List of Wafer processing/polishing equipment products

  • classification:Wafer processing/polishing equipment

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types a...

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  • Wafer processing/polishing equipment

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Contributing to the simplification of inspection tasks with air-free semi-automatic polishing.

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  • Wafer processing/polishing equipment

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The adoption of a unique blade tip positioner and an adjustable collet holder allows for quick and accurate visual drill setup!

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  • Wafer processing/polishing equipment

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High-Spec Dedicated Load Grinding Device

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  • Wafer processing/polishing equipment

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A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!

  • Wafer processing/polishing equipment
  • Other abrasives

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Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!

  • Wafer processing/polishing equipment
  • Other abrasives

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Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.

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  • Wafer processing/polishing equipment
  • Other abrasives

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We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.

  • Wafer processing/polishing equipment

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Efficiently enhance polishing power with low vibration design! We offer three models of sanders with speed control.

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  • Wafer processing/polishing equipment

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A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

TAIKO(R) wafer and thin wafer compatible models

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

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