List of Bonding Equipment products
- classification：Bonding Equipment
1～15 item / All 173 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
- Bonding Equipment
Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.
- Bonding Equipment
A method to triple production capacity without expanding the clean room!
- Bonding Equipment
Easier wedge bonding of copper wire using heating technology.
- Bonding Equipment
Easily connect copper wire chips with innovative laser heating.
- Bonding Equipment
The optimal bonding solution for the aerospace field, which requires high reliability.
- Bonding Equipment
High-precision bonding solutions that meet miniaturization needs.
- Bonding Equipment
Providing the optimal bond for high-brightness LED manufacturing.
- Bonding Equipment
Providing optimal and high-quality bonds that correspond to high currents.
- Bonding Equipment
Achieving high-quality bonds optimized for automotive powertrains.
- Bonding Equipment