List of Other semiconductor manufacturing equipment products
- classification：Other semiconductor manufacturing equipment
271～285 item / All 1961 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals.
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automated system.
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automated equipment.
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automatic equipment.
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
100% focus on BATCHSPRAY technology! Significant reduction of water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
Remove resin residue after dry etching without using organic solvents!
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
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Make effective use of the interior of the device while saving space.
- Other machine elements
- Food Packaging Machinery
- Other semiconductor manufacturing equipment
March 6, 2025 (Thursday) 16:00 - WEB Seminar [Safety Measures / Improving Work Efficiency] Case Studies on Solving Issues Around Doors and Covers
【Event Date and Time】 March 6, 2025 (Thursday) 16:00 - 16:45 *Participation is free. The capacity is 250 people (first come, first served). 【Highlights】 - We will introduce examples of how we solved customer challenges using our technology for lightly opening doors and lids or securely holding them in place, known as "Motion Design Tech." - Many mechanical components that contribute to safety measures and improved work efficiency will be showcased. Participants who respond to the survey after the seminar will receive a torque hinge!! *The torque hinge offered as a participation benefit is for illustration purposes. The actual product may differ in design and specifications. You can also check the details of the seminar on the registration page. We sincerely look forward to your participation.
There is a track record of adoption in semiconductor manufacturing equipment components. Contributes to weight reduction and strength improvement of products.
- Other semiconductor manufacturing equipment
Processing of GaN substrates is also possible! Introduction of contact annealing lamp annealing (RTP) equipment.
- Other semiconductor manufacturing equipment
We flexibly respond to everything from software and hardware design to implementation and product assembly. "Yoho's adaptability" to the challenges of various manufacturers.
- EMS
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Capable of accommodating large circuit board assembly in 850×500mm size.
Supports large PCB assembly with a size of 850×500mm. [Precision] Chip size: 03015 Lead pitch: 0.3mm Adjacent pitch: 0.1mm [Supported Chips] BGA, CSP, QFN, SOP, QFP, LED, etc. [Supported Sizes] Minimum size: 50mm×50mm Maximum size: 500mm×850mm Board thickness: 0.5mm to 3.0mm
If you are troubled by contamination from waste and foreign substances after cleaning, NCC will provide solutions!
- Other machine tools
- Other production management systems
- Other semiconductor manufacturing equipment
Challenge to a new film polishing method using multi-axis robots! You can watch it in the video.
- Other semiconductor manufacturing equipment
- Grinding Machine
We will exhibit at JIMTOF2024.
We will be exhibiting at the 32nd Japan International Machine Tool Fair JIMTOF2024. This time, in addition to our existing outer diameter grinding machines and robotic grinding machines, we will showcase a new internal diameter grinding machine, a new end face grinding machine, and a newly developed belt-type surface grinding machine, along with demonstrations. We will also provide explanations about the machines, discussions on film grinding, and talks aimed at specific machine development at the venue, so please come and visit us. Exhibition Location: East Hall E1039, Sanshin Corporation
Ultra-fast, clean, and low-load. Why not optimize the TBDB (temporary bonding and debonding) process with a photonic debonding device?
- Other semiconductor manufacturing equipment