List of Electronic Components and Modules products
- classification:Electronic Components and Modules
8056~8100 item / All 59185 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
How flexible printed circuit boards save space in harsh automotive and industrial environments.
- Printed Circuit Board
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
【Significant reduction in power loss and heat generation】DC/DC converter achieving over 97% efficiency. Flexible system configuration is also possible with series and parallel connections.
- converter
This is a ceramics 3D printer capable of handling high precision and ultra-complex shapes. We will assist you in developing products one step ahead!
- Sensors
- Capacitor
- Other semiconductors
Expanding 2A class high current products into a compact package (SC-59)!
- Transistor
Aluminum extruded heat sink with a width of 37mm and a height of 10mm - available in various lengths.
- Other semiconductors
Pursuing 'high efficiency' and 'compact vertical design' reasonably!!
- converter
HOLT has announced the expansion of its MIL-ST-1553 product line with the new HI-6200 family of products.
- Dedicated IC
The MAMBA series features a 6mm x 6mm MIL-STD-1553 terminal (SPI interface).
- Other electronic parts
HOLT Corporation 1553 Protocol IC HI-2130
The world's smallest MIL-STD-1553 terminal IC, with a transformer integrated into a slim 15×15×4.4mm package. The HI-2130 is a product that combines the functions of Holt's HI-6130 16-bit parallel bus interface and HI-6131 SPI device, integrating MIL-STD-1553 protocol logic, dual transceivers, and dual transformers into one compact package. The slim 15×15×4.4mm HI-2130LBxx is one of the smallest single-package 1553 terminals with an integrated transformer, making it ideal for applications such as switched mezzanine cards (XMC) or PCI mezzanine card (PMC) assemblies. The BGA package is available in both RoHS compliant and Sn/Pb versions, providing customers with a solution for Sn/Pb assemblies without the need for expensive re-balling.
If you're considering magnetic induction AGVs, choose Makome for sensors!
- Sensors
- Sensors
Our company handles batteries for various applications, including batteries for different uses.
- Lithium-ion battery
- Secondary Cells/Batteries
Prototyping and mass production of precision optical products, accommodating small to large production runs (custom assembly equipment support also available).
- Other optical parts
- Prototype Services
In addition to V-notch and orifice processing in accordance with SEMI standards, additional machining such as notching and drilling is also possible. We support research and development from a single ...
- Other semiconductors
We provide a series of project systems that satisfy our customers, leveraging the development and production know-how and networks (cooperative partners) cultivated at major mass production manufactur...
- lens
To security, high value-added products in the automotive application industry! Achieving performance tailored to the application.
- lens
- Processing Contract
Compatible with spherical-shaped lenses! It can also accommodate lenses with diffraction structures on the lens surface.
- lens
- Mold Design
Pioneering the future with mechatronics and optical technology! We provide a series of project systems that satisfy our customers.
- lens
To those in the medical, equipment maintenance, and entertainment industries! We provide display devices adapted to the evolving AR and VR software.
- Other optical parts
Utilizing mechatronics and optical technology to change future lifestyles and propose new value creation in the market.
- lens
Consistent support available! We can perform high-precision mold making and precise molding.
- lens
- Mold Design
Aluminum extruded heat sink with a width of 37mm and a height of 6mm - available in various lengths.
- Other semiconductors
Calibrate the CO2 sensor on-site! Easy operation with one push.
- Sensors
49.5 inches, high resolution 1920x540, high brightness 1500 nits, open frame, supports wide viewing angles, ultra-wide monitor
- LCD display
If you are having trouble selecting for filtering, grounding, shielding, or thermal measures, please take a look! Comprehensive catalog now available.
- cable
- Other Connectors
- Wiring materials
The thermal insulation performance contributes to heat management for outdoor equipment.
- cable
- Other Connectors
- Wiring materials
Enhances the heat dissipation characteristics of the substrate, effective for thermal management inside the equipment.
- cable
- Other Connectors
- Wiring materials
Noise countermeasures for GPS bands (1.5GHz band) and EMS countermeasures for in-vehicle devices, as well as noise countermeasure components compatible with in-vehicle harnesses and high-speed communi...
- Other FA equipment
- others
- Ferrite Core
Waterproof connector that prevents the intrusion of oil, water, and dust from the power cord and cable entry points.
- Other Connectors
- Waterproof Connector
Rejitek, Mini LED adoption, supports local dimming, 240 zones, high brightness 1,500 cd/m², HDMI
- LCD display
Simplify cleaning and inspection! Provide exceptional signal integrity for high-performance applications.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
The cable side-exit design eliminates the need to consider the cable bending radius!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
A clock multiplier module that multiplies the input clock by N times and divides it by 1/D using a PLL to output the clock!
- Other electronic parts
Development of high-speed transmission networks is possible! Available with various optical interfaces.
- LAN/Optical cable
- cable
- Other cable related products
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.