency, high-switching-speed SiC diode products!
- diode
Non-volatile memory that achieves high-speed access, high durability, and high reliability, enhancing system performance!
- Memory
- Memory
We are offering 8GB and 16GB options that fall under low capacity! This provides cost benefits to customers who are using more capacity than necessary.
- Memory
- Memory
Balancing cybersecurity and functional safety! The memory itself protects the data within it.
- Memory
- Memory
Octal interface for NAND flash memory! Enables large-capacity code storage with Octal NAND.
- Memory
- Memory
Heat sink for mounting on a circuit board that can securely hold a transistor with a clip, width 57mm, height 28mm.
- Other semiconductors
Introducing the mechanism of "silent degradation" that leads to the destruction of electronic devices without being noticed!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductors and ICs
Before the resin encapsulation of semiconductors." "A page has been added on 'Why did the 'Quiet Evolution' occur?'
"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.
A detailed explanation of specific approaches to surface treatment that are key to maximizing the quality of semiconductor resin encapsulation!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductors and ICs
Before the resin encapsulation of semiconductors." "A page has been added on 'Why did the 'Quiet Evolution' occur?'
"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.
Aluminum extruded heat sink with a width of 45mm and a height of 60mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 45mm and a height of 22mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 45mm and a height of 6mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 43.1mm and a height of 16.51mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 43.1mm and a height of 8mm - available in various lengths.
- Other semiconductors
![[Semiconductor Free Webinar] Five E...](https://image.mono.ipros.com/public/product/image/2034227/IPROS14348150124794756379.png?w=280&h=280){kind=small}
Introducing the challenges of heat in 3D stacking and chiplet integration in mobile devices!
- Seminar
- Other semiconductors
Free webinar on semiconductors! Explaining five expectations for the PC/laptop/tablet market.
- Seminar
- Other semiconductors
Grasp the consumer electronics market of 2026! Hosting a free webinar on semiconductors.
- Seminar
- Other semiconductors
Understanding the semiconductor manufacturing market in 2026! Hosting a free webinar on semiconductors.
- Seminar
- Other semiconductors
Investigating the mobile market in 2026, including the increase in demand from BRIC and emerging markets!
- Seminar
- Other semiconductors
Released Rad-Hard versions of SigmaQuad-II+, SyncBurst, and NBT SRAM.
- Other electronic parts
- Memory
GSI Technology Rad-Hard SRAM
Release of Rad-Hard versions of SigmaQuad-II+, SyncBurst, and NBT SRAM! GSI's Rad-Hard SRAM is expected to be a key component in advanced systems utilizing cutting-edge FPGAs, ADCs, and DACs. The initial release products are certified to Class-Q and Class-V levels to meet the stringent requirements of aerospace and defense customers. For satellite and defense customers eagerly awaiting alternatives to current Rad-Hard memory solutions, GSI's Rad-Hard SRAM leverages our proven commercial technology and architecture with radiation enhancement, providing efficient and high-performance state-of-the-art memory at the 40nm technology node.
The ultra-high-speed Quad SRAM SigmaQDR series is fully compatible with products from other companies such as Cypress.
- Memory
GSI Technology Rad-Hard SRAM
Release of Rad-Hard versions of SigmaQuad-II+, SyncBurst, and NBT SRAM! GSI's Rad-Hard SRAM is expected to be a key component in advanced systems utilizing cutting-edge FPGAs, ADCs, and DACs. The initial release products are certified to Class-Q and Class-V levels to meet the stringent requirements of aerospace and defense customers. For satellite and defense customers eagerly awaiting alternatives to current Rad-Hard memory solutions, GSI's Rad-Hard SRAM leverages our proven commercial technology and architecture with radiation enhancement, providing efficient and high-performance state-of-the-art memory at the 40nm technology node.
Aluminum extruded heat sink with a width of 41.5mm and a height of 34mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 41.5mm and a height of 22mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 40mm and a height of 35mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 40mm and a height of 27mm - available in various lengths.
- Other semiconductors
From sample sales to industrial production! Custom support such as purity enhancement and additional analysis is available.
- Other contract services
- Other semiconductors
- others
![[Electrode Production Example] Tin ...](https://image.mono.ipros.com/public/product/image/9b8/2000693472/IPROS6130698468849762423.jpg?w=280&h=280){kind=small}
Can be used for gas sensors, solar cells, etc.! It has high orientation and low resistance characteristics.
- Organic Natural Materials
- Other polymer materials
- Other semiconductors
Published in the Chemical Industry Daily (February 4, 2026).
Our company was featured in the Chemical Industry Daily (February 4, 2026). 'CalcoGenic Expands Sulfurized Tin for Secondary Batteries'
Aluminum extruded heat sink with a width of 40mm and a height of 10mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 40mm and a height of 8mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 40mm and a height of 6mm - available in various lengths.
- Other semiconductors
Achieved approximately 40% reduction in power consumption compared to DDR2! Enables operation at lower current and lower voltage.
- Memory
- Memory
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Due to the demand for high functionality and miniaturization, mixed ICs that include both analog and digital elements are being sought.
- Other semiconductors
DDC's MIL-STD-1553 terminal IC and pin, as well as software drop-in compatible IC.
- Other semiconductors
HOLT Corporation 1553 Protocol IC HI-2130
The world's smallest MIL-STD-1553 terminal IC, with a transformer integrated into a slim 15×15×4.4mm package. The HI-2130 is a product that combines the functions of Holt's HI-6130 16-bit parallel bus interface and HI-6131 SPI device, integrating MIL-STD-1553 protocol logic, dual transceivers, and dual transformers into one compact package. The slim 15×15×4.4mm HI-2130LBxx is one of the smallest single-package 1553 terminals with an integrated transformer, making it ideal for applications such as switched mezzanine cards (XMC) or PCI mezzanine card (PMC) assemblies. The BGA package is available in both RoHS compliant and Sn/Pb versions, providing customers with a solution for Sn/Pb assemblies without the need for expensive re-balling.
Aluminum extruded heat sink with a width of 38.1mm and a height of 16.5mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 38mm and a height of 30mm - available in various lengths.
- Other semiconductors