List of Heating device products

  • classification:Heating device

136~180 item / All 1975 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.

  • Other Pumps

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Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!

We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"

If you have any issues with your halogen heater, please consult us first.

  • Other heaters
  • Heating device
  • Industrial Furnace

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We might be able to save energy by utilizing the "waste heat."

  • Heating device

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Support for the sterilization of reusable N95 masks in short supply due to the novel coronavirus, in accordance with the sterilization methods for reusable N95 masks announced by the National Institut...

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  • Heating device

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A heating solution for mass-producing nanoparticles in a "continuous" manner with uniform particle size.

  • Heating device
  • Other heating equipment

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It can be heated with a structure that directly touches the heated substance, such as liquids or gases.

  • Other heaters
  • Heating device

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It is a structure that releases mechanical stress caused by expansion and contraction.

  • Other heaters
  • Heating device

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This heater can be flexibly designed for the cross-sectional area in relation to the direction of gas flow.

  • Other heaters
  • Heating device

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Supports a mixed combustion ratio from 100% hydrogen to 100% city gas. We meet customer needs with low NOx combustion and stable flames.

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  • Heating device
  • Industrial Furnace
  • Drying Equipment

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Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.

  • Heating device
  • Electric furnace
  • Annealing furnace

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【MiniLab】 Evaporation/Sputtering Dual Chamber System

Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

  • Heating device
  • Annealing furnace
  • Electric furnace

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☆★☆ Spatter and Vapor Deposition Source Combined Film Formation Device 【nanoPVD-ST15A】 ☆★☆

Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device. Metal deposition, organic deposition, and sputter cathode are installed in a compact frame. A resistance heating evaporation source (for metal deposition), an organic evaporation source (for organic materials), and magnetron sputtering (for metals and insulating materials) are installed in the chamber, allowing for various thin film experimental setups within a single chamber. ◉ Three combinations available: 1. Sputter Cathode + Resistance Heating Evaporation Source x2 2. Sputter Cathode + Organic Evaporation Source x2 3. Sputter Cathode + Resistance Heating Source x1 + Organic Evaporation Source x1 (*DC sputtering only) 【Specifications】 ◉ Compatible substrates: up to Φ4 inches ◉ Sputtering: 2" cathode x up to 3 sources ◉ Vacuum deposition: Resistance heating evaporation (up to 2), organic evaporation (up to 4) ◉ 7" touch panel operation with PLC automatic process control ◉ APC automatic pressure control ◉ 1 line of Ar gas (standard) + expandable with N2, O2 ◉ Connects to a Windows PC via USB for recipe creation and storage. Data logging on PC ◉ Various other options available ◉ Easy operation with a 7" touch panel and PLC automatic process control

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

  • Heating device
  • Annealing furnace
  • Electric furnace

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mid-station-linear-load-lock-1.jpg

【MiniLab】 Evaporation/Sputtering Dual Chamber System

Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

  • Heating device

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■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor

High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm

6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.

  • Annealing furnace
  • Heating device
  • Electric furnace

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mid-station-linear-load-lock-1.jpg

【MiniLab】 Evaporation/Sputtering Dual Chamber System

Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)

Rapid heating up to 350℃! Since it is transparent, you can check the condition of the heated object through the heater.

  • Food Processing Equipment
  • Industrial Furnace
  • Heating device

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We will introduce the main components and key elements of the high-frequency induction heating device!

  • Heating device

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We are introducing high-frequency dielectric heating, which allows for easy temperature control, in our company column!

  • Heating device

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The generation of toxic gas and the surrounding environment do not become high temperature, creating a good working environment! We have many abundant application examples to introduce.

  • Heating device

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About the expanding use of induction heating! We will provide detailed introductions by field.

  • Heating device

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It is possible to adopt various temperature control methods! The heating coil during heating can be freely raised and lowered, allowing for flexible temperature distribution.

  • Heating device

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The heating coil in operation allows for adjustable height and flexible temperature distribution! Data import to other devices is possible.

  • Heating device

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No need for water cooling cables, making maintenance a breeze! Can be integrated with the furnace body.

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  • Heating device

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Providing high-frequency devices suitable for our customers! The culmination of manufacturing experience and wisdom is our asset!

  • Heating device

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I will briefly explain the differences between induction heating and dielectric heating! Please take a moment to read it.

  • Heating device

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We will provide a detailed introduction to what the high-frequency output is based on!

  • Heating device

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We will provide a detailed introduction to high-frequency induction heating, which has various features such as easy temperature control and high reproducibility!

  • Heating device

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The principle is the same as that of an induction cooker (IH heater) and microwave! High-frequency heating using power in the radio wave range (3kHz to 3GHz).

  • Heating device

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The amount of heat generated changes depending on the electrical properties of the material (such as resistance)! Here, we introduce the heating objects for induction heating and dielectric heating.

  • Heating device

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Automotive electronic components - Shortening molding cycles and improving insulation and durability! Introducing the application fields of dielectric heating.

  • Heating device

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