List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
541～585 item / All 1014 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate various workpieces, including compound semiconductor wafers!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Other semiconductors
Helicoils, which are often incorporated into design specifications. By embedding them into the base material, they enhance thread strength and enable repeated use!
- Semiconductor inspection/test equipment
- Wafer processing/polishing equipment
- nut
A completely different polishing method from the conventional one! It demonstrates high capability in removing resin, paste, and ink after the filling process.
- Wafer processing/polishing equipment
We will provide the 'electrolytic polishing device,' 'dedicated electrode jig,' and 'electrolytic polishing solution' as a package.
- Other surface treatment equipment
- Wafer processing/polishing equipment
Ultrasonic polishing device suitable for processing the corners of discharge targets!
- Wafer processing/polishing equipment
The technical team of the end mill manufacturer is regrinding! It comes back to life at about one-third the price of a new one!
- Wafer processing/polishing equipment
- Other contract services
- Processing Contract
High reliability, large capacity, precise and efficient surface grinding equipment.
- Wafer processing/polishing equipment
![[Data] Standard Processing Content](https://image.mono.ipros.com/public/product/image/dc6/2000639978/IPROS52924240281032613503.png?w=280&h=280){kind=small}
For those who want to reduce the ordering process! We will assist you in reducing processes with our one-stop service!
- Wafer processing/polishing equipment
- Processing Contract
I want to restore the sharpness! I want to improve the precision! We can solve these concerns with regrinding! It is possible to finish in as little as 2 days! Here are examples of products we have re...
- Wafer processing/polishing equipment
- Other abrasives
- Surface treatment contract service
We offer polishing processing services for various glass materials.
- Glass
- Processing Contract
- Wafer processing/polishing equipment
Energy-saving and high airflow effectively capture fine dust within the factory.
- Welding Machine
- Wafer processing/polishing equipment
- Ventilation and Exhaust
Ideal for lapping processing of mechanical seals for valves, parts for construction machinery, and difficult-to-cut materials!
- Wafer processing/polishing equipment
- Other processing machines
A tabletop wrapping machine that achieves high flatness and surface roughness finish!
- Wafer processing/polishing equipment
- Other processing machines
Standard type practical general-purpose wrapping machine!
- Wafer processing/polishing equipment
- Other processing machines
Design tailored to the customer's work methods and the size of the workspace, improving ventilation throughout the welding work area! [Compliance with revised specialized regulations and measures to p...
- Welding Machine
- Wafer processing/polishing equipment
- air conditioning
Capable of grinding processing and wafer inspection! Developed to meet new tape and customer requirements.
- Non-ferrous metals
- Wafer processing/polishing equipment
- Other semiconductors
InnoLas Semiconductor is headquartered in Munich, Germany, and continues to provide wafer marking equipment globally.
- Wafer processing/polishing equipment
Precise control of the grinding amount! Electrolytic polishing can be applied even to the inner surfaces of fine holes!
- Other surface treatment equipment
- Wafer processing/polishing equipment
- Processing Contract
The primary goal is the automation of the grinding process! Fully automated equipment for grinding, quality inspection, and sorting from manual labor.
- Other machine elements
- Wafer processing/polishing equipment
We can accommodate metal materials such as copper, high-tensile steel, aluminum copper, and magnesium! We will respond to your requests with various shapes, including uneven shapes.
- Other machine tools
- Wafer processing/polishing equipment
![[Performance Introduction] Lifter B...](https://image.mono.ipros.com/public/product/image/7c0/2000613062/IPROS97553044171352445515.png?w=280&h=280){kind=small}
It is possible to create various works that match the user's specifications from the development stage.
- Wafer processing/polishing equipment
The perfect flexible sander for long hours of grinding and polishing work!
- Grinding Machine
- Plastic processing machines (cutting and rolling)
- Wafer processing/polishing equipment
![[Processing Example] Fixed Pitch Cu...](https://image.mono.ipros.com/public/product/image/a87/2000592230/IPROS56659030623071506259.png?w=280&h=280){kind=small}
Dicing that can cut various materials with high precision!
- Fine Ceramics
- Wafer processing/polishing equipment
- Contract manufacturing
![[Processing Example] Multi-Size Cut](https://image.mono.ipros.com/public/product/image/54a/2000592241/IPROS67165984129151422282.png?w=280&h=280){kind=small}
Dicing that can cut various materials with high precision!
- Fine Ceramics
- Wafer processing/polishing equipment
- Contract manufacturing
![[Processing Example] Multi-Angle Cu...](https://image.mono.ipros.com/public/product/image/008/2000592243/IPROS45352811176206579859.png?w=280&h=280){kind=small}
High-precision dicing that can cut various materials!
