List of Contract Analysis products

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• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

We respond to various needs, including those in the automotive sector and its surrounding fields, and we accept commissioned testing and research.

• Contract Analysis

We respond to various needs, including those in the automotive sector and its surrounding fields, and we accept commissioned testing and research.

• Contract Analysis

We respond to various needs, including those related to automobiles and their surrounding fields, and we accept commissioned testing and research.

• Contract Analysis

We respond to various needs, including those related to automobiles and their surrounding fields, and we accept commissioned testing and research.

• Contract Analysis

We respond to various needs, including those in the automotive sector and its surrounding fields, and we accept commissioned testing and research.

• Contract Analysis

We respond to various needs, including those related to automobiles and their surrounding fields, and we accept commissioned testing and research.

• Contract Analysis

We will introduce many examples of our strengths using FIB, such as methods for detecting anomalies within plating layers, pattern drawing, and structural analysis.

• Contract Analysis
• Other semiconductors
• Processing Contract

The Slice & View feature of FIB allows you to observe the spread from the starting point of plating defects, and the 3D construction enables confirmation of the shape of the defects.

• Plating Equipment
• Contract Analysis
• Other metal materials

In addition to general thermal analysis, we will introduce many examples of our strengths in DSC, TG-DTA, DMA, etc., including low-temperature measurements and estimates of deformation and fracture.

• Other measurement, recording and measuring instruments
• Contract Analysis
• Other polymer materials

It is possible to estimate the curing time of epoxy resin from the DSC measurement results. We will simulate using the Kamal model.

• Contract Analysis
• Contract measurement
• Other polymer materials

The results of DMA measurements can predict the long-term deformation (creep measurement) of materials. This can be utilized in evaluations that typically take a long time.

• Rubber
• Contract Analysis
• Contract Analysis

Supports PAT, process control, automation, and remote operation through bio-compatible functionality and real-time bioprocess monitoring.

• Analytical Equipment and Devices
• Separation device
• Contract Analysis

Acquisition of ISO/IEC 17025 laboratory accreditation! Reliable testing services through a controlled environment and established procedures.

• Contract Analysis
• Contract measurement
• Contract Inspection

Effective for identifying defects in semiconductors and electronic components, as well as measuring current distribution in new materials!

• Contract Analysis
• Contract measurement
• Contract Inspection

You can observe the internal structures and defects of semiconductors, electronic components, and organic composite materials by magnifying them.

• Contract Analysis