List of Other semiconductor manufacturing equipment products
- classification：Other semiconductor manufacturing equipment
256～270 item / All 1997 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
The sprayer part can be quickly replaced.
- Other semiconductor manufacturing equipment
Sintered metal filters suitable for low-cost solvent suction applications.
- Other semiconductor manufacturing equipment
We provide sintered metal products tailored to your needs.
- Other semiconductor manufacturing equipment
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
We relentlessly pursue customer satisfaction and technical expertise, contributing to society. We have extensive experience in contract manufacturing for OEMs and prototype machines.
- CVD Equipment
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Using conductive PP! Suitable for prototypes and small-scale transportation, shipping, and storage.
- Racks and Cases
- Other semiconductor manufacturing equipment
- cabinet
Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.
- Other semiconductor manufacturing equipment
We will be exhibiting at the Kyoto Pulse Plaza, which will be held in Kyoto from February 18, 2026.
This time, Orte Corporation will exhibit at "Kyoto Pulse Plaza" again this year, following our participation in last year's semiconductor exhibition. The latest cutting-edge collets that can only be seen here will be on display! Our specialists in chip transport collets will unveil the latest lineup that solves on-site "troubles"! Be amazed by our rubber collet that achieves a contact width of less than 0.1mm! Of course, we have rubber collets that address ionizer countermeasures, as well as patented holder mechanisms that perfectly accommodate high-aspect and large chips. You will surely find yourself thinking, "This is the collet I wanted!"... We plan to showcase many actual samples! You can actually hold, touch, and experience the performance on the spot. Please come and visit our booth! We are confident that you will definitely think, "I'm glad I came to see this!" 【Exhibition Contents】 - Pickup collets (rubber/plastic/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays)
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
- Other semiconductor manufacturing equipment
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
The micro heater can be easily wrapped around pipes and can be used even in a vacuum.
- Other semiconductor manufacturing equipment
- Food Packaging Machinery
Various shapes can be produced according to the shape of the heated object. We can manufacture even from just one piece!
- Other semiconductor manufacturing equipment
- Other processing machines
Support yield improvement through pressure management!
- Other semiconductor manufacturing equipment
- Other measurement, recording and measuring instruments
Support yield improvement through pressure management!
- Other semiconductor manufacturing equipment
- Other measurement, recording and measuring instruments
The layout and operability of the NS series remain unchanged, achieving stable low-temperature measurements.
- Tester
- Other semiconductor manufacturing equipment