List of Other semiconductors products
- classification：Other semiconductors
901～915 item / All 2609 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
With a pressing force of 55N, the transistor in the TO-220 and TO-3P packages can be reliably brought into contact with the heat sink.
- Other semiconductors
With a pressing force of 59N, it is possible to ensure that transistors in TO-248 and TO-218 packages make reliable contact with the heat sink.
- Other semiconductors
A pressing force of 20N can reliably ensure that the TO-220 package transistor makes contact with the heat sink.
- Other semiconductors
One-stop solution from design to manufacturing of power semiconductors!
- Other semiconductors
Nikkankogyo Shimbun - Award-winning products of the Excellent New Technology and New Products Award! Eliminated the need for external shielding.
- Other semiconductors
You can download and view the latest flyers and catalog data distributed at the exhibition held in November 2024!
- Memory
- Other semiconductors
We offer semiconductor products primarily featuring Toshiba semiconductors, as well as LCDs and electronic components!
- Other semiconductors
Achieving a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line! *Samples available upon request.
- Other semiconductors
Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!
- Other semiconductors
Achieves low RDS(on) to maximize the effective use of package space.
- Other semiconductors
Introducing our unique package and DioMOS technology fusion module!
- Other semiconductors
The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!
- Other semiconductors
Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.
- Other semiconductors
Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.
- Other semiconductors
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
6/2 Webinar "AI Data Center Heat Dissipation/Cooling Technology"
■ Title: "Heat Dissipation/Cooling Technologies for AI Data Centers" ―― The rapid increase in data center power due to the expansion of generative AI. How to address PUE targets and high-heat GPUs. A practical overview from air cooling to liquid cooling, cold aisle, water cooling in-row, and immersion cooling. A strategic course to master thermal issues. ■ Date and Time: June 2, 2026 (Tuesday) 10:30 AM - 4:30 PM ■ Zoom Streaming (Archive available for missed sessions with materials) 【Knowledge Gained from the Seminar】 - Basic knowledge of heat transfer - Heat dissipation knowledge in component and circuit board design - Common thermal design methods for forced air cooling and natural air cooling equipment - Thermal design methods for heat sinks, etc. 【Target Audience for the Seminar】 Electronic device designers (assembly design, mechanical design, circuit design, circuit board design), heat dissipation device/material developers, quality assurance, and quality control departments.