List of Solder products
- classification：Solder
256～270 item / All 475 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
I will introduce the issue of printing defects (solder paste).
- Solder
Reduced occurrence of dross due to the action of oxidation-inhibiting elements! A solder pot oxidation inhibitor that exhibits stable oxidation prevention effects.
- Solder
Completely halogen-free compatible! Demonstrates wettability equivalent to halogen-containing products, and is compatible with difficult materials such as nickel and brass!
- Solder
Acidic type high-speed indium plating solution
- Non-ferrous metals
- Chemicals
- Solder
Three types of Pb-free soldered products were subjected to reliability testing! We will introduce the main objectives of each test and the results of cross-sectional observations.
- Solder
Cross-sectional observation of substrate-mounted components (1) to (6)
We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structure of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks.