List of Wafer processing/polishing equipment products

  • classification:Wafer processing/polishing equipment

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

The primary goal is the automation of the grinding process! Fully automated equipment for grinding, quality inspection, and sorting from manual labor.

  • Other machine elements
  • Wafer processing/polishing equipment

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We can accommodate metal materials such as copper, high-tensile steel, aluminum copper, and magnesium! We will respond to your requests with various shapes, including uneven shapes.

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  • Other machine tools
  • Wafer processing/polishing equipment

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It is possible to create various works that match the user's specifications from the development stage.

  • Wafer processing/polishing equipment

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The perfect flexible sander for long hours of grinding and polishing work!

  • Grinding Machine
  • Plastic processing machines (cutting and rolling)
  • Wafer processing/polishing equipment

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Dicing that can cut various materials with high precision!

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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Dicing that can cut various materials with high precision!

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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High-precision dicing that can cut various materials!

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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Dicing that can cut various materials with high precision!

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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Dicing that can cut various materials with high precision!

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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Dicing that can cut various materials with high precision!

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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We can accommodate metal materials such as copper, high-tensile steel, aluminum copper, and magnesium! We will respond to your requests with various shapes, including uneven shapes.

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  • Other machine tools
  • Wafer processing/polishing equipment

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Adopts a compact tabletop design! It can be done in a clean environment without dust scattering.

  • Wafer processing/polishing equipment

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Compatible with everything from fine abrasives to coarse ones! The main body is made of rigid PVC, so it won't rust.

  • Wafer processing/polishing equipment

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A non-woven fabric-based polishing pad that responds well to various applications.

  • Other abrasives
  • Wafer processing/polishing equipment
  • Hand polishing and filing

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[Technical Information] Groove Processing of CMP Polishing Pads 2

Last time, we explained how the groove processing on the surface of polishing pads affects the diffusion of slurry. Here, we will introduce examples that visually verify the diffusion effect of slurry due to grooves. We prepared six different types of groove processing as samples on the polishing pad "IC1000," which has become the de facto standard for semiconductor use. - Circular Groove - Perforated Groove - Radial Groove - Spiral Groove - XY Groove - Arc Groove When a blue-colored liquid is dripped under the same conditions, it becomes clear that the diffusion of the liquid varies depending on the groove processing. It can be confirmed that the circular grooves and spiral grooves have high slurry retention, while the radial grooves and arc grooves excel in slurry discharge. Thus, even with the same polishing pad, the diffusion of slurry differs due to groove processing, which affects the action of slurry intervening with the workpieces such as wafers. Therefore, the selection of groove processing is very important. Our company can assist you in selecting groove processing while considering your process conditions and targets, so please feel free to consult with us.

Before cutting is the key factor. We focus on specification confirmation, proposal of construction methods, process and jig design, tool selection, program creation, and machining simulation.

  • Wafer processing/polishing equipment
  • Stepper
  • Semiconductor inspection/test equipment

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