List of Bonding Equipment products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

• Other safety and hygiene products

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

• Bonding Equipment

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

• Bonding Equipment

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

• Bonding Equipment

Use of diamond with excellent wear resistance.

• Bonding Equipment

Utilizing ultra-precision machining to demonstrate excellent bonding properties.

• Bonding Equipment

Achieving stable tension force using a unique ceramic nozzle.

• Bonding Equipment

High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.

• Bonding Equipment

We can widely design and provide EFO torches for wire bonders used by various companies in the semiconductor industry.

• Bonding Equipment
• Other semiconductor manufacturing equipment

It can be customized for use with electronic equipment manufacturing devices from other companies. We actively conduct meetings before the design phase to deliver products that align with your company...

• Other semiconductor manufacturing equipment
• Bonding Equipment

No more worries about epoxy application! Designing the optimal solution. Superior application stability compared to genuine parts associated with the equipment.

• Other semiconductor manufacturing equipment
• Bonding Equipment

We provide support to carry out the semiconductor manufacturing backend processes more efficiently and accurately.

• Bonding Equipment
• Other semiconductor manufacturing equipment

Flexibly respond to the manufacturer's discontinuation of bonding products.

• Bonding Equipment

Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!

• Other semiconductor manufacturing equipment
• Bonding Equipment
• Circuit board processing machine

The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.

• Bonding Equipment

Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.

• Bonding Equipment