List of Other polymer materials products

Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

• air conditioning

Compliant with RoHS and REACH! Easy to mold, easier to process than traditional metal materials, and economical!

• Other polymer materials

Room temperature curing type × high thermal conductivity 2.4W/mK! A two-component epoxy resin with excellent heat dissipation insulation. Suitable for thermal management of motors, coils, and sensors.

• Other polymer materials

High thermal conductivity of 2.5 W/mK and high Tg of 185°C, this is a highly reliable low-viscosity epoxy resin suitable for thermal management of motors and coils.

• Other polymer materials

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

• Other polymer materials

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

• Other polymer materials

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

• Other polymer materials

Low viscosity for thorough filling of details! An epoxy resin that can also be considered as a varnish alternative. Cures at room temperature and contributes to energy savings.

• Other polymer materials

Room temperature curing × high heat resistance × flame retardant V-0 equivalent! Epoxy resin for sealing electrical and electronic components. No heating equipment required! Contributes to energy savi...

• Other polymer materials

Room temperature curing × high transparency × flame retardant equivalent to V-0 epoxy resin. Flexibility enhancement to suppress cracking! A new proposal for room temperature curing epoxy.

• Other polymer materials

Transparent, difficult to yellow, flame-retardant epoxy resin equivalent to V-0. Low viscosity with excellent workability. Widely usable from transparent sealing to clear panels.

• Other polymer materials

Room temperature curing × high thermal conductivity × flexibility! An epoxy resin suitable for stress relief. Low viscosity and good workability, equivalent to UL94 V-0.

• Other polymer materials

One-component × low-temperature curing × high insulation! Epoxy resin for encapsulating electronic components. Cures completely at 80°C in 1 hour! Low-temperature curing type enhances work efficiency.

• Other polymer materials

One-component × high strength × high thixotropy! An epoxy resin suitable for structural bonding. With a Tg of 130°C and a shear adhesive strength of 24 MPa, it is a highly reliable structural adhesive...

• Other polymer materials

Room temperature curing × high adhesion × high moisture resistance! Epoxy resin for small motors and sensors. Cures at room temperature, energy-saving high-performance epoxy.

• Other polymer materials