List of Other semiconductors products
- classification：Other semiconductors
511～525 item / All 2606 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Did you know that CMP slurry can be regenerated as CMP slurry?
- Ceramics
- Other semiconductors
Aluminum extruded heat sink with a width of 31 mm and a height of 6 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 30 mm and a height of 17.5 mm - available in length variations.
- Other semiconductors
Materials used in automobiles, semiconductors, and solar panels, as well as packaging materials, also utilize Goyo Paper's laminated products.
- Other electronic parts
- Other semiconductors
- Paper and pulp products
Aluminum extruded heat sink with a width of 30 mm and a height of 7.5 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 29 mm and a height of 25 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 29 mm and a height of 11.5 mm - available in various lengths.
- Other semiconductors
We will comprehensively respond to our customers' needs, from consulting on requirements specifications to chip replacement!
- Other semiconductors
FPGA capable of high-speed and real-time processing.
- Other semiconductors
A thorough explanation of semiconductor packaging from the basics to applications!
- Other semiconductors
- others
- Technical and Reference Books
5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"
■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)
Aluminum extruded heat sink with dimensions of 27.95 mm wide x 15.24 mm high - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 12.5 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 8 mm - available in various lengths.
- Other semiconductors
Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17
■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, more sophisticated material design for encapsulants is required than ever before. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulants. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials
Aluminum extruded heat sink with dimensions 27 mm wide x 22 mm high - available in various lengths.
- Other semiconductors