List of Bonding Equipment products
- classification：Bonding Equipment
106～120 item / All 142 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion e...
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
NEW! "Rotating Plasma Device"! Exhibiting at the International Frontier Industry Messe 2012 in Kobe from September 6 to 7. ■ Demo units available at the exhibition booth. Popular for surface modification and cleaning applications.
New Product! Rotating Plasma Device Debuts at Trade Show! 【Trade Show Name】International Frontier Industry Messe 2012 【Dates】 September 6 (Thursday) - 7 (Friday), 2012 10:00 - 17:00 【Venue】Kobe International Exhibition Hall, Building 2 (Kobe Port Island) 【Expected Exhibition Scale】 200 booths (including concurrently held events) * FY 2011 results: 239 companies, 271 booths 【Expected Number of Visitors】 15,000 people * FY 2011 results: 17,253 people 【Booth】 Booth Number B-07 Displayed at the booth of 'Kyoto Environmental Nanocluster (Kyoto Institute of Advanced Technology)' 【Presentation】 September 7 (Friday) Presentation Corner A 11:00-11:20 【Exhibition Content】 ☆ Live Demonstration Tabletop Vacuum Plasma Device YHS-R Rotating Vacuum Plasma Device YHS-DOS ■ Sakigake Semiconductor Special Exhibition Page http://www.sakigake-semicon.co.jp/international-industrial-fair2012_plasma.html
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
- Bonding Equipment
200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.
- Bonding Equipment
- Wafer processing/polishing equipment
[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).
We will be exhibiting at ICEP-IAAC 2018 (April 17 (Tuesday) to 21 (Saturday); Kuwana City, Mie Prefecture). We look forward to your visit.
Prototype - Multi-functional tabletop mounter for small-scale production. Capable of solder application, component placement, and heating all in one machine.
- Mounter
- Bonding Equipment
Full auto ACF implementation line, ideal for camera modules and more.
- Bonding Equipment
- Mounter
- Other assembly machines
Continuous thermal bonding with a multi-head system achieves a stable temperature profile.
- Bonding Equipment
Continuous thermal bonding with multi-heads and efficient handling with carrier transport.
- Bonding Equipment
Ideal for R&D and small lot production; can be applied up to a length of 100mm.
- Other mounting machines
- Other assembly machines
- Bonding Equipment
Ideal for R&D and small lot production; can be applied up to a length of 60mm.
- Other mounting machines
- Other assembly machines
- Bonding Equipment
ACF thermal bonding equipment that supports a wide range of processes from R&D to mass production.
- Bonding Equipment
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
- Bonding Equipment
- Other semiconductor manufacturing equipment
Next, it enhances adhesion, improves wettability, and has cleaning effects. It is ideal for surface treatments such as thin film formation, various bonding, painting, and plating pre-treatments, as we...
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
Pen-shaped atmospheric pressure plasma device! Surface modification ¥348,000-
A low-temperature, non-charge-damage atmospheric pressure plasma device that excels in surface modification, cleaning, hydrophilic treatment, and adhesion enhancement! Perfect for fine processing and spot treatment! This pen-type atmospheric pressure plasma device operates at low temperatures without charge damage!! It enables environmentally friendly surface treatment through dry cleaning without solvents♪ Utilizing the high reactivity of plasma, it addresses issues such as enhancing adhesion and bonding to various materials like resin, metal, glass, and fiber, improving hydrophilicity, and removing organic substances! While high-priced plasma devices have been mainstream, the pen-type atmospheric pressure plasma device achieves excellent cost performance by focusing on essential functions. Additionally, by using only nitrogen gas for plasma generation without He or Ar, running costs are significantly reduced! Please check the treatment effects with a free demonstration first. *For treatment videos, search on YOUTUBE for "pen-type atmospheric pressure plasma device."
This is the world's first product to generate atmospheric pressure plasma on a surface.
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
We can produce sheets as thin as 1mm and thick plates up to several tens of mm! We meet our customers' needs with shaping processes tailored to their applications.
- Other Auto Parts
- Bonding Equipment
- Transport and handling robots
We can manufacture sheets from less than 1mm to several tens of mm in thickness! We meet our customers' needs with shaping processes tailored to their applications.
- Other Auto Parts
- Bonding Equipment
- Transport and handling robots