List of Bonding Equipment products
- classification：Bonding Equipment
106～120 item / All 149 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
We offer a diverse lineup including bonding press machines and laminating machines!
- Other processing machines
- Printing Machinery
- Bonding Equipment
Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.
- Bonding Equipment
Introducing a rubber connecting machine that allows for easy switching from overlapping sewing to butt sewing.
- Other processing machines
- Bonding Equipment
A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.
- Wafer processing/polishing equipment
- Bonding Equipment
[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).
We will be exhibiting at ICEP-IAAC 2018 (April 17 (Tuesday) to 21 (Saturday); Kuwana City, Mie Prefecture). We look forward to your visit.
This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.
- Other semiconductors
- Bonding Equipment
- PCB terminal blocks
Achieving stable dispensing of two-component adhesive!
- Other processing machines
- glue
- Bonding Equipment
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
NEW! "Rotating Plasma Device"! Exhibiting at the International Frontier Industry Messe 2012 in Kobe from September 6 to 7. ■ Demo units available at the exhibition booth. Popular for surface modification and cleaning applications.
New Product! Rotating Plasma Device Debuts at Trade Show! 【Trade Show Name】International Frontier Industry Messe 2012 【Dates】 September 6 (Thursday) - 7 (Friday), 2012 10:00 - 17:00 【Venue】Kobe International Exhibition Hall, Building 2 (Kobe Port Island) 【Expected Exhibition Scale】 200 booths (including concurrently held events) * FY 2011 results: 239 companies, 271 booths 【Expected Number of Visitors】 15,000 people * FY 2011 results: 17,253 people 【Booth】 Booth Number B-07 Displayed at the booth of 'Kyoto Environmental Nanocluster (Kyoto Institute of Advanced Technology)' 【Presentation】 September 7 (Friday) Presentation Corner A 11:00-11:20 【Exhibition Content】 ☆ Live Demonstration Tabletop Vacuum Plasma Device YHS-R Rotating Vacuum Plasma Device YHS-DOS ■ Sakigake Semiconductor Special Exhibition Page http://www.sakigake-semicon.co.jp/international-industrial-fair2012_plasma.html
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion e...
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
NEW! "Rotating Plasma Device"! Exhibiting at the International Frontier Industry Messe 2012 in Kobe from September 6 to 7. ■ Demo units available at the exhibition booth. Popular for surface modification and cleaning applications.
New Product! Rotating Plasma Device Debuts at Trade Show! 【Trade Show Name】International Frontier Industry Messe 2012 【Dates】 September 6 (Thursday) - 7 (Friday), 2012 10:00 - 17:00 【Venue】Kobe International Exhibition Hall, Building 2 (Kobe Port Island) 【Expected Exhibition Scale】 200 booths (including concurrently held events) * FY 2011 results: 239 companies, 271 booths 【Expected Number of Visitors】 15,000 people * FY 2011 results: 17,253 people 【Booth】 Booth Number B-07 Displayed at the booth of 'Kyoto Environmental Nanocluster (Kyoto Institute of Advanced Technology)' 【Presentation】 September 7 (Friday) Presentation Corner A 11:00-11:20 【Exhibition Content】 ☆ Live Demonstration Tabletop Vacuum Plasma Device YHS-R Rotating Vacuum Plasma Device YHS-DOS ■ Sakigake Semiconductor Special Exhibition Page http://www.sakigake-semicon.co.jp/international-industrial-fair2012_plasma.html
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
- Bonding Equipment
200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.
- Bonding Equipment
- Wafer processing/polishing equipment
[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).
We will be exhibiting at ICEP-IAAC 2018 (April 17 (Tuesday) to 21 (Saturday); Kuwana City, Mie Prefecture). We look forward to your visit.
Prototype - Multi-functional tabletop mounter for small-scale production. Capable of solder application, component placement, and heating all in one machine.
- Mounter
- Bonding Equipment
Full auto ACF implementation line, ideal for camera modules and more.
- Bonding Equipment
- Mounter
- Other assembly machines
Continuous thermal bonding with a multi-head system achieves a stable temperature profile.
- Bonding Equipment
Continuous thermal bonding with multi-heads and efficient handling with carrier transport.
- Bonding Equipment
Ideal for R&D and small lot production; can be applied up to a length of 100mm.
- Other mounting machines
- Other assembly machines
- Bonding Equipment