List of Circuit board design and manufacturing products

Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

• air conditioning

We will introduce the technology for picking up by suction and transferring to chip trays and JEDEC trays.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

Introducing technologies compatible with wet dicing and dry dicing!

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

Pine α supports direct path cleaning with pure water! Capable of suitable cleaning!

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

We handle all mixed implementation that combines multiple processes in-house! We also deal with a wide range of processes related to mixed implementation!

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

Implementation of ultra-small solder balls is possible! Solder balls can be directly mounted on the flux of the PCB surface electrodes!

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

It can further reduce the implementation area compared to the COB method, enabling miniaturization on the PCB!

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

Miniaturization of modules is possible! Semiconductor chips can be directly mounted on printed circuit boards using die bonding material!

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

Directly mount semiconductor components onto the solder of PCB surface electrodes! Chip components and irregularly shaped components can be mounted on the surface of the PCB!

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

At Nishiuchi, we are engaged in the development and design of resin molding and casting, as well as the production of composite products.

• plastic
• Circuit board design and manufacturing
• Other polymer materials

Chip size packages for various components used in mobile phones and other small devices.

• Printed Circuit Board
• Other electronic parts
• Circuit board design and manufacturing

Significantly improved circuit density! A substrate that enables more three-dimensional and high-density configurations.

• Printed Circuit Board
• Circuit board design and manufacturing

High-density and high-reliability multilayer boards can be manufactured!

• Printed Circuit Board
• Circuit board design and manufacturing

Implementation of components directly above the through hole and solder balls is possible! Achieving high density in the circuit board.

• Circuit board design and manufacturing
• Printed Circuit Board

A technology capable of forming high dams of approximately 0.1 to 0.6 mm through a unique special printing method.

• Circuit board design and manufacturing
• Printed Circuit Board
• Other electronic parts

Complex structures can be realized by combining machining technology, STH technology, and others!

• Circuit board design and manufacturing
• Printed Circuit Board
• Other electronic parts