Manufacturing and processing machineryの製品一覧
- 分類:Manufacturing and processing machinery
271~315 件を表示 / 全 99252 件
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
<Column demonstration in progress> Analyzing aggregate and drug-antibody ratio (DAR) using SEC column and HIC column.
- Chromatographic resins and packing materials
We have launched a video distribution site for pharmaceutical companies.
We are distributing topics that are particularly noteworthy in the biopharmaceutical industry in an on-demand video format. We will regularly update the latest videos, so please take this opportunity to watch them. 【Register to view here】 *Please copy the URL and watch it in your browser. https://portal.stream.jp/eqk212ojxt
The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!
- Tester
It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!
- Tester
Achieves high-speed and stable solder ball mounting with a unique solder ball mounting method!
- Mounter
Features stable solder ball mounting and improves productivity through an inline system.
- Other semiconductor manufacturing equipment
Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.
- Semiconductor inspection/test equipment
Freeze-drying of fine particles is possible! Testing available for cosmetics, microorganisms, regenerative medicine, and more.
- Other machine tools
We are currently conducting test drying for customers considering the introduction of freeze-drying equipment!
- Other food machinery
A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].
- High pressure cleaner
- Other semiconductor manufacturing equipment
- Resist Device
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).
- Other semiconductor manufacturing equipment
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
- Bonding Equipment
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
- Other semiconductor manufacturing equipment
Notice of Participation in "Semicon Japan 2018"
We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.
- Soldering Equipment
- Reflow Equipment
Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.
- Soldering Equipment
- Reflow Equipment
Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.
- Soldering Equipment
- Reflow Equipment
This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. Manufactured by Unitemp Japan.
- Soldering Equipment
- Heating device
A Comprehensive Explanation of the Benefits and Applications of Formic Acid Reduction (Manufactured by Unitec Japan)
- Annealing furnace
Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!
- Ultrasonic Oscillator
- Other cutting tools
- Other processing machines
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Manual flip chip bonder suitable for small-scale production and various experiments.
- Bonding Equipment
Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.
- Printed Circuit Board
- LCD display
- Other semiconductor manufacturing equipment
A rich lineup is available! Demonstrations of inkjet coating equipment and a well-equipped coating test environment are provided.
- Painting Machine
- Other surface treatment equipment
Before considering or purchasing inkjet evaluation machines and mass production equipment, for those who wish to conduct a test once, and for customers who have been evaluated by other companies but w...
- Processing Contract
- Other contract services
Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.
- Assembly Machine
- Other semiconductor manufacturing equipment
The blue light blue laser is changing the world of soldering! The "BLES system" achieves soldering without flux, which has been difficult until now.
- Soldering Equipment
Lasers can be selected from