List of Semiconductors and ICs products
- classification：Semiconductors and ICs
991～1035 item / All 4293 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Width 47.8mm Height 33mm Length 50mm Extruded heat sink for PCB mounting Compatible with transistor clips
- Other semiconductors
Thermal pad for TO-247 and TO-218 package transistors.
- Other semiconductors
Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W200mm x H84mm
- Other semiconductors
Clip-type heatsink for TO-220 package semiconductors that can be mounted without screws.
- Other semiconductors
54mm diameter round LED heat sink
- Other semiconductors
Clip-type heat sink that can be mounted without screws on TO-247, TO-248, TO-220, and TO-218 package semiconductors.
- Other semiconductors
Insulated clamp parts for TO-247 package power transistors
- Other semiconductors
Round Pin Heat Sink "ICK S R 140 x 70"
- Other semiconductors
Efficient heat dissipation is possible with a W129mm x H66mm hollow-type heat sink and axial fan.
- Other semiconductors
A clip that can securely make contact with a TO-220 package transistor and a heat sink.
- Other semiconductors
I have processed a heat sink for surface mount devices that can be soldered, measuring W8mm x H6mm x L19mm, with taping.
- Other semiconductors
98 mm diameter x 50 mm height round pin fin heat sink (Al99.5)
- Other semiconductors
This is a black anodized heat sink for BGA with a width of 45 mm, a length of 42.5 mm, and a height of 6 mm.
- Other semiconductors
200mm diameter, 40mm height round LED heat sink
- Other semiconductors
Efficient heat dissipation is possible with a W66mm x H66mm hollow-type heat sink and an axial fan.
- Other semiconductors
Axial flow heat sink with axial flow fan for AC230V
- Other semiconductors
Heat sink for DIP IC (14, 16 contacts)
- Other semiconductors
High-performance heat sink for forced air cooling (hollow type) W400mm x H88mm, 31 fins
- Other semiconductors
With a pressing force of 55N, the transistor in the TO-220 and TO-3P packages can be reliably brought into contact with the heat sink.
- Other semiconductors
With a pressing force of 59N, it is possible to ensure that transistors in TO-248 and TO-218 packages make reliable contact with the heat sink.
- Other semiconductors
A pressing force of 20N can reliably ensure that the TO-220 package transistor makes contact with the heat sink.
- Other semiconductors
Zener diode combined with a transistor or MOSFET!
- Transistor
Built-in resistance allows for miniaturization of the set and reduction of component count due to the compact surface mount design!
- Transistor
One-stop solution from design to manufacturing of power semiconductors!
- Other semiconductors
Nikkankogyo Shimbun - Award-winning products of the Excellent New Technology and New Products Award! Eliminated the need for external shielding.
- Other semiconductors
Output current values can be adjusted according to the duty ratio of the pulse input signal!!
- ASIC
LED driver with adjustable light output now features additional protection functions, including open and short circuit detection!
- ASIC
You can download and view the latest flyers and catalog data distributed at the exhibition held in November 2024!
- Memory
- Other semiconductors
By using a fused coupler for all inputs, monitor up to 8 different fillers inline!
- diode
Ultra-flat and wideband spectral characteristics! Built-in tap and power monitor functions.
- diode
We offer semiconductor products primarily featuring Toshiba semiconductors, as well as LCDs and electronic components!
- Other semiconductors
Achieving a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line! *Samples available upon request.
- Other semiconductors
Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!
- Other semiconductors
Achieves low RDS(on) to maximize the effective use of package space.
- Other semiconductors
Introducing our unique package and DioMOS technology fusion module!
- Other semiconductors
The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!
- Other semiconductors
Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.
- Other semiconductors
Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.
- Other semiconductors
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
A new style heat sink with lower thermal resistance than the popular FK244 series.
- Other semiconductors
By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.
- Other semiconductors
Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!
- Composite Materials
- Other semiconductors
- Generators and transmission motors
We will exhibit at the 2nd Power Device & Module EXPO!
We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!
Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.
- Other semiconductors
It is utilized in various fields such as coherent communication and RF over fiber.
- diode