List of Board to Board Connectors products

  • classification:Board to Board Connectors

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

  • PRエリア.png
  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

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The new promotional video for IEH has been completed.

The promotional video for our handling manufacturer, IEH Corporation, has been updated. In addition to explaining the structure and benefits of the hyperbolic contact, which is the biggest feature of their products, the main applications are clearly described. We have uploaded it to the related link below, so please take this opportunity to check it out.

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The new promotional video for IEH has been completed.

The promotional video for our handling manufacturer, IEH Corporation, has been updated. In addition to explaining the structure and benefits of the hyperbolic contact, which is the biggest feature of their products, the main applications are clearly described. We have uploaded it to the related link below, so please take this opportunity to check it out.

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02.jpg

The new promotional video for IEH has been completed.

The promotional video for our handling manufacturer, IEH Corporation, has been updated. In addition to explaining the structure and benefits of the hyperbolic contact, which is the biggest feature of their products, the main applications are clearly described. We have uploaded it to the related link below, so please take this opportunity to check it out.

This is the HGM series hyperboloid (hyperbolic) connector for 2.54mm (0.1") pitch PCBs.

  • Board to Board Connectors

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02.jpg

The new promotional video for IEH has been completed.

The promotional video for our handling manufacturer, IEH Corporation, has been updated. In addition to explaining the structure and benefits of the hyperbolic contact, which is the biggest feature of their products, the main applications are clearly described. We have uploaded it to the related link below, so please take this opportunity to check it out.

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02.jpg

The new promotional video for IEH has been completed.

The promotional video for our handling manufacturer, IEH Corporation, has been updated. In addition to explaining the structure and benefits of the hyperbolic contact, which is the biggest feature of their products, the main applications are clearly described. We have uploaded it to the related link below, so please take this opportunity to check it out.

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02.jpg

The new promotional video for IEH has been completed.

The promotional video for our handling manufacturer, IEH Corporation, has been updated. In addition to explaining the structure and benefits of the hyperbolic contact, which is the biggest feature of their products, the main applications are clearly described. We have uploaded it to the related link below, so please take this opportunity to check it out.

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02.jpg

The new promotional video for IEH has been completed.

The promotional video for our handling manufacturer, IEH Corporation, has been updated. In addition to explaining the structure and benefits of the hyperbolic contact, which is the biggest feature of their products, the main applications are clearly described. We have uploaded it to the related link below, so please take this opportunity to check it out.

Strong against "jamming" during insertion and extraction. Demonstrates high reliability and performs well in environments with severe shock and vibration. Numerous achievements in the aerospace and de...

  • Board to Board Connectors

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02.jpg

The new promotional video for IEH has been completed.

The promotional video for our handling manufacturer, IEH Corporation, has been updated. In addition to explaining the structure and benefits of the hyperbolic contact, which is the biggest feature of their products, the main applications are clearly described. We have uploaded it to the related link below, so please take this opportunity to check it out.

The modular design that integrates power and signal hyperbolic contacts allows for flexible combinations to be constructed.

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  • Board to Board Connectors

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02.jpg

The new promotional video for IEH has been completed.

The promotional video for our handling manufacturer, IEH Corporation, has been updated. In addition to explaining the structure and benefits of the hyperbolic contact, which is the biggest feature of their products, the main applications are clearly described. We have uploaded it to the related link below, so please take this opportunity to check it out.

Strong against "jamming" during insertion and withdrawal, achieving lightweight design! Connectors optimal for UAM such as eVTOL.

  • Board to Board Connectors

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Strong against "jamming" during insertion and removal, resistant to shocks and vibrations! Achieves lightweight railway vehicles with high reliability.

  • Board to Board Connectors

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Strong against "jamming" during insertion and resistant to shock and vibration! Also adopted in eVTOL applications.

  • Board to Board Connectors

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Strong against "jamming" during insertion and achieves weight reduction! Ideal for eVTOL and other UAM applications.

  • Board to Board Connectors

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Strong against "jamming" during insertion and resistant to shock and vibration! Numerous achievements in the aerospace field!

  • Board to Board Connectors

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Strong against "jamming" during insertion and extraction, resistant to shock and vibration! A connector that contributes to weight reduction.

  • Board to Board Connectors

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Compliance with RoHS and ELV directives! Embossed taping specifications.

  • Board to Cable Connector
  • Board to Board Connectors
  • Board to FPC connector

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Connector protection function with reinforcement fittings! Prevents partial engagement with an inertia lock structure.

  • Other Connectors
  • connector
  • Board to Board Connectors

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SMT pin header achieving high-density mounting with a 1.27mm pitch.

  • Board to Board Connectors

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SMT pin header compatible with high-density mounting with a 2mm pitch.

  • Board to Board Connectors

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It excels in vibration and shock compared to MIL specifications, making it a highly reliable connector that also contributes to improved environmental resistance.

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  • Rectangular Connector
  • Board to Board Connectors

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Ultra-compact rectangular connector with micro-D-like crimp contact type.

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  • Rectangular Connector
  • Board to Board Connectors

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The Same Sky connector product line has newly introduced pin headers, pin sockets, and box headers.

  • Board to Board Connectors
  • connector

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The Same Sky connector product line now features new pin headers, pin sockets, and box headers.

The Same Sky connector product line now features new pin headers, pin sockets, and box headers. We offer 1 to 2 row types with a pitch of 2.54mm, available in 1 to 40 pins. Type: Pin Header / Pin Socket / Box Header Pitch: 2.54mm Direction: Vertical (Straight) Number of Pins: 1 to 40 Rated Voltage: 250Vdc Rated Current: 3A Mounting Type: Through Hole https://samesky.co.jp//SS-Products-connector-RectangularConnector.html

Providing a high-density and slim solution for interconnecting with SI performance!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

An OCP-recommended internal I/O connector solution designed specifically for boot drive applications!

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  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Designed for internal wiring, enabling support for artificial intelligence (AI) and machine learning applications!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!

  • Board to Board Connectors

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A high-speed solution that demonstrates SI performance up to 32Gbps and has a roadmap to 56Gbps!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Implementing an optimized direct-to-cable connector system to maximize system performance!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Output through a 0.50mm SMT plug and thin cable assembly without going through the PCB!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Robust machine design consistently achieves stability and reliability through external fitting!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Integrate power circuits, ground circuits, and high-speed data connections into a single connector!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Improve the connection efficiency of various increasing in-vehicle devices such as cameras, radar, turn indicators, and mirror defrosters!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Adopting modular design! It is possible to configure and provide multiple patterns of form factors.

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Ensures high reliability with a 2-point contact structure! Increases the maximum operating temperature to 125°C, suitable for automotive applications.

  • Board to Board Connectors

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