Quality assurance for substrates supporting next-generation computing - Supporting the realization of high-reliability products, from advanced package substrates for quantum computers to high-performance substrates for AI servers and ultra-high-speed transmission substrates for optoelectronic integration.
As the practical application of quantum computers, AI servers, and optoelectronic fusion systems progresses, printed circuit boards are required to achieve higher density and multilayering than ever before. On the other hand, the miniaturization of wiring spacing and interlayer distances increases the risk that even slight foreign substances or ionic residues can cause insulation failures, leading to short circuits, localized heating, and even burning. Particularly in AI servers and high-speed communication boards, minor insulation degradation can significantly impact the overall reliability of the system. Additionally, after burning, the foreign substances or conductive pathways that caused the issue often disappear, making fault analysis difficult in many cases. Eurofins FQL conducts advanced insulation evaluation tests at the bare board stage before component mounting, visualizing potential risks early on.
✔ Prevention of defects
✔ Improvement of quality and reliability
✔ Reduction of analysis costs and rework hours
We support the realization of high-reliability products, from advanced package boards for quantum computers to high-performance boards for AI servers and ultra-high-speed transmission boards for optoelectronic fusion. Please feel free to consult us about the quality of boards that support next-generation technologies.

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For themes where evaluation methods have not been established, we will also consider the evaluation criteria and analysis approaches together.







