List of Other Connectors products

  • classification:Other Connectors

316~330 item / All 2512 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

It is possible to achieve effective and low-cost design by combining various cable assembly processes!

  • Other Connectors

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With our self-managed overseas inspection system, we can flexibly respond to export requirements and international quality demands!

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  • Other Connectors

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Contributing to implementation flexibility through diversification of design and miniaturization of products!

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  • Other Connectors
  • connector
  • connector

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Contributing to your products with wash-resistant, multi-pole, and high connection reliability! Introducing connectors for smart clothing.

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  • Other Connectors

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Simultaneous transmission of power and data is possible! A new standard interface that is gaining popularity from industrial equipment to mobile devices.

  • Other Connectors
  • connector

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We also introduce related products such as USB PD adapters, USB Type-C cables, and USB Type-C connectors!

  • Other Connectors

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If you are having trouble selecting for filtering, grounding, shielding, or thermal measures, please take a look! Comprehensive catalog now available.

  • cable
  • Other Connectors
  • Wiring materials

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The thermal insulation performance contributes to heat management for outdoor equipment.

  • cable
  • Other Connectors
  • Wiring materials

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Enhances the heat dissipation characteristics of the substrate, effective for thermal management inside the equipment.

  • cable
  • Other Connectors
  • Wiring materials

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Simplify cleaning and inspection! Provide exceptional signal integrity for high-performance applications.

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  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

The cable side-exit design eliminates the need to consider the cable bending radius!

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  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Achieving FFC/FPC cable connections with high retention force! Meeting a wide range of application needs.

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  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Protecting the contact and latch areas even in harsh environments!

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  • Other Connectors

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Molex WEBセミナー.png

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Add two-column products and expand multi-pole variations! Contribute to the improvement of signal integrity.

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  • Other Connectors

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Molex WEBセミナー.png

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

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