List of Other abrasives products
- classification：Other abrasives
1336～1350 item / All 1432 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
This is a soft product that is easy to use, made by impregnating non-woven fabric with abrasive material.
- Other abrasives
Ultrasonic finishing device Serap for precision machining that has never existed before!
- Other abrasives
- Other processing machines
A rich selection to accommodate all types of work!
- Grindstone
- Other abrasives
- others
For over 80 years, we have maintained high quality and continued to be trusted by mold craftsmen.
- Grindstone
- Hand polishing and filing
- Other abrasives
Towards environmental conservation and further customer benefits. We propose 21st-century polishing.
- Other abrasives
- Wafer processing/polishing equipment
Towards environmental conservation and further customer benefits. We propose 21st-century polishing.
- Other abrasives
- Wafer processing/polishing equipment
Equipped with thermal stability and wear resistance.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Amber color, regular block structure, medium toughness.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Good dispersion and difficult to crack.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of participation in the 2016 Xiamen International Stone Fair.
We plan to exhibit at the Xiamen International Stone Fair 2016. We understand you are busy, but we sincerely hope you can attend. Name: Xiamen International Stone Fair 2016 Dates: March 6 (Sunday) to March 9 (Wednesday), 2016 Time: 9:00 AM to 5:30 PM Venue: China Xiamen International Conference and Exhibition Center Booth Number: 5069
Si Coating (Coating Diamond)
- Grindstone
- Diamond cutter
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
High-quality diamond micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of participation in the 2016 Xiamen International Stone Fair.
We plan to exhibit at the Xiamen International Stone Fair 2016. We understand you are busy, but we sincerely hope you can attend. Name: Xiamen International Stone Fair 2016 Dates: March 6 (Sunday) to March 9 (Wednesday), 2016 Time: 9:00 AM to 5:30 PM Venue: China Xiamen International Conference and Exhibition Center Booth Number: 5069
High-quality diamond micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
High-quality diamond micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Gray, blocky shape, polycrystalline structure.
- Grindstone
- Other abrasives
- Diamond cutter
Notice of participation in GrindTec 2016.
We understand that you are busy, but we sincerely request your attendance. Event Name: Germany Grindtec 2016 Exhibition Date: March 16 (Wednesday) to March 19 (Saturday), 2016 Time: 9:00 AM to 5:00 PM Booth Number: 2077 (Hall 2)
Gray-black color, regular lump shape, high toughness and high thermal stability.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of participation in GrindTec 2016.
We understand that you are busy, but we sincerely request your attendance. Event Name: Germany Grindtec 2016 Exhibition Date: March 16 (Wednesday) to March 19 (Saturday), 2016 Time: 9:00 AM to 5:00 PM Booth Number: 2077 (Hall 2)