List of Other polymer materials products
- classification：Other polymer materials
406～420 item / All 4575 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Low-viscosity epoxy resin that solves the heat dissipation problem of high-output robots.
- Other polymer materials
- Other consumables
It enhances heat dissipation and contributes to the efficiency of power electronics.
- Other polymer materials
- Other consumables
Low viscosity, high thermal conductivity epoxy resin that contributes to improving the cooling performance of automobiles.
- Other polymer materials
- Other consumables
Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.
- Other polymer materials
- Other consumables
It is an adhesive that is expected to have strong adhesion to materials such as silicone rubber and foam.
- Other polymer materials
Added silicone adhesive and sealant "TSE3975" to AD-Chemi.
Momentive's "TSE3975" is a one-component, moisture-curing, low-volatility silicone adhesive. It cures at room temperature by reacting with moisture in the air, forming a silicone rubber that combines flexibility and elasticity. Unlike the paste-type TSE3925 in the same series, TSE3975 is a flowable type. It maintains moderate flowability while being resistant to dripping, allowing for smooth filling and sealing of gaps and narrow spaces with complex shapes. The curing mechanism employs an alkoxy curing method, releasing alcohol-based vapors during the curing process. Unlike acetate types, it is non-corrosive to metals, making it particularly suitable for use in electrical and electronic devices that utilize various metal components such as copper, iron, aluminum, and stainless steel. It also meets the corrosion test of military standard MIL-A-46146B, ensuring reliability for applications that require high trustworthiness. In terms of adhesive performance, it demonstrates excellent adhesion to a wide range of substrates, including metals, various plastics, glass, and ceramics, without the need for a primer.
This is a thin film coating agent designed to protect electronic printed circuit boards (PCBs). It protects substrates and components from mechanical and environmental corrosion.
- Rubber
- Other polymer materials
Added silicone adhesive and sealant "TN8000" to AD-Chemi.
SnapSil TN8000 is a one-component, fast-curing, non-corrosive silicone adhesive sealant provided by Momentive Performance Materials. It utilizes an alkoxy neutral curing system that reacts with moisture in the air, forming a silicone rubber that combines flexibility and elasticity after curing. This product takes the form of a thixotropic (shear-thinning) paste, demonstrating moderate flowability during application, while minimizing sagging after application on vertical or inclined surfaces, making it easy to work with. Additionally, since it is an alkoxy curing type, it does not emit corrosive gases during curing. It can be safely used in applications involving easily corroded metal materials such as copper and precision electronic components. Features: - Fast curing and alkoxy neutral curing: Cures quickly at room temperature, improving work efficiency. - Primerless adhesion: Exhibits excellent adhesion without the need for a primer on many substrates. - Long-term adhesion reliability: Maintains high adhesive strength even in humid environments. Adhesive performance remains stable after long-term aging. - Excellent electrical insulation: Has high volume resistivity and dielectric breakdown voltage, making it suitable for insulating and sealing electrical and electronic components. - Flame retardant certification: UL94 HB certification obtained.
We propose silicone adhesives, potting materials, and encapsulants that can also be used for conventional general-purpose devices requiring heat dissipation.
- Rubber
- Other polymer materials
Added silicone adhesive and sealant "TSE3975" to AD-Chemi.
Momentive's "TSE3975" is a one-component, moisture-curing, low-volatility silicone adhesive. It cures at room temperature by reacting with moisture in the air, forming a silicone rubber that combines flexibility and elasticity. Unlike the paste-type TSE3925 in the same series, TSE3975 is a flowable type. It maintains moderate flowability while being resistant to dripping, allowing for smooth filling and sealing of gaps and narrow spaces with complex shapes. The curing mechanism employs an alkoxy curing method, releasing alcohol-based vapors during the curing process. Unlike acetate types, it is non-corrosive to metals, making it particularly suitable for use in electrical and electronic devices that utilize various metal components such as copper, iron, aluminum, and stainless steel. It also meets the corrosion test of military standard MIL-A-46146B, ensuring reliability for applications that require high trustworthiness. In terms of adhesive performance, it demonstrates excellent adhesion to a wide range of substrates, including metals, various plastics, glass, and ceramics, without the need for a primer.
Controlling the bubbles changes the quality.
- Other polymer materials
Added silicone adhesive and sealant "TSE3925" to AD-Chemi.
Momentive's "TSE3925" is a one-component, moisture-curing, low-volatility silicone adhesive. It cures at room temperature by reacting with moisture in the air, forming a silicone rubber that combines flexibility and elasticity. The product has a non-flowing paste-like consistency, making it resistant to dripping after application. It ensures minimal displacement during application on vertical surfaces, inclined surfaces, and uneven areas, providing stable workability. The tack-free time is approximately 5 minutes at 23°C, demonstrating excellent fast-curing properties that contribute to shortening processes in manufacturing lines and on-site work. In terms of adhesion performance, it exhibits excellent adhesion to a wide range of substrates, including metals, various plastics, glass, and ceramics, without the need for a primer. Additionally, the content of low molecular weight siloxanes is extremely low (0.028 wt%), making it safe for use in sensitive electronic components and sensor areas where siloxane gas may cause contact failure or contamination. For more details, please check our website.
We will introduce the products that will be exhibited at the 39th Nepcon Japan from January 22 to January 24 (Tokyo Big Sight).
- Engineering Plastics
- Other polymer materials
- plastic
Exhibited at the 40th NePCON Japan from January 21 to January 23 (Tokyo Big Sight).
Nepcon Japan is an electronics development and assembly exhibition that showcases electronic components and materials, as well as manufacturing, assembly, and inspection equipment that support the multifunctionality and high performance of electronic devices.
Stretchable conductive material with conductivity imparted to acrylic elastomer.
- Other polymer materials
Stretchable conductive material with conductivity imparted to acrylic elastomer.
- Other polymer materials