List of Other analyses products
- classification：Other analyses
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It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Rapid gate system design and CAE analysis with a single software.
- simulator
- Other analyses
- Other CAD related software
Significant reduction of design and processing lead time in advance through simple and speedy analysis.
- simulator
- Other analyses
Would you like to prepare for compliance with the Cyber Resilience Act using 'Black Duck SCA', which supports OSS risk management and SBOM creation?
- Software (middle, driver, security, etc.)
- Other security
- Other analyses
This is a PC that maximizes processing efficiency in various analysis scenarios such as optical design, simulation, optimization, and tolerance analysis!
- Other analyses
[Blog] "The Possibilities of Automotive Development Expanding with LS-DYNA × AI" HPC Supporting Next-Generation CAE
In automotive development, CAE (Computer Aided Engineering) is widely used to enhance safety and performance. Among these, "crash analysis," which predicts the deformation, stress, and strain of the vehicle body during a collision, is crucial in the field of crash safety. The representative CAE software LS-DYNA allows for the setting of conditions such as body shape, materials, thickness, and collision speed to analyze the behavior during a crash. On the other hand, automotive development requires not just a single design proposal but also the comparison of numerous candidates, including materials, thickness, component shapes, and reinforcement positions. This is where the focus shifts to utilizing the analysis data accumulated in LS-DYNA to train AI, which can be used for predicting analysis results and screening design candidates. Rather than replacing CAE, combining CAE with AI has the potential to make the design review process more efficient. Furthermore, HPC (High Performance Computing) becomes essential as a foundation supporting CAE analysis, AI learning, and large-scale data processing.
R2-Wireless "Odin" comprehensively verifies and demonstrates the detection performance of drone electromagnetic signatures for 16 models distributed in the country.
- Other analyses
- Other measurement, recording and measuring instruments