List of Other processing machines products
- classification：Other processing machines
9676～9690 item / All 10133 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
No wax damage, easy-to-install structure.
- Other processing machines
- Other machine elements
- Lubricants
Once set, no replacement is needed for over 4 months.
- Other processing machines
- Other machine elements
- Lubricants
By using a specially developed solid lubricant, we achieve a reduction in labor and expenses!
- Other processing machines
- Other machine elements
- Lubricants
By using a specially developed solid lubricant, we achieve a reduction in labor and costs!
- Other processing machines
- Other machine elements
- Lubricants
By using a specially developed solid lubricant, we achieve a reduction in labor and costs!
- Other processing machines
- Other machine elements
- Lubricants
By using a specially developed solid lubricant, we achieve a reduction in labor and costs!
- Other processing machines
- Other machine elements
- Lubricants
A completely new 3D universal surface support chuck fixture born in Germany.
- Other machine tools
- Other processing machines
Processing and welding of iron, aluminum, and stainless steel. Reliable technology and equipment.
- Other machine tools
- Other processing machines
Heavy machinery and conveyor combined type
- Binding/Packing Machine
- Other processing machines
Empty can sorting and compression
- Automatic sorting machine
- Other processing machines
Heavy machinery investment type
- Binding/Packing Machine
- Other processing machines
Dual-side mask aligner for 300mm wafers, ideal for re-wiring processing.
- Other processing machines
[Finished] On June 3rd (Friday), at the JIEP Advanced Implementation Technology Symposium (Tokyo Big Sight), we introduced the wafer process technology for 3D stacking/TSV formation by Zeiss Microtech.
On June 3rd (Friday), at Tokyo Big Sight, we will introduce the wafer process technology for 3D stacking from Zeus Microtech at the JIEP Advanced Implementation Technology Symposium/Session 3A1 "New Implementation Technologies for Next-Generation 3D Packages" (9:30–12:30). Development of 3D stacked devices using TSV is progressing in fields such as CMOS image sensors and MEMS. We will present on the lithography, thin wafer handling (temporary bonding/debonding), and wafer bonding technologies necessary for 3D stacking/integration. In this seminar, experts from various fields will also give presentations on the latest technologies in 3D implementation and next-generation packaging. □ For more details, please contact us.
【Ended】 We will be exhibiting at the Micro Machine/MEMS Exhibition (July 13 (Wed) - 15 (Fri), Ariake, Tokyo Big Sight).
Zuse Microtech Co., Ltd. will exhibit at the "22nd Micromachine/MEMS Exhibition" held at Tokyo Big Sight in Ariake from July 13 (Wednesday) to 15 (Friday). Please visit us at Booth B-05 in Hall 2. We will introduce wafer processing equipment for MEMS, LEDs, and 3D packaging, including mask aligners, resist coating/developing equipment, wafer bonding equipment, and temporary bonding/debonding equipment. We plan to showcase samples such as wafer debonding for thinning and metal bonding for high-brightness LEDs. Additionally, in collaboration with Tanaka Precious Metals Co., Ltd., we will also exhibit wafer bonding technology using submicron Au particles. In the accompanying exhibitor presentation, titled "Advanced Lithography and Wafer Bonding Technology - Advanced MEMS, High-Brightness LEDs, and Thin Wafer Transport," we will mainly introduce wafer bonding technology for advanced MEMS and high-brightness LEDs. We invite you to join us on July 14 (Thursday) from 14:40 to 15:30 in the exhibitor presentation room (next to the entrance on the East 1 Hall side).
Fully automatic, compatible with a maximum of 200mm.
- Other processing machines
The SUSS Japan Seminar in 2012 has concluded.
On December 4, 2012 (Tuesday), we will hold the SUSS Japan Seminar in 2012 at the Hyatt Regency Tokyo (Shinjuku). This year, we will conduct two seminars in parallel: the Photomask Section "Mask Integrity Challenges – Path to NGL Production" and the 3D Section "Current Status and Trends in 3D Integration Technology." We sincerely invite you to participate. 【Date】December 4, 2012 (Tuesday) 【Location】Hyatt Regency Tokyo, 27F 【General Participation Fee】¥5,000 【Details and Registration Method】http://www.suss.com/jp.html ■ Photomask Section "Mask Integrity Challenges – Path to NGL Production" 【Time】10:00 - 17:10 【Capacity】100 people ■ 3D Section "Current Status and Trends in 3D Integration Technology" 【Time】10:30 - 17:10 【Capacity】100 people ■ Joint Reception 17:15 - 19:00