List of Contract Analysis products
- classification:Contract Analysis
511~525 item / All 2066 items
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- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
TEM-EELS enables elemental identification and chemical state analysis in micro-regions.
- Contract Analysis
It is possible to non-destructively identify the location of defects in solar cell cells.
- Contract Analysis
Trace analysis of metallic elements and atmospheric component elements.
- Contract Analysis
Evaluation of carrier diffusion layer uniformity in samples with surface roughness.
- Contract Analysis
Identification of contamination sources on the cleavage surface using TOF-SIMS.
- Contract Analysis
Identification of contamination sources on the outermost surface using TOF-SIMS.
- Contract Analysis
Evaluation of the state before and after drug solution treatment using Raman analysis.
- Contract Analysis
Identification of powders by FT-IR analysis and XRF analysis.
- Contract Analysis
It is possible to evaluate the state of the electrodes before and after charging, as well as the presence and distribution of Li.
- Contract Analysis
- Contract measurement
- Contract Inspection
Samples after thermal degradation can be evaluated using LC/MS/MS, TOF-SIMS, TEM+EDX, etc.
- Contract Analysis
- Contract measurement
Evaluation of composition, bonding state, structure, and density is possible.
- Contract Analysis
Simultaneous analysis of six types of ginsenosides (Rb1, Rc, Rd, Re, Rg1, Rg3)
- Contract Analysis
Proposal for evaluation of breakdown voltage of GaN-based devices and surface heat distribution assessment.
- Contract Analysis
Non-destructive analysis of leakage points in Si-based power diodes.
- Contract Analysis
Evaluation of distribution uniformity and identification/estimation of organic matter through surface analysis of microdomains.
- Contract Analysis