Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?

From investigating the mechanisms of failures and malfunctions to proposing improvement measures and verifying their effectiveness, our expert engineers provide total support!

Eurofins FQL provides failure analysis for a variety of products, from circuit components such as semiconductors, printed circuit boards, and connectors to OEM and ODM products. If you have concerns such as "I want to conduct failure analysis but do not have sufficient equipment" or "I have doubts about the manufacturer's failure analysis report," please feel free to contact us. 【Leave it to us】 ■ Investigation Plan: Understanding failure phenomena and planning analysis methods to confirm usage conditions ■ Non-destructive Analysis: Narrowing down abnormal areas non-destructively ■ Destructive Analysis: Estimating causes through observation and analysis of the occurrence of abnormalities ■ Summary of Results: Summarizing analysis results and proposing improvements *For more details, please refer to the PDF materials or feel free to contact us.

• Capacitor
• Contract Analysis
• Other contract services

Are you having trouble with the resin opening of power modules such as IGBTs, which contain a high amount of filler in the package sealing resin for high voltage and large current components?

Power modules such as IGBTs (Insulated Gate Bipolar Transistors) for high voltage and large current components often contain a significant amount of fillers in the package sealing resin, making it difficult to open the resin. We can remove the package resin using chemical agents for internal observation and, depending on your requirements, conduct evaluations, analyses, and assessments of the internal components after opening. *Please provide a trial sample for opening in advance so we can confirm whether it can be opened (free of charge). *IGBT (Insulated Gate Bipolar Transistor) is a type of power semiconductor capable of high-speed switching for large power.

• inverter
• Contract Analysis
• UPS/Uninterruptible Power Supply

Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?

We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.

• Microcomputer
• Contract Analysis
• Other contract services

We select the optimal non-destructive analysis from lock-in infrared thermal analysis, 3D X-ray tomography, ultrasonic testing (SAT), etc., and narrow down the abnormal areas.

In non-destructive analysis, we understand the failure occurrence situation and infer the failure mechanism from visual observation and electrical characteristics. Lock-in infrared thermal analysis When precise location identification is difficult in a non-destructive manner, focusing on heat generation and comparing it with good products is effective. - There are multiple components related to abnormal phenomena, such as mounted circuit boards. - It is unclear whether the short circuit is inside a component or externally at a solder joint. [Examples] - Chip capacitors - Power ICs - Printed circuit boards Ultrasonic flaw detection (SAT) While it is known that delamination inside ICs can be observed, it is also suitable for checking the condition of items composed of multiple materials. [Examples] - Bonding areas of cosmetic panels - Junctions of aluminum heat sinks - Interiors of die-cast products *For more details, please refer to the PDF document or feel free to contact us.

• Microcomputer
• Other semiconductors
• Contract Analysis

We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!

We provide high-quality circuit processing and wiring processing services using FIB, including cutting and changing connection points of fine wiring in the lower layers, processing fine wiring located beneath wide power wiring, and the urgent delivery of functioning LSI. - Both AL wiring and Cu wiring can be processed. - We accept orders starting from just one piece. - We will propose the optimal processing points during consultations. - We can accommodate special sample shapes. Please consult with us.

• Microcomputer
• Semiconductor inspection/test equipment
• Semiconductors and ICs

Reliability evaluation of power modules and power devices. We offer proposals from the construction of test environments tailored to your power cycle specifications to investigation and analysis!

When power semiconductors and power modules are repeatedly turned ON and OFF, the self-heating and cooling of the components and modules cause distortion due to the differences in expansion of the bonding materials, leading to a deterioration in bonding reliability. We offer power cycle testing that takes into account the heating operation due to repeated self-heating and cooling cycles. ■ Components, units, and devices where the adoption of power semiconductors and power modules is progressing: - Traction inverters for electric vehicles (EVs) and hybrid electric vehicles (HEVs) - On-board chargers and DC-DC converters - Motor control, robots, machine tools, elevators - Industrial inverters and uninterruptible power supplies (UPS) - Solar power generation systems and wind power generation systems

• inverter
• Engine parts
• UPS/Uninterruptible Power Supply

We offer a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests!

