List of Circuit board processing machine products
- classification：Circuit board processing machine
271～315 item / All 350 items
By combining spin and spray, we achieved a high-precision and uniform process.
- Circuit board processing machine
Integration of processing into a unified device! A laser system that improves production efficiency through automatic cutting.
- Circuit board processing machine
- Touch Panel
- Etching Equipment
From procurement to shipping tailored to customer needs! Also compatible with R corner cuts!
- Circuit board processing machine
- Other processing machines
Electrostatic coating device
- Circuit board processing machine
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
NEW! "Rotating Plasma Device"! Exhibiting at the International Frontier Industry Messe 2012 in Kobe from September 6 to 7. ■ Demo units available at the exhibition booth. Popular for surface modification and cleaning applications.
New Product! Rotating Plasma Device Debuts at Trade Show! 【Trade Show Name】International Frontier Industry Messe 2012 【Dates】 September 6 (Thursday) - 7 (Friday), 2012 10:00 - 17:00 【Venue】Kobe International Exhibition Hall, Building 2 (Kobe Port Island) 【Expected Exhibition Scale】 200 booths (including concurrently held events) * FY 2011 results: 239 companies, 271 booths 【Expected Number of Visitors】 15,000 people * FY 2011 results: 17,253 people 【Booth】 Booth Number B-07 Displayed at the booth of 'Kyoto Environmental Nanocluster (Kyoto Institute of Advanced Technology)' 【Presentation】 September 7 (Friday) Presentation Corner A 11:00-11:20 【Exhibition Content】 ☆ Live Demonstration Tabletop Vacuum Plasma Device YHS-R Rotating Vacuum Plasma Device YHS-DOS ■ Sakigake Semiconductor Special Exhibition Page http://www.sakigake-semicon.co.jp/international-industrial-fair2012_plasma.html
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion e...
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
NEW! "Rotating Plasma Device"! Exhibiting at the International Frontier Industry Messe 2012 in Kobe from September 6 to 7. ■ Demo units available at the exhibition booth. Popular for surface modification and cleaning applications.
New Product! Rotating Plasma Device Debuts at Trade Show! 【Trade Show Name】International Frontier Industry Messe 2012 【Dates】 September 6 (Thursday) - 7 (Friday), 2012 10:00 - 17:00 【Venue】Kobe International Exhibition Hall, Building 2 (Kobe Port Island) 【Expected Exhibition Scale】 200 booths (including concurrently held events) * FY 2011 results: 239 companies, 271 booths 【Expected Number of Visitors】 15,000 people * FY 2011 results: 17,253 people 【Booth】 Booth Number B-07 Displayed at the booth of 'Kyoto Environmental Nanocluster (Kyoto Institute of Advanced Technology)' 【Presentation】 September 7 (Friday) Presentation Corner A 11:00-11:20 【Exhibition Content】 ☆ Live Demonstration Tabletop Vacuum Plasma Device YHS-R Rotating Vacuum Plasma Device YHS-DOS ■ Sakigake Semiconductor Special Exhibition Page http://www.sakigake-semicon.co.jp/international-industrial-fair2012_plasma.html
Quick response with reliable technology and quality! We are a comprehensive EMS company for electronic device manufacturing.
- Circuit board processing machine
Lead-free solder compatible, also capable of picking up chip parts from dense circuit boards.
- Soldering Equipment
- Circuit board processing machine
High-speed, high-precision drilling and routing machine that meets all processing needs.
- Circuit board processing machine
For High-Quality & Factory Automation
- Circuit Board Inspection Equipment
- Circuit board processing machine
- Other inspection equipment and devices
We handle printed circuit boards, electronic component manufacturing and inspection equipment, as well as related materials and equipment.
- Circuit Board Inspection Equipment
- Circuit board processing machine
- Other inspection equipment and devices
Read the needs and respond to them. We will contribute to the development of the industry with meticulous agility.
- Circuit board processing machine
- Circuit Board Inspection Equipment
- Processing Contract
Error-free conversion from CAM to NC program.
- Circuit board processing machine
Next, it enhances adhesion, improves wettability, and has cleaning effects. It is ideal for surface treatments such as thin film formation, various bonding, painting, and plating pre-treatments, as we...
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
Pen-shaped atmospheric pressure plasma device! Surface modification ¥348,000-
A low-temperature, non-charge-damage atmospheric pressure plasma device that excels in surface modification, cleaning, hydrophilic treatment, and adhesion enhancement! Perfect for fine processing and spot treatment! This pen-type atmospheric pressure plasma device operates at low temperatures without charge damage!! It enables environmentally friendly surface treatment through dry cleaning without solvents♪ Utilizing the high reactivity of plasma, it addresses issues such as enhancing adhesion and bonding to various materials like resin, metal, glass, and fiber, improving hydrophilicity, and removing organic substances! While high-priced plasma devices have been mainstream, the pen-type atmospheric pressure plasma device achieves excellent cost performance by focusing on essential functions. Additionally, by using only nitrogen gas for plasma generation without He or Ar, running costs are significantly reduced! Please check the treatment effects with a free demonstration first. *For treatment videos, search on YOUTUBE for "pen-type atmospheric pressure plasma device."
This is the world's first product to generate atmospheric pressure plasma on a surface.
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
Compact space-saving tabletop ACF bonding device.
- Circuit board processing machine
- Other mounting machines
The grip can be used permanently!
- Circuit board processing machine
- Other consumables
Introduced a processing machine equipped with IFRIT (Ifrit) from Cyber Laser Co. It enables high-precision micro-machining of difficult-to-process materials and achieves reduced friction.
- Circuit board processing machine
- Other processing machines
- Processing Contract
Air-free, hassle-free laminator
- Other semiconductor manufacturing equipment
- Circuit board processing machine
- Vacuum Packaging Machine
The dust prevention measures are different from previous exposure devices!
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Processing technology that allows flexible responses tailored to customer needs, from a single prototype to mass production.
- Circuit board processing machine
High-performance flip chip bonder for multi-variety cell production lines.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production purposes
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production with automatic ACF attachment.
- Circuit board processing machine
Elimination of coating unevenness and nozzle clogging with a unique nozzle.
- spray
- Circuit board processing machine
- Other semiconductor manufacturing equipment
IC bonding device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production use.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
High-density plasma is generated over a large area by a unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Molding Equipment
- Circuit board processing machine
- Plasma surface treatment equipment
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
Implementation Solution Service
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Notice of Participation in the 22nd Fine Tech Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions
Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 22nd Fine Tech Japan, which will be held at Tokyo Big Sight from April 11 (Wednesday) to April 13 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (CO2 reduction) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, combining low capital investment with low running costs, which is its greatest economic advantage. On the day of the event, we will conduct a demonstration using the compact tabletop MyPL-Auto150, allowing you to experience actual large-area plasma irradiation. We sincerely look forward to your visit. 【Contact Information for Inquiries】 Well, Inc. Packaging Solutions Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-plasma.jp/
Real-time monitoring system for semiconductor packaging process anomalies
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Dispenser & UV irradiation device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Ultrasonic flip chip bonder
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
We are committed to manufacturing printed circuit boards with a pattern accuracy of 0.1μm.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine
Leave the substrate cutting device to TME.
- Circuit board processing machine