List of Bonding Equipment products

It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

Eagle AERO is a high-throughput wire bonding device.

• Bonding Equipment

CoS (Chip on Submount) is a high-precision die/flip chip bonder.

• Bonding Equipment

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

• Bonding Equipment

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

• Bonding Equipment

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

• Bonding Equipment

Use of diamond with excellent wear resistance.

• Bonding Equipment

Utilizing ultra-precision machining to demonstrate excellent bonding properties.

• Bonding Equipment

Achieving stable tension force using a unique ceramic nozzle.

• Bonding Equipment

High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.

• Bonding Equipment

We can widely design and provide EFO torches for wire bonders used by various companies in the semiconductor industry.

• Bonding Equipment
• Other semiconductor manufacturing equipment

It can be customized for use with electronic equipment manufacturing devices from other companies. We actively conduct meetings before the design phase to deliver products that align with your company...

• Other semiconductor manufacturing equipment
• Bonding Equipment

No more worries about epoxy application! Designing the optimal solution. Superior application stability compared to genuine parts associated with the equipment.

• Other semiconductor manufacturing equipment
• Bonding Equipment

We provide support to carry out the semiconductor manufacturing backend processes more efficiently and accurately.

• Bonding Equipment
• Other semiconductor manufacturing equipment

Flexibly respond to the manufacturer's discontinuation of bonding products.

• Bonding Equipment

Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!

• Other semiconductor manufacturing equipment
• Bonding Equipment
• Circuit board processing machine