List of Wafer processing/polishing equipment products

  • classification:Wafer processing/polishing equipment

46~90 item / All 993 items

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Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!

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  • Glass

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Meticulous work unique to Japanese manufacturers! Detailed follow-up visits by sales representatives even after installation.

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  • Wafer processing/polishing equipment

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I'm graduating from hand polishing!

  • Wafer processing/polishing equipment

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I'm graduating from hand polishing!

  • Wafer processing/polishing equipment

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~Me, Polishing, and IMT~

  • Wafer processing/polishing equipment

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Realization of low Ra using high-quality grinding tape.

  • Wafer processing/polishing equipment

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[Made in Japan] Precision Grinding Tape Used

  • Wafer processing/polishing equipment

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Ideal for high-precision sample preparation! We also propose optimal polishing conditions! Reliable domestic machines with comprehensive after-sales support!

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  • Wafer processing/polishing equipment

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We will make proposals centered around polishing machines, polishing devices, and sample polishing machines, utilizing the know-how of all precision polishing technologies.

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  • Wafer processing/polishing equipment

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Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types a...

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  • Wafer processing/polishing equipment

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Contributing to the simplification of inspection tasks with air-free semi-automatic polishing.

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  • Wafer processing/polishing equipment

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The adoption of a unique blade tip positioner and an adjustable collet holder allows for quick and accurate visual drill setup!

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  • Wafer processing/polishing equipment

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High-Spec Dedicated Load Grinding Device

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  • Wafer processing/polishing equipment

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A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!

  • Wafer processing/polishing equipment
  • Other abrasives

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Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!

  • Wafer processing/polishing equipment
  • Other abrasives

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Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.

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  • Wafer processing/polishing equipment
  • Other abrasives

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We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.

  • Wafer processing/polishing equipment

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Efficiently enhance polishing power with low vibration design! We offer three models of sanders with speed control.

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  • Wafer processing/polishing equipment

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Two types are available: dry type that does not use water and wet type that processes while applying cutting fluid.

  • Wafer processing/polishing equipment

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A semi-automatic polishing device that ensures stable processing quality without relying on skilled labor!

  • Wafer processing/polishing equipment

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A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

TAIKO(R) wafer and thin wafer compatible models

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

We will make it possible to regrind tools with small diameters that were difficult to regrind!

  • Wafer processing/polishing equipment

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Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.

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  • Other surface treatment equipment
  • Wafer processing/polishing equipment

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We will monitor the grinding process in real-time with the Marpos measurement head!

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  • Wafer processing/polishing equipment
  • Production Management System
  • Other measurement, recording and measuring instruments

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[Product demo available] Achieving high efficiency, durability, and flat grinding capability! A new mechanism has been adopted in the pad support section.

  • Wafer processing/polishing equipment
  • Other machine elements

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【Product demo available】Paper size is φ150mm! It is compact and lightweight at 730g, has a long lifespan, and is easy to maintain.

  • Wafer processing/polishing equipment
  • Other machine elements

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【Product demo available】Low failure rate and long lifespan, plus easy maintenance! Easy to operate and does not cause fatigue even with long hours of use.

  • Wafer processing/polishing equipment
  • Other machine elements

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Polishing equipment that maximizes the characteristics of polishing film.

  • Wafer processing/polishing equipment

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Processing technology that can polish shafts with complex shapes!

  • Wafer processing/polishing equipment

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For home appliance parts! Achieving work improvement, labor saving, and uniform product quality through automation.

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  • Wafer processing/polishing equipment
  • Articulated Robot

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Precision polishing technology that contributes to the improvement of gear quality!

  • Wafer processing/polishing equipment

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Innovative processing technology that enables the grinding of complex-shaped main shafts!

  • Wafer processing/polishing equipment

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Processing technology that realizes precision grinding of robot joints!

  • Wafer processing/polishing equipment

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Precision grinding of complex-shaped gears!

  • Wafer processing/polishing equipment

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Precision shaft grinding that affects motor performance.

  • Wafer processing/polishing equipment

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It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.

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  • Wafer processing/polishing equipment

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For grinding complex-shaped shafts such as camshafts!

  • Wafer processing/polishing equipment

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Innovation in turbine shaft polishing in the aerospace field.

  • Wafer processing/polishing equipment

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Precision shaft grinding technology to improve generator performance!

  • Wafer processing/polishing equipment

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