Useful for semiconductor backend processes! Design pickup tools in any format.

basic information

In the final stages of semiconductor manufacturing, the process of cutting and transporting chips from wafers takes place. This process is divided into three parts: dicing, wire bonding, and molding. Dicing is the process of cutting the wafer into chips using a diamond blade. A dicing tape is applied to the wafer, and while rotating the blade, ultra-pure water is sprayed to facilitate the cutting. There are also methods that use lasers, scribes, or plasma for cutting. Wire bonding is the process of securing the chip to a lead frame. The lead frame is a component that serves as the terminal when mounting the semiconductor onto a substrate. The chip is fixed to the lead frame in a process called die bonding, and in the wire bonding process, the chip and lead frame are connected with thin metal wires. Molding is the process of encapsulating the chip in epoxy resin. Since chips are very delicate products, they can be affected by scratches, impacts, dust, and magnetic fields. Therefore, they are protected by being encapsulated in epoxy resin. Chips that have undergone these processes are inspected before being shipped.

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Applications/Examples of results

In the semiconductor backend process, we have received feedback from those who have incorporated our products, stating that productivity has improved and scratches have been reduced. We will flexibly respond to cases that are difficult to improve on your own and will carry out product design tailored to your company.