List of Reflow Equipment products
- classification：Reflow Equipment
91～105 item / All 114 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
SUS304, lathe processing, cutting, stainless steel processing [Leave cost reduction to Firiru Co., Ltd.]
- Reflow Equipment
- Taping Machine
- Other mounting machines
Strongly supporting the implementation line! We create necessary printed backup boards, transport carriers, and splitting jigs from design to processing in a short delivery time!
- Career
- Reflow Equipment
- Other mounting machines
It is possible to observe and preserve the state of the sample in a heated condition.
- Reflow Equipment
A bestselling type with a wealth of achievements, supporting high-temperature soldering, paste sintering, and metal particle sintering processes with reliable software and highly dependable hardware.
- Reflow Equipment
- Annealing furnace
- Electric furnace
N2 reflow system for solder bump formation compatible with 6.8-inch wafers
- Reflow Equipment
N2 reflow system for forming solder bumps compatible with 200-300mm wafers
- Reflow Equipment
Void processing for power module metal substrate reflow is possible!
- Reflow Equipment
Lead-free small-sized mounting board compatible compact N2 reflow device
- Reflow Equipment
M size (W260) PCB compatible lead-free nitrogen reflow oven
- Reflow Equipment
Standard device for voidless soldering. Proven and reliable hardware and software supporting automotive power device modules.
- Reflow Equipment
- Annealing furnace
Achieving fluxless, voidless reflow from power modules to wafer bumps. New model launched for upgraded quality! *Currently supporting sample testing.
- Reflow Equipment
- Soldering Equipment
- Electric furnace
We will be exhibiting at the 34th NePCON Japan - Electronics Development and Implementation Exhibition - from January 15 to 17, 2020.
Shinko Precision Co., Ltd. will be exhibiting at the 34th Nepcon Japan - Electronics Development and Implementation Exhibition - held at Tokyo Big Sight. We will showcase the actual machine of our renewed vacuum reflow device. You will be able to experience the upgraded equipment live. Additionally, we plan to display panels for our ICP etching equipment compatible with next-generation devices such as SiC and GaN, as well as a heat treatment device compatible with reducing atmosphere for next-generation bonding materials. We sincerely look forward to your visit. 【Exhibited Products】 ■ Plasma Cleaning Device "POEM" (Plasma Cleaner) ■ Inline Vacuum Soldering Device ■ Batch Vacuum Soldering Device (Fluxless Reflow Vacuum Reflow)
Since it is pallet transport, it can reduce substrate warping. It can be used on the back side with a flexible pin.
- Reflow Equipment
Germany's ERSA company presents the world-recognized high-quality reflow equipment 'HOTFLOW 3 Series' that maximizes cost-effectiveness to the limit.
- Reflow Equipment
Adopting a heating method using near-infrared! It allows for the observation of the reflow state while measuring oxygen concentration.
- Reflow Equipment
Kind to the Earth, kind to people.
- Other metal materials
- Other polymer materials
- Reflow Equipment