List of Bonding Equipment products
- classification：Bonding Equipment
46～60 item / All 149 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
- Bonding Equipment
Anode bonding support device
- Semiconductor inspection/test equipment
- Bonding Equipment
Multi-Wafer Handling Die Bonder (Auto)
- Bonding Equipment
Eagle AERO is a high-throughput wire bonding device.
- Bonding Equipment
CoS (Chip on Submount) is a high-precision die/flip chip bonder.
- Bonding Equipment
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
- Bonding Equipment
AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.
- Bonding Equipment
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
- Bonding Equipment
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
- Bonding Equipment
Achieving stable tension force using a unique ceramic nozzle.
- Bonding Equipment
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
- Bonding Equipment
We can widely design and provide EFO torches for wire bonders used by various companies in the semiconductor industry.
- Bonding Equipment
- Other semiconductor manufacturing equipment