List of Contract Analysis products
- classification：Contract Analysis
46～60 item / All 662 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Instead of software experts, physics experts will handle the initial meeting and provide analysis results tailored to the customer's needs.
- simulator
- Thermo-fluid analysis
- Contract Analysis
A customer case study of KYB Corporation has been published! "Fluid Analysis (CFD) of a Vane Pump Using SimericsMP+ (formerly known as Pumplinx)"
As a user case of Simerics MP+, we have published a fluid analysis (CFD) of a vane pump using Simerics MP+ (formerly known as Pumplinx), with the cooperation of the people from the Foundation Technology Research Institute of KYB Corporation!
SCORG is a measurement software for the design and analysis of screw compressors, expanders, pumps, and motors.
- simulator
- Thermo-fluid analysis
- Contract Analysis
Fatigue evaluation of non-ferrous and non-metallic materials (short fiber reinforced resin / CFRP laminated materials / rubber, etc.)
- Stress Analysis
- Contract Analysis
- Structural Analysis
We will exhibit at the 14th Automotive World [January 19 (Wed) - 21 (Fri), 2022].
We are pleased to announce that we will be exhibiting at the "14th International Car Electronics Technology Exhibition" during the "14th Automotive World," which will be held at Tokyo Big Sight from January 19 (Wednesday) to January 21 (Friday), 2022. Automotive World showcases the latest technologies in cutting-edge themes within the automotive industry, such as autonomous driving, vehicle electrification, connected cars, and lightweighting. Among these, the "International Car Electronics Technology Exhibition" is the world's largest specialized exhibition in this field, featuring semiconductors, electronic components, software, and testing technologies that support the evolution of car electronics. We will be showcasing CAE software that can be utilized for improving fuel efficiency, reducing CO2 emissions, and considering lightweighting in the development and design of electric and hybrid vehicles. Specifically, we will introduce three products, including our flagship CAE software "FEMFAT," which is used for fatigue life prediction analysis, as well as engineering services for prototyping and vehicle testing. We invite you to visit the Magna booth.
We support the entire process from data collection necessary for MBD development to model creation!
- Contract measurement
- Contract Analysis
Providing modular software solutions for computation and simulation!
- Contract Analysis
- Structural Analysis
- Mechanism Analysis
We will exhibit at the Automotive World from January 21, 2026 (Wednesday).
We are pleased to announce that we will be exhibiting at the "18th Automotive World" held at Tokyo Big Sight, specifically at the "18th Car Electronics Technology Exhibition (Testing Zone)." Automotive World showcases the latest technologies in cutting-edge automotive themes. Among these, the "International Car Electronics Technology Exhibition" is the world's largest specialized exhibition in this field, featuring semiconductors, electronic components, software, and testing technologies that support the evolution of car electronics. From our company, we will be displaying engineering services and analysis software products from Magna Powertrain. Specifically, we will present contract services that help solve our customers' technical challenges, such as vehicle engineering, alternative propulsion systems, simulation services, and a full range of testing services, as well as four products including our flagship CAE software "FEMFAT" for fatigue life prediction analysis and the newly released "FEMFAT MELCOM" for strength analysis of PCBA. We invite you to visit the Magna booth.
We propose an efficient vibration fatigue analysis environment for solder joints and bus bars on electronic substrates!
- Stress Analysis
- Contract Analysis
We will consider the surface contact near the spot welding area to make it possible to reproduce the actual phenomenon!
- Mechanism Analysis
- Stress Analysis
- Contract Analysis
We propose a consistent process from the creation of a material database for thermal fatigue evaluation to thermal fatigue analysis!
- Structural Analysis
- Stress Analysis
- Contract Analysis
Support for the creation of databases suitable for fatigue analysis methods of joints (welding, adhesives, fastening) and their applications!
- Stress Analysis
- Structural Analysis
- Contract Analysis
We propose a structural optimization process that takes fatigue life into consideration, supporting realistic structural optimization!
- Structural Analysis
- Stress Analysis
- Contract Analysis
Hysteresis can be reproduced! The analysis model takes into account the friction between the leaf springs and the U-bolt clamping force.
- Contract Analysis
- Mechanism Analysis
- Stress Analysis
With the experience and know-how cultivated in European development sites, we respond to various needs from CAE to prototyping and evaluation! 【*Free case study collection available】
- Contract measurement
- Other contract services
- Contract Analysis
We will exhibit at the Automotive World from January 21, 2026 (Wednesday).
We are pleased to announce that we will be exhibiting at the "18th Automotive World" held at Tokyo Big Sight, specifically at the "18th Car Electronics Technology Exhibition (Testing Zone)." Automotive World showcases the latest technologies in cutting-edge automotive themes. Among these, the "International Car Electronics Technology Exhibition" is the world's largest specialized exhibition in this field, featuring semiconductors, electronic components, software, and testing technologies that support the evolution of car electronics. From our company, we will be displaying engineering services and analysis software products from Magna Powertrain. Specifically, we will present contract services that help solve our customers' technical challenges, such as vehicle engineering, alternative propulsion systems, simulation services, and a full range of testing services, as well as four products including our flagship CAE software "FEMFAT" for fatigue life prediction analysis and the newly released "FEMFAT MELCOM" for strength analysis of PCBA. We invite you to visit the Magna booth.
It is also possible to display various maps of each phase! Analysis is based on the information of the crystal structure possessed by the sample.
- Contract Analysis
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Appearance inspection, electrical inspection, and internal observation using X-rays conducted! Introduction of analysis cases.
- Contract Analysis
Analysis case of faulty switch contacts
Since a malfunction was suspected in the switch section of the appliance that would not power on, we will introduce a case study along with the work flow. First, we check for any shape changes such as swelling, cracking, or discoloration through visual observation. In the electrical check, we confirm whether the malfunction can be reproduced and whether it is an open or short circuit. An internal observation using X-rays revealed that the contact terminals inside the switch had melted, scattered, and disappeared, resulting in an open failure. Ultimately, we will submit a report that includes the consideration of the cause. We also accept inquiries for analysis consultations after non-destructive testing, so please feel free to contact us.