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  6. Before the resin encapsulation of semiconductors: What surface design enhances insulation and bonding strength?

Before the resin encapsulation of semiconductors: What surface design enhances insulation and bonding strength?

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last updated:Dec 10, 2025

ゼストロンジャパン
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A detailed explanation of specific approaches to surface treatment that are key to maximizing the quality of semiconductor resin encapsulation!

Semiconductor devices, which function as the brains of various electronic devices ranging from smartphones, automobiles, to home appliances that are essential in our daily lives, are supported by their high reliability. One of the key technologies that ensure this reliability is "resin encapsulation." The process of covering and solidifying semiconductor chips with resin is indispensable for protecting them from external environments and maintaining stable performance over long periods. However, as products require higher reliability, there are increasing cases where simply solidifying with resin is not sufficient. To fully realize the true performance of resin encapsulation, it is extremely important how well the surfaces of the semiconductor chips and substrates to be encapsulated are prepared, which is referred to as "surface design." *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*

    Other semiconductorsOther semiconductor manufacturing equipmentSemiconductors and ICs
半導体の樹脂封止、その前に。絶縁性と接合強度を高める表面設計とは.png

Before the resin encapsulation of semiconductors: What surface design enhances insulation and bonding strength?

半導体の樹脂封止、その前に。絶縁性と接合強度を高める表面設計とは.png
半導体の樹脂封止、その前に。絶縁性と接合強度を高める表面設計とは.png
  • Related Link - https://www.zestron.com/jp/know-how/semiconductor-…
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Why did 'silent degeneration' occur? - The correlation between insulation properties and resin bonding strength -

Why did 'silent degeneration' occur? - The correlation between insulation properties and resin bonding strength -

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Before the resin encapsulation of semiconductors." "A page has been added on 'Why did the 'Quiet Evolution' occur?'

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"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.

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Zestron is a global standard "flux cleaning agent manufacturer" based in Germany, with eight locations worldwide. Our cleaning agents are primarily environmentally friendly water-based cleaners that achieve a balance between cleaning performance and safety, while also enabling the reduction of organic solvents, VOCs, and overall usage to lower costs. At our technical center in Kanagawa, customers can choose from inline and batch-type spray cleaning equipment, as well as jet and ultrasonic devices, tailored to their needs, allowing them to test work cleaning under conditions equivalent to those in production environments. In parallel with the cleaning tests, we analyze cleanliness at our analysis center. Utilizing digital microscopes, FT-IR, ion chromatography, and SEM-EDX/EDS, we can detect flux residues that are often overlooked by visual inspection. After the tests are completed, our engineers will provide a technical report detailing recommended processes. *We generally offer support for cleaning process issues free of charge. If you have any requests or challenges related to flux cleaning, please feel free to contact us.

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