List of Manufacturing and processing machinery products

  • classification:Manufacturing and processing machinery

541~585 item / All 99306 items

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We provide manufacturing technology for neutralization, esterification, sulfonation, phosphorylation, polycondensation reactions, powder mixing, emulsification, and dispersion, etc. *We can also handl...

  • Contract manufacturing

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Do you have any concerns about contract manufacturing of various chemical products?

We would like to introduce the contract manufacturing services provided by Riten Chemical Co., Ltd. We are a chemical manufacturer based in Kyoto with 70 years of experience. Since our establishment, we have been developing, manufacturing, and selling various surfactants used in the textile and paper industries. Based on the technology and development capabilities we have cultivated over the years, we accept contract manufacturing of various chemical products, so please feel free to contact us. 【Contract Manufacturing Achievements】 ■ Construction waterproofing agents ■ Plant growth promoters ■ Construction waterproofing materials ■ Greening-related agents ■ Chemicals for the electronics industry ■ Wastewater treatment agents ■ Industrial preservatives ■ Special surfactants... We provide more detailed information through related products and catalogs.

Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!

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  • Glass

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This is an annealing furnace manufactured by Unitemp Japan, applicable to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN.

  • Soldering Equipment
  • Heating device

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This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. 【Testable】

  • Soldering Equipment
  • Heating device

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Metal-compatible tags that can also be printed and encoded! High-performance label tags developed for the metal surfaces of everyday items and industrial products.

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  • IC tag
  • label
  • Special labels, etc.

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We have achieved continuous welding of CFRTP, which was difficult with conventional technology, through our unique ultrasonic welding technology.

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  • Secondary Cells/Batteries
  • Plastic processing machines (cutting and rolling)

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Introduction to Ultrasonic Application Devices / Welding, Joining, and Cutting Methods [Online Seminar]

【Overview】 Date and Time: September 25 (Friday) 10:00 AM - 11:00 AM (Registration starts at 9:30 AM) Theme: Introduction to Adwells' Ultrasonic Application Devices / Welding, Joining, and Cutting Techniques Content: - Welding: A new technology for continuously welding CFRTP using ultrasonic waves. We will introduce applicable applications including processing examples and existing methods. - Joining: We will present technologies that solve challenges in metal joining for product development. - Cutting: We propose ultrasonic cutting for high-precision cutting of high-performance materials. It can cut rubber, resin, green sheets, etc., with high precision and without dragging burrs. - Seminar Participation Registration URL: https://www.nissei.co.jp/machinery - Product Overview Introduction Pages Ultrasonic Joining Device: http://ma.imsys.jp/r/1272880?m=0000&c=00000000 Ultrasonic Welding Device: http://ma.imsys.jp/r/1272879?m=0000&c=00000000 Ultrasonic Cutter: http://ma.imsys.jp/r/1272881?m=0000&c=00000000

A lineup of top-class inkjet coating equipment! Complete with demonstrations of inkjet coating devices and a well-equipped coating test environment.

  • Painting Machine

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Non-contact lead-free soldering laser unit compatible with fine thermal control resin bonding.

  • Soldering Equipment

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High-speed Die Bonder compatible with micro and thin chips!

  • Printed Circuit Board
  • Substrate transport device (loader/unloader)

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A new microball system that meets individual piece needs! Reduces ball consumption.

  • Circuit board processing machine

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The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!

  • Tester

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It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!

  • Tester

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Achieves high-speed and stable solder ball mounting with a unique solder ball mounting method!

  • Mounter

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Features stable solder ball mounting and improves productivity through an inline system.

  • Other semiconductor manufacturing equipment

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Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.

  • Semiconductor inspection/test equipment

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Freeze-drying of fine particles is possible! Testing available for cosmetics, microorganisms, regenerative medicine, and more.

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  • Other machine tools

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We are currently conducting test drying for customers considering the introduction of freeze-drying equipment!

  • Other food machinery

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A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

  • High pressure cleaner
  • Other semiconductor manufacturing equipment
  • Resist Device

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

  • Other semiconductor manufacturing equipment

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.

  • Wafer processing/polishing equipment

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It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

  • Bonding Equipment

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Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.

  • Other semiconductor manufacturing equipment

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Notice of Participation in "Semicon Japan 2018"

We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009

A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.

  • Other semiconductor manufacturing equipment

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300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.

  • Soldering Equipment
  • Reflow Equipment

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Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.

  • Soldering Equipment
  • Reflow Equipment

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Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

  • Soldering Equipment
  • Reflow Equipment

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This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. Manufactured by Unitemp Japan.

  • Soldering Equipment
  • Heating device

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A Comprehensive Explanation of the Benefits and Applications of Formic Acid Reduction (Manufactured by Unitec Japan)

  • Annealing furnace

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Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

  • Ultrasonic Oscillator
  • Other cutting tools
  • Other processing machines

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

Manual flip chip bonder suitable for small-scale production and various experiments.

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  • Bonding Equipment

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Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.

  • Printed Circuit Board
  • LCD display
  • Other semiconductor manufacturing equipment

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A rich lineup is available! Demonstrations of inkjet coating equipment and a well-equipped coating test environment are provided.

  • Painting Machine
  • Other surface treatment equipment

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Before considering or purchasing inkjet evaluation machines and mass production equipment, for those who wish to conduct a test once, and for customers who have been evaluated by other companies but w...

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  • Processing Contract
  • Other contract services

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Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.

  • Assembly Machine
  • Other semiconductor manufacturing equipment

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The blue light blue laser is changing the world of soldering! The "BLES system" achieves soldering without flux, which has been difficult until now.

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  • Soldering Equipment

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Lasers can be selected from three types: CO2, YVO4, and UV, depending on the application! Equipped with a 3D laser marker that can mark large areas with high quality.

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  • Laser marker

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By conducting a complete visual inspection of the chips before implementation, we can reduce losses in subsequent processes and improve yield! Ideal for acceptance inspection and screening in module a...

  • Semiconductor inspection/test equipment

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A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.

  • Other semiconductor manufacturing equipment

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Coating functional ink on wafers, sheets, glass, resin substrates, etc.!

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  • Painting Machine

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Reliable solder ball repairs are performed by a repair unit that has accumulated unique image processing and proven results.

  • Semiconductor inspection/test equipment

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Contributes to improving the durability of infrastructure facilities. Effectively removes foreign substances.

  • Other mounting machines
  • Piping Materials
  • Other powder equipment

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We will strongly eliminate foreign substances in the manufacturing of daily necessities and protect quality.

  • Other mounting machines
  • Piping Materials
  • Other powder equipment

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We will strongly remove foreign substances from agricultural materials to protect product quality.

  • Other mounting machines
  • Piping Materials
  • Other powder equipment

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Strongly eliminate foreign matter contamination in the manufacturing of medical devices.

  • Other mounting machines
  • Piping Materials
  • Other powder equipment

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Protecting the quality of home appliances! Strongly removing foreign substances.

  • Other mounting machines
  • Piping Materials
  • Other powder equipment

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Strongly remove foreign matter contamination in packaging material manufacturing.

  • Other mounting machines
  • Piping Materials
  • Other powder equipment

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Protecting toy safety! Strongly removing foreign substances.

  • Other mounting machines
  • Piping Materials
  • Other powder equipment

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