List of Other semiconductors products
- classification：Other semiconductors
46～90 item / All 2687 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
For industrial equipment, power supplies, and batteries. Supporting the selection and replacement of low on-resistance, high-efficiency, and high-reliability MOSFETs.
- Other semiconductors
This is a special industrial OPP film with a formulation of additives that is controlled as much as possible. It can be used as a release film in the electronics and optics fields without coating a re...
- Other optical parts
- Other semiconductors
Reproduction is possible even without design data. 'Discontinued LSI Reproduction Service' that does not stop mass production and maintenance.
- Other semiconductors
- EMS
- Dedicated IC
Agilex 5 FPGA SOM Second Edition. Low-cost and small Comet A13 SoM.
- Embedded Board Computers
- Other electronic parts
- Other semiconductors
Systematically acquire semiconductor packaging technology from the basics. Learn about quality control and the latest packaging trends in one day.
- Technical Seminar
- Other semiconductor manufacturing equipment
- Other semiconductors
![[Demo Unit Rental] ESD-Compatible B...](https://image.mono.ipros.com/public/product/image/24c/2000511511/IPROS50291014719946690229.jpeg?w=280&h=280){kind=small}
Adopts a body with embedded electrostatic discharge prevention material, an ESD-compatible laser barcode scanner capable of continuous high-speed reading.
- Printed Circuit Board
- Other semiconductors
- Other clean room equipment and facilities
HFE from Halocarbon is a fluorinated solvent with a low global warming potential (GWP) and an ozone depletion potential (ODP) of zero.
- Electronic Components
- Other semiconductors
A systematic explanation of silicon, silane, silicone, and silica. Learn broadly from everyday applications to the semiconductor and optical fields.
- Ceramics
- Fine Ceramics
- Other semiconductors
A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!
- Technical and Reference Books
- Other semiconductors
- Technical and Reference Books
11/5 Webinar: Basics of Semiconductor Packaging and Quality Control
■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors
Producing fluorine specialty products on various scales! Supporting customers from initial development.
- Lubricants
- Other semiconductors
- Chemicals
No need for contact with the reader, making it less prone to damage! Introduction to non-contact IC cards.
- Other production management systems
- Entrance and exit control system
- Other semiconductors
A practical market research report systematically organized around thermal management, focusing on structural changes in the AI infrastructure market, competitive strategies of major companies, market...
- Server Cooler
- server
- Other semiconductors
10/22 Webinar "C3 Thinking in the Era of Generative AI"
**Title: "Thinking Skills to Survive in the Era of Generative AI: 'C3 Thinking Method - From Creative and Critical Thinking to Presentation Techniques'"** --- To survive in the era of generative AI and create new value, we explain the necessary thinking skills through the "C3 Thinking Method," which consists of "Creative," "Critical," and "Communicative." Participants will learn practically through exercises, covering methods for idea generation using generative AI, ways to critically evaluate AI output, and techniques for effectively communicating thought results through verbalization, visualization, and presentation skills. **Knowledge Gained from the Seminar:** - Basic thinking skills required in the generative AI era and the C3 Thinking Method - Methods to expand ideas and concepts using generative AI - Key points for critically evaluating the output of generative AI - Ways to appropriately and effectively communicate thought results to others - Skills in verbalization, visual thinking, and presentation techniques **Target Audience for the Seminar:** - Individuals involved in "thinking jobs" such as corporate planning and business planning - Those responsible for human resource education and training - Individuals who want to utilize generative AI in their work - Those who wish to systematically learn the thinking skills needed in the AI era
An easy-to-understand explanation of the latest trends in PFAS regulations, which are being strengthened globally!
- Technical and Reference Books
- Other semiconductors
11/5 Webinar: Basics of Semiconductor Packaging and Quality Control
■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors
Reproduction is possible even without design data. 'Discontinued LSI Reproduction Service' that does not stop mass production and maintenance.
- Other semiconductors
- EMS
- Dedicated IC
Difficult-to-dissolve substances can also be cleaned with peeling and dissolving actions! A water-based cleaning agent that balances cleaning performance and safety.
- Cleaning agents
- Other semiconductors
- Printed Circuit Board
A page for "flux cleaner" has been added.
We have added a page for "Flux Cleaning Agent." This product selectively removes flux residues and is a water-based cleaning agent that supports the quality and reliability of electronic devices. Conventional solvent-based cleaning agents primarily rely on dissolving action to remove flux residues, but this product simultaneously exhibits both peeling and dissolving actions through its unique cleaning technology. 【Features】 ■ High cleaning performance due to unique cleaning technology ■ Removal of oxide films and prevention of re-oxidation during cleaning ■ Increased bonding strength through cleaning ■ High safety due to being a water-based cleaning agent
Compatible with 2 to 12-inch wafers. Customizable for each item.
- Other cleaning machines
- Other semiconductor manufacturing equipment
- Other semiconductors
Achieving stable operation even in harsh industrial environments with accurate inspection and high-speed detection!
- Dedicated IC
- Other semiconductors
Achieving high-quality clocks for high-speed communication, optical communication, and data centers with ultra-low phase jitter at the femtosecond level.
- Dedicated IC
- Other semiconductors