List of Wafer processing/polishing equipment products

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• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

Regrinding of small-diameter end mills that supports lightweight component manufacturing in the aerospace field.

• Wafer processing/polishing equipment

For precision parts processing. Even small-diameter end mills that were thought to be beyond repair can be re-sharpened.

• Wafer processing/polishing equipment

Even the small-diameter end mills essential for precision machining are re-sharpened without giving up.

• Wafer processing/polishing equipment

Supports regrinding of small-diameter end mills essential for high-precision molds.

• Wafer processing/polishing equipment

For processing complex shapes. Are you having trouble with regrinding small diameter end mills?

• Wafer processing/polishing equipment

We contribute to the manufacturing of miniaturized electronic components through the regrinding of small-diameter end mills.

• Wafer processing/polishing equipment

For lens processing. Are you having trouble with the regrinding of small-diameter tools?

• Wafer processing/polishing equipment

Regrinding of small tools is also possible. Supporting parts processing in the robotics industry.

• Wafer processing/polishing equipment

For fine decoration. Even the small tools that were given up on can be re-sharpened.

• Wafer processing/polishing equipment

Accelerate prototype development! Reduce costs and time with regrinding of small-diameter end mills.

• Wafer processing/polishing equipment

We will revive special-shaped end mills through regrinding without giving up.

• Wafer processing/polishing equipment

Please consider regrinding small-diameter end mills for custom applications without giving up.

• Wafer processing/polishing equipment

We will make it possible to regrind tools with small diameters that were difficult to regrind!

• Wafer processing/polishing equipment

Non-stop roller conveyance! Accelerating the automation and inline processing of thin material burr removal with bottom grinding that doesn't require inversion!

• Wafer processing/polishing equipment

Customizable high-speed finishing machine compatible with fully automated processes.

• Other machine tools
• Wafer processing/polishing equipment

The maximum load capacity is 200kg! This large machine was developed for barrel polishing of large and heavy workpieces.

• Other machine tools
• Wafer processing/polishing equipment

With the wet zero-gap system, barrel polishing is possible without deformation even for extremely small and thin workpieces, such as those with a thickness of 0.1mm!

• Other machine tools
• Wafer processing/polishing equipment

Jewelry and dental tabletop (small) electro-polishing device

• Other machine tools
• Wafer processing/polishing equipment

Innovative electro-polishing equipment for yellow gold, red gold, white gold, and silver.

• Other machine tools
• Wafer processing/polishing equipment

Minimal shape change and high gloss! Achieve polishing of metals for jewelry, dental, and industrial applications with a tabletop-sized special electrolytic polishing machine!

• Wafer processing/polishing equipment

The dressing of the grinding pad significantly changes the time in tool management.

• Wafer processing/polishing equipment

When it comes to the modification of grinding pads, it's the DP-equipped modification carrier, but what about improving work efficiency?

• Wafer processing/polishing equipment

No slurry needed! Achieves stable processing and uniform finishing for both brittle and ductile materials.

• Wafer processing/polishing equipment

Isn't it the case that flatness and parallelism are not stable in metal surface processing? We support quality stabilization through processing with fixed abrasive grains.

• Wafer processing/polishing equipment

Stable processing of sapphire flat surfaces with different machinability for each face orientation using fixed abrasive grains.

• Wafer processing/polishing equipment

Processing that does not melt even low-melting-point resins. Achieves stable precision even in batch processing of large-diameter workpieces.

• Wafer processing/polishing equipment

Suppresses processing heat and warping. Achieves high-precision finishing with uniform processing on both sides.

• Wafer processing/polishing equipment

Streamlining the flat grinding of hard and brittle ceramics. It helps reduce chipping and cracking while supporting both precision stability and productivity improvement.

• Wafer processing/polishing equipment

Are you struggling with scratches, chipping, and inconsistencies in finishing? We achieve high-quality surface finishes with stable processing.

• Wafer processing/polishing equipment

Efficient flat processing of silicon carbide, a difficult-to-machine material. It aims to shorten processing time while stabilizing precision simultaneously.

• Wafer processing/polishing equipment

The best cost-performance machine in the series! Automate deburring on a low budget.

• Wafer processing/polishing equipment

Standard with two axes for the grinding wheel shaft! Additional installation is possible to meet needs.

• Wafer processing/polishing equipment

The easiest model to introduce in the Baritac series!

• Wafer processing/polishing equipment

Achieve an even finish without polishing marks through "planetary motion" with a rotary 4-axis buff!

• Wafer processing/polishing equipment

Equipped with a simultaneous double-sided grinding mechanism that finishes both sides of the workpiece at once!

• Wafer processing/polishing equipment

A versatile diamond polishing machine capable of handling all polishing directions! Ideal for chip-free polishing of single crystal diamonds!

• Diamond cutter
• Wafer processing/polishing equipment

Equipped with an oscillation mechanism! Supports both deburring and hairline finishing with one machine.

• Wafer processing/polishing equipment

Proposal for Continuous Supply Ultra-Pure Water Production System: Achieving Stable Operation 24 Hours a Day

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment
• Wafer

For any issues with surface grinding, please consult JFC. We can handle both processing of supplied materials and processing with materials included.

• Fine Ceramics
• Other machine elements
• Wafer processing/polishing equipment

A mirror-like surface created by electropolishing! Supporting IT technology with electropolishing that further enhances corrosion resistance.

• Wafer processing/polishing equipment

We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.

• Wafer processing/polishing equipment

Efficiently enhance polishing power with low vibration design! We offer three models of sanders with speed control.

• Wafer processing/polishing equipment

A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment
• Mounter

TAIKO(R) wafer and thin wafer compatible models

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment
• Mounter

A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment
• Mounter