List of Other abrasives products
- classification：Other abrasives
961～975 item / All 1416 items
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
You can download a free booklet that introduces the uses, structures, and examples of various types of frames.
- Other machine tools
- Solar power generator
- Other energy equipment
Grinding cloth is composed of three elements: the base material, the abrasive material, and the adhesive. The key is to effectively combine their respective properties! Please feel free to consult us.
- Other abrasives
A rich lineup including resin cross belts and grinding wheels for tools is featured!
- Grinding Machine
- Other abrasives
- Grindstone
A shaft-mounted buff suitable for polishing operations such as mirror finish on various metals!
- Other abrasives
- Other machine elements
You can select a brush that suits the purpose of the task!
- Other abrasives
- Other machine elements
Would you like to automate your grinding process? We can solve various issues such as labor shortages, quality stability, and productivity improvement through automation! Let's start with a consultati...
- Other abrasives
Significant reduction in wire damage, dramatically improved workability and safety!
- Brush
- Other abrasives
Reviving sharpness through regrinding and recoating contributes to cost reduction!
- Wafer processing/polishing equipment
- Other abrasives
- others
Less dust scattering during polishing! Introducing a polishing compound for paper grain masking and skin adjustment.
- Other abrasives
- paint
- Coating Agent
Easily chamfered with NC lathes and multi-tasking machines. Compatible with various shapes and parts such as gears, hubs, notches, and splines.
- Other cutting tools
- Other abrasives
Maximum operating speed of 2400 rpm! It grinds with a stronger grinding power than conventional products, improving production efficiency through increased line speed.
- Other abrasives
Polishing slurry that achieves a high polishing rate and good surface quality.
- Other abrasives
【Technical Information】Components of CMP Slurry
I will explain the components of CMP slurry. Currently, many slurries used in the CMP process have the following composition: 1) Abrasives: They enhance processing efficiency through mechanical action. Some also exhibit chemical action. 2) Chemicals and additives: They enhance processing efficiency through chemical action and provide special functions or performance. They have various functions such as surface modification of the workpiece, prevention of re-adhesion of impurities, and improvement of cleaning properties. 3) Dispersion medium: It evenly disperses the abrasive components and mediates mechanical and chemical actions. Currently, almost pure water is used. It serves roles such as cooling, transporting abrasives, discharging residues, and lubrication. We optimally select abrasives and additives according to each application, ensuring the stability of the slurry itself and maximizing performance up to the customer. Next time, I will explain "abrasives," one of the components.
Polishing slurry that achieves nano-level surface quality.
- Other abrasives
[Technical Information] Components of CMP Slurry 2
This time, I will explain about abrasives, one of the materials used in CMP slurries. ■ Types of Slurry Abrasives Currently, the materials used as abrasives for slurries include the following: 1) Silica (SiO2) 2) Ceria (CeO2) 3) Alumina (Al2O3) Most of the abrasives mentioned above are inorganic, but at the research level, composite abrasives of inorganic and organic materials are also being developed. ■ Overview and Characteristics of Abrasives 1) Silica Abrasives - Colloidal Silica: Synthesized by precipitation methods or sol-gel methods. The shapes can be spherical or irregular. - Fumed Silica: Synthesized through gas-phase reactions in flames. The processing efficiency is often higher than that of colloidal silica. 2) Ceria Abrasives - The abrasives themselves have chemical activity, which generally results in higher processing efficiency for SiO2. - They have high sedimentation properties and low washability. 3) Alumina Abrasives - They have a strong mechanical polishing effect. Due to their larger particle size and Mohs hardness, they exhibit high processing efficiency. - They have even higher sedimentation properties but are inferior in defect performance, such as scratching. The selection of abrasives is a very key factor in slurry design. We select abrasives based on the intended applications and targets of our customers.
The de facto standard for polishing pads in the CMP process. World market share No. 1!
- Other abrasives
[Technical Information] Groove Processing of CMP Polishing Pads 2
Last time, we explained how the groove processing on the surface of polishing pads affects the diffusion of slurry. Here, we will introduce examples that visually verify the diffusion effect of slurry due to grooves. We prepared six different types of groove processing as samples on the polishing pad "IC1000," which has become the de facto standard for semiconductor use. - Circular Groove - Perforated Groove - Radial Groove - Spiral Groove - XY Groove - Arc Groove When a blue-colored liquid is dripped under the same conditions, it becomes clear that the diffusion of the liquid varies depending on the groove processing. It can be confirmed that the circular grooves and spiral grooves have high slurry retention, while the radial grooves and arc grooves excel in slurry discharge. Thus, even with the same polishing pad, the diffusion of slurry differs due to groove processing, which affects the action of slurry intervening with the workpieces such as wafers. Therefore, the selection of groove processing is very important. Our company can assist you in selecting groove processing while considering your process conditions and targets, so please feel free to consult with us.
Polishing pads optimal for primary polishing in mirror surface finishing.
- Other abrasives
[Technical Information] Groove Processing of CMP Polishing Pads 2
Last time, we explained how the groove processing on the surface of polishing pads affects the diffusion of slurry. Here, we will introduce examples that visually verify the diffusion effect of slurry due to grooves. We prepared six different types of groove processing as samples on the polishing pad "IC1000," which has become the de facto standard for semiconductor use. - Circular Groove - Perforated Groove - Radial Groove - Spiral Groove - XY Groove - Arc Groove When a blue-colored liquid is dripped under the same conditions, it becomes clear that the diffusion of the liquid varies depending on the groove processing. It can be confirmed that the circular grooves and spiral grooves have high slurry retention, while the radial grooves and arc grooves excel in slurry discharge. Thus, even with the same polishing pad, the diffusion of slurry differs due to groove processing, which affects the action of slurry intervening with the workpieces such as wafers. Therefore, the selection of groove processing is very important. Our company can assist you in selecting groove processing while considering your process conditions and targets, so please feel free to consult with us.