List of Binding/Packing Machine products

  • classification:Binding/Packing Machine

136~180 item / All 854 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

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  • Satech - EasyGuard_Ipros_2023_JP_Media-gallery_1.jpg
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  • Satech - AdaptaGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Other safety and hygiene products

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Automating everything from mail delivery and shrink packaging to loading! We support the labor-saving and efficiency improvements in the increasingly demanding e-commerce logistics.

  • Binding/Packing Machine

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Shrink cloth stronger than shrink film. Easy packaging with heat shrinkage. Cost reduction through packaging automation!

  • Packaging materials
  • Binding/Packing Machine
  • Other packaging materials

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It is a semiconductor sorting device that extracts dies from dicing wafers and transfers them to tape/reels or trays while inspecting the dies.

  • Visual Inspection Equipment
  • Binding/Packing Machine
  • Taping Machine

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Exhibited at SEMICON Japan 2021 Hybrid.

Our company will be exhibiting at "SEMICON Japan 2021 Hybrid," which will be held at Tokyo Big Sight from December 15 (Wednesday) to December 17 (Friday), 2021. We are a semiconductor inspection equipment manufacturer headquartered in China. The company was established in 2008 in China, and we began full-scale sales activities in Japan in October 2020. This will be our first exhibition at SEMICON Japan. We look forward to your visit.

Hexa EVO+ is a device that inspects both the front and back sides of semiconductor IC packages and packages them for taping and other purposes.

  • Binding/Packing Machine
  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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ProductSmall51677.jpg

Exhibited at SEMICON Japan 2021 Hybrid.

Our company will be exhibiting at "SEMICON Japan 2021 Hybrid," which will be held at Tokyo Big Sight from December 15 (Wednesday) to December 17 (Friday), 2021. We are a semiconductor inspection equipment manufacturer headquartered in China. The company was established in 2008 in China, and we began full-scale sales activities in Japan in October 2020. This will be our first exhibition at SEMICON Japan. We look forward to your visit.

Improved work efficiency! A PP band that combines toughness with ease of handling, lightness, and softness.

  • Other packaging materials
  • Binding/Packing Machine

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Uses environmentally friendly honeycomb paper. No tape or scissors are needed as the papers interlock with each other. Multiple products can be packaged together, improving the process.

  • Binding/Packing Machine

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Currently featuring an article introducing RAMPACK on Paltek's website.

On the website of PALTEK Co., Ltd., the domestic distributor of Ranpak, there is a blog titled "Packaging Eggs Without Breaking Them! What Are Reliable Paper Packaging Materials?" It discusses the excellent cushioning capabilities of Geami, a cushioning material for wrapping. Please take a moment to read it! 【Paltek Blog】 https://www.paltek.co.jp/solution/ranpak/blog/rb230821_01/index.html

Multiple products can be packaged together! Unlike plastic bubble wrap, it requires no tape or scissors and takes up about 1/10 of the storage space! Environmentally friendly paper material.

  • Binding/Packing Machine

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Participated as a partner company in the tour of SoftBank Robotics' showroom "SoftBank Robotics Logistics Innovation Lab."

At the "SoftBank Robotics Logistics Innovation Lab (LIL)" located in Ichikawa City, Chiba Prefecture, various logistics automation solutions from around the world are gathered, including the packaging solutions from Ranpack. Ranpack participated as a partner company in a tour held on January 26, where we introduced the following solutions to approximately 50 visitors. We will continue to participate in various events and showcase environmentally friendly solutions. <Paper Cushioning Material> ■ Gap Filling https://kensetsu.ipros.jp/product/detail/2000736088 ■ Packaging https://kensetsu.ipros.jp/product/detail/2000719873 <Automation> ■ Automatic Sealing Machine with Height Adjustment Function https://kensetsu.ipros.jp/product/detail/2000700596 For more details about LIL, visit: https://www.softbankrobotics.com/jp/event/lil/

The unique palletizing software allows for even palletizing of booklets with simple settings!

  • Binding/Packing Machine

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Sturdy drive roller conveyor! The height of the machine is adjustable, making it easy to move the machine.

  • Binding/Packing Machine

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Energy-saving operation! After packing is complete, the main motor stops until the next package arrives, saving power consumption.

  • Binding/Packing Machine

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