Reliability evaluation test / environmental test

As the practical application of quantum computers, AI servers, and optoelectronic fusion systems progresses, printed circuit boards are required to achieve higher density and multilayering than ever before. On the other hand, the miniaturization of wiring spacing and interlayer distances increases the risk that even slight foreign substances or ionic residues can cause insulation failures, leading to short circuits, localized heating, and even burning. Particularly in AI servers and high-speed communication boards, minor insulation degradation can significantly impact the overall reliability of the system. Additionally, after burning, the foreign substances or conductive pathways that caused the issue often disappear, making fault analysis difficult in many cases. Eurofins FQL conducts advanced insulation evaluation tests at the bare board stage before component mounting, visualizing potential risks early on. ✔ Prevention of defects ✔ Improvement of quality and reliability ✔ Reduction of analysis costs and rework hours We support the realization of high-reliability products, from advanced package boards for quantum computers to high-performance boards for AI servers and ultra-high-speed transmission boards for optoelectronic fusion. Please feel free to consult us about the quality of boards that support next-generation technologies.

The usage environment of electronic devices varies, and the impact of corrosion caused by various environmental factors tends to increase. The reliability and lifespan of electronic devices heavily depend on the environment in which they are used. Corrosive substances originating from hot springs, volcanoes, waste, and rivers can corrode electronic components, printed circuit board wiring, connector contacts, and switch contacts of electrical equipment, potentially leading to serious issues. This content is recommended for those who want to solve such challenges: • Does the atmosphere of the operating environment lead to failures in electronic devices? • I want to reduce the risk of failure in harsh environments such as hot springs and wastewater treatment plants. • I want to conduct environmental surveys in large factories with fewer personnel and man-hours. • I want to prolong the lifespan of aging infrastructure as much as possible. We will introduce our original corrosion environment diagnostic kit, Eco Checker II, as well as methods for diagnosing corrosion environments.

The spread of 5G communication, the electrification of the automotive industry, the intensification of US-China trade friction represented by certain semiconductor manufacturers leading to supply stoppages, and the rapid increase in digital products due to the impact of the COVID-19 pandemic are various social phenomena that are increasing the demand for semiconductors. Along with these developments, the acceleration of semiconductor supply risks is progressing. In addition to the adoption of new products, evaluation of existing and distributed products is also necessary... However, the personnel involved in new adoption and product evaluation are limited. Do you have any of these concerns? - Lack of know-how to evaluate semiconductor components - Want to evaluate alternative products but lack personnel and equipment - Want to use stock items and market products but have concerns about reliability - Unable to determine whether the delivered semiconductor products are counterfeit or genuine At Eurofins FQL, we leverage our years of experience in component evaluation and failure analysis to provide not only semiconductor evaluations but also failure analysis services. Additionally, we offer evaluations of distributed products to assist in determining the authenticity of counterfeit, imitation, or long-term stored items. Please feel free to contact us.

We will be exhibiting at the 54th Reliability, Maintainability, and Safety Symposium. ■Content We will present a case study focusing on market failures that resulted from contact failure due to corrosion (dezincification) occurring inside pogo pins. Additionally, we conducted verification on new samples based on four key points extracted from FTA (corrosive substances, temperature/humidity, scratches (wear), and pinholes), and found that the presence of formate ions and sulfate ions, along with scratches (wear), significantly accelerated corrosion. We will estimate the contact failure mechanism derived from the verification results.