List of Bonding Equipment products
- classification：Bonding Equipment
1～15 item / All 149 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
- Bonding Equipment
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
- Bonding Equipment
Manual flip chip bonder suitable for small-scale production and various experiments.
- Bonding Equipment
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
- Bonding Equipment
- Processing Contract
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
- Bonding Equipment
Expansion of productivity! The large work area allows for batch processing of multiple devices.
- Bonding Equipment
A controllable current transducer and frequency that continuously monitors wire deformation.
- Bonding Equipment