- Fine Ceramics
- Wafer processing/polishing equipment
- Contract manufacturing
![[Processing Example] Full Cut](https://image.mono.ipros.com/public/product/image/f83/2000592244/IPROS56797084922677407157.png?w=280&h=280){kind=small}
Dicing that can cut various materials with high precision!
- Fine Ceramics
- Wafer processing/polishing equipment
- Contract manufacturing
![[Processing Example] Half Cut](https://image.mono.ipros.com/public/product/image/4e8/2000592245/IPROS45800580001709181188.png?w=280&h=280){kind=small}
Dicing that can cut various materials with high precision!
- Fine Ceramics
- Wafer processing/polishing equipment
- Contract manufacturing
![[Processing Example] Groove Cutting](https://image.mono.ipros.com/public/product/image/367/2000592246/IPROS06668770372251505854.png?w=280&h=280){kind=small}
Dicing that can cut various materials with high precision!
- Fine Ceramics
- Wafer processing/polishing equipment
- Contract manufacturing
We can accommodate metal materials such as copper, high-tensile steel, aluminum copper, and magnesium! We will respond to your requests with various shapes, including uneven shapes.
- Other machine tools
- Wafer processing/polishing equipment
Adopts a compact tabletop design! It can be done in a clean environment without dust scattering.
- Wafer processing/polishing equipment
Compatible with everything from fine abrasives to coarse ones! The main body is made of rigid PVC, so it won't rust.
- Wafer processing/polishing equipment
[Must-see for the semiconductor industry] Check chips more accurately! Inspection possible without damaging integrated circuits using high-precision polishing technology!
- Wafer processing/polishing equipment
![[Polishing Technology] Ultra-Precis...](https://image.mono.ipros.com/public/product/image/54f/2000603990/IPROS83849052596060099439.png?w=280&h=280){kind=small}
From ceramics to metals, glass, and single crystals, we accommodate a wide range of materials! Introducing our processing technology.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
A non-woven fabric-based polishing pad that responds well to various applications.
- Other abrasives
- Wafer processing/polishing equipment
- Hand polishing and filing
[Technical Information] Groove Processing of CMP Polishing Pads 2
Last time, we explained how the groove processing on the surface of polishing pads affects the diffusion of slurry. Here, we will introduce examples that visually verify the diffusion effect of slurry due to grooves. We prepared six different types of groove processing as samples on the polishing pad "IC1000," which has become the de facto standard for semiconductor use. - Circular Groove - Perforated Groove - Radial Groove - Spiral Groove - XY Groove - Arc Groove When a blue-colored liquid is dripped under the same conditions, it becomes clear that the diffusion of the liquid varies depending on the groove processing. It can be confirmed that the circular grooves and spiral grooves have high slurry retention, while the radial grooves and arc grooves excel in slurry discharge. Thus, even with the same polishing pad, the diffusion of slurry differs due to groove processing, which affects the action of slurry intervening with the workpieces such as wafers. Therefore, the selection of groove processing is very important. Our company can assist you in selecting groove processing while considering your process conditions and targets, so please feel free to consult with us.
Before cutting is the key factor. We focus on specification confirmation, proposal of construction methods, process and jig design, tool selection, program creation, and machining simulation.
- Wafer processing/polishing equipment
- Stepper
- Semiconductor inspection/test equipment
We can perform excavations up to a maximum diameter of 1000 mm and a depth of 600 mm. We are committed to providing products that prioritize not only precision but also aesthetics.
- Stepper
- Semiconductor inspection/test equipment
- Wafer processing/polishing equipment
Achieve high processing quality, very short setup times, and excellent productivity!
- Other processing machines
- Other machine tools
- Wafer processing/polishing equipment
We will process SiC and GaN substrates using the CARE method!
- Wafer processing/polishing equipment
- Processing Contract
A consistent system up to the polishing finish! At Gotou Welding, we produce prototypes starting from just one piece.
- Processing Contract
- Contract manufacturing
- Wafer processing/polishing equipment
Achieve high quality, low cost, and mass production with our centerless grinding machine, boasting high production numbers and precision!
- Wafer processing/polishing equipment
- Processing Contract
- others
This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
- Wafer processing/polishing equipment
- Other abrasives
- Circuit board processing machine
This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
- Wafer processing/polishing equipment
- Other abrasives
- Circuit board processing machine
We specialize in flat grinding processes, focusing on surface grinding and rotary grinding.
- Processing Contract
- Wafer processing/polishing equipment
- aluminum
The grinding wheel rotates under proven grinding conditions! It is polished with high precision and sharpness, allowing for fine printing.
- Wafer processing/polishing equipment
I will explain the important polishing process for achieving uniform thickness of the printing film using photographs.
- Wafer processing/polishing equipment