List of Wafer processing/polishing equipment products
- classification:Wafer processing/polishing equipment
46~90 item / All 993 items
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
Meticulous work unique to Japanese manufacturers! Detailed follow-up visits by sales representatives even after installation.
- Wafer processing/polishing equipment
I'm graduating from hand polishing!
- Wafer processing/polishing equipment
I'm graduating from hand polishing!
- Wafer processing/polishing equipment
~Me, Polishing, and IMT~
- Wafer processing/polishing equipment
~Me, Kenma, and IMT~
- Wafer processing/polishing equipment
Realization of low Ra using high-quality grinding tape.
- Wafer processing/polishing equipment
[Made in Japan] Precision Grinding Tape Used
- Wafer processing/polishing equipment
Ideal for high-precision sample preparation! We also propose optimal polishing conditions! Reliable domestic machines with comprehensive after-sales support!
- Wafer processing/polishing equipment
We will make proposals centered around polishing machines, polishing devices, and sample polishing machines, utilizing the know-how of all precision polishing technologies.
- Wafer processing/polishing equipment
Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types a...
- Wafer processing/polishing equipment
Contributing to the simplification of inspection tasks with air-free semi-automatic polishing.
- Wafer processing/polishing equipment
~Me, Kenma, and IMT~
- Wafer processing/polishing equipment
~Me, Kenma, and IMT~
- Wafer processing/polishing equipment
The adoption of a unique blade tip positioner and an adjustable collet holder allows for quick and accurate visual drill setup!
- Wafer processing/polishing equipment
High-Spec Dedicated Load Grinding Device
- Wafer processing/polishing equipment
A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!
- Wafer processing/polishing equipment
- Other abrasives
Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!
- Wafer processing/polishing equipment
- Other abrasives
Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.
- Wafer processing/polishing equipment
- Other abrasives
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment
Efficiently enhance polishing power with low vibration design! We offer three models of sanders with speed control.
- Wafer processing/polishing equipment
Two types are available: dry type that does not use water and wet type that processes while applying cutting fluid.
- Wafer processing/polishing equipment
A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
TAIKO(R) wafer and thin wafer compatible models
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
We will make it possible to regrind tools with small diameters that were difficult to regrind!
- Wafer processing/polishing equipment
Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.
- Other surface treatment equipment
- Wafer processing/polishing equipment
We will monitor the grinding process in real-time with the Marpos measurement head!
- Wafer processing/polishing equipment
- Production Management System
- Other measurement, recording and measuring instruments
[Product demo available] Achieving high efficiency, durability, and flat grinding capability! A new mechanism has been adopted in the pad support section.
- Wafer processing/polishing equipment
- Other machine elements
【Product demo available】Paper size is φ150mm! It is compact and lightweight at 730g, has a long lifespan, and is easy to maintain.
- Wafer processing/polishing equipment
- Other machine elements
【Product demo available】Low failure rate and long lifespan, plus easy maintenance! Easy to operate and does not cause fatigue even with long hours of use.
- Wafer processing/polishing equipment
- Other machine elements
Polishing equipment that maximizes the characteristics of polishing film.
- Wafer processing/polishing equipment
Processing technology that can polish shafts with complex shapes!
- Wafer processing/polishing equipment
For home appliance parts! Achieving work improvement, labor saving, and uniform product quality through automation.
- Wafer processing/polishing equipment
- Articulated Robot
Precision polishing technology that contributes to the improvement of gear quality!
- Wafer processing/polishing equipment
Innovative processing technology that enables the grinding of complex-shaped main shafts!
- Wafer processing/polishing equipment
Processing technology that realizes precision grinding of robot joints!
- Wafer processing/polishing equipment
Precision grinding of complex-shaped gears!
- Wafer processing/polishing equipment
Precision shaft grinding that affects motor performance.
- Wafer processing/polishing equipment
It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.
- Wafer processing/polishing equipment
For grinding complex-shaped shafts such as camshafts!
- Wafer processing/polishing equipment
Innovation in turbine shaft polishing in the aerospace field.
- Wafer processing/polishing equipment
Precision shaft grinding technology to improve generator performance!
- Wafer processing/polishing equipment