List of Bonding Equipment products

  • classification:Bonding Equipment

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

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  • Other safety and hygiene products

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Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.

  • Bonding Equipment
  • Processing Contract

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Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.

  • Bonding Equipment

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Expansion of productivity! The large work area allows for batch processing of multiple devices.

  • Bonding Equipment

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A controllable current transducer and frequency that continuously monitors wire deformation.

  • Bonding Equipment

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Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.

  • Bonding Equipment

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Air bearing cylinder with zero friction resistance.

  • Pneumatic Equipment
  • Bonding Equipment
  • Wafer processing/polishing equipment

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Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition

We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee

Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!

  • Pneumatic Equipment
  • Bonding Equipment
  • Wafer processing/polishing equipment

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Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition

We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee

It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

  • Bonding Equipment

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Manual flip chip bonder suitable for small-scale production and various experiments.

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  • Bonding Equipment

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Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.

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  • Bonding Equipment

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Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.

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  • Bonding Equipment

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"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.

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  • Other processing machines
  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.

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  • Bonding Equipment

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Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]

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  • Bonding Equipment

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Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!

  • Bonding Equipment
  • Other mounting machines
  • Other contract services

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