Our company offers "reliability evaluation/environmental testing" services. We own over 100 testing machines and chambers, including thermal shock testers and gas corrosion testers. We can accommodate a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests, as well as providing rental of testing chambers and conducting customized tests. Please feel free to contact us. 【Available Reliability Tests / Environmental Tests (partial list)】 ■ Thermal Shock Test (Gas Chamber / Liquid Chamber) ■ High Temperature and High Humidity Storage Test ■ Gas Corrosion Test ■ Accelerated Weather Resistance Test ■ Vibration Test ■ Salt Spray Test ■ Safety Tests (Crush Test, Heating Test, Charge/Discharge Test)

• Environmental Test Equipment
• Contract Inspection
• Other contract services

In public construction civil engineering sites, there are many instances where sheets are used as common temporary facilities, such as construction roads, access roads, heavy machinery work yards, material storage areas, and worker pathways. Traditionally, steel plates were common, but due to their weight, transportation and installation can be cumbersome. Hyper CLT sheets are civil engineering materials made from wooden CLT for civil engineering use. The 5×10 sheet weighs about 230 kg, and the 5×20 sheet weighs about 460 kg, making them lightweight and easy to transport, install, and remove, even with small machinery. They can be widely utilized for temporary roads, heavy machinery scaffolding, pathways within the site, and protection of material storage in public works. Since they are made of wood, they also contribute to environmental aspects such as reducing summer heat reflection, lowering noise, and fixing CO2. They can simultaneously address construction efficiency, safety measures, and environmental considerations, making them effective for innovative proposals in public works. Furthermore, they improve transportation efficiency and reduce labor in site operations as an alternative to steel plates. Hyper CLT sheets are registered technology with the Ministry of Land, Infrastructure, Transport and Tourism under NETIS "TH-250021-A." They are recommended for companies considering civil engineering, civil engineering use, and civil engineering CLT. Feel free to request materials or consult about implementation. They are temporary materials that also help improve site evaluations in public works. Please consider them.

We have released a new video on our company’s YouTube channel. The theme of this video is "The World of Amino Acid-Based Shampoos." Amino acid-based shampoos have become popular in recent years, but the lather, feel, and finish can vary greatly depending on the cleansing ingredients used. In this video, we clearly explain the changes in user experience based on the differences in cleansing ingredients by comparing two types of amino acid-based shampoos. We hope you can use this as a hint for developing original shampoos and differentiation.

New York and Tokyo, June 26, 2026 - (JCN Newswire) - This year's successful listing of PayPay Corporation (hereinafter "PayPay") on NASDAQ has provided a significant boost. The question now facing Japan's leading innovation companies is no longer "Is a U.S. listing feasible?" but rather "How can we attract global capital and build companies that align with global growth strategies?" The 2nd Japan Go IPO Summit will be held on September 16, 2026, at the Grand Hyatt Tokyo to address this question. This summit is hosted by MarcumAsia and organized by AUM Advisors. To register for this invitation-only event, please apply here: Japan GO IPO Summit Attendee Information https://events.marcumasia.com/view.php?id=32

Our company representative, Shibata, will be speaking as a lecturer at the "Mikata Project" AI Utilization Seminar for the automotive industry, hosted by the Chubu Bureau of Economy, Trade and Industry. ■ Title: AI Implementation Course Leading to Results - Learning Success Patterns and Practical Processes from Real Examples in Manufacturing Sites "We implemented AI, but it is not being used on-site and is left unattended" and "The implementation has become the goal without yielding results" - we have seen many such stumbling blocks in manufacturing sites. In the seminar, based on real examples, we will discuss common patterns for successful implementation that lead to results, pitfalls to avoid, and practical processes to ensure AI is continuously used. We will also propose specific measures for sites struggling with technology transfer and dependency on individuals. ■ Event Overview Date: July 3, 2026 (Friday) 13:30 - 16:00 Venue: TKP Meitetsu Nagoya Station Conference Center + Online Participation Fee: Free / Application Deadline: June 30 (Tuesday) Organizer: Chubu Bureau of Economy, Trade and Industry (Automotive Industry "Mikata Project") Co-presenter: Satoru Hayami, Waseda University For details and registration, please visit the official page of the Chubu Bureau of Economy, Trade and Industry. If you are struggling with AI implementation in manufacturing sites, please feel free to consult us, regardless of region or industry.

July 16 (Thursday) 10:00 AM - 6:00 PM Venue: Convex Okayama Small Exhibition Hall