List of Bonding Equipment products

  • classification:Bonding Equipment

76~90 item / All 149 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

Tabletop manual wire bonder Model 626. It can be used for prototyping and development.

  • Bonding Equipment

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You can perform the entire series of operations from applying adhesive, bonding, to UV spot curing with a single piece of equipment!

  • dispenser
  • Bonding Equipment

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A device that performs a series of processes from slit coating to vacuum lamination.

  • Other assembly machines
  • Bonding Equipment

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Supports high-precision stacked packages such as NAND flash.

  • Bonding Equipment

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Ideal for bonding small pin ICs such as QFN.

  • Bonding Equipment

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Ideal for bonding small pin ICs such as QFN.

  • Other semiconductors
  • Bonding Equipment

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It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.

  • Bonding Equipment

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Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.

  • Other processing machines
  • Bonding Equipment

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A device that applies dam material and fill material by dispensing and bonds them together in the atmosphere.

  • dispenser
  • Bonding Equipment

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It is a mass production device for optical bonding using OCR.

  • Bonding Equipment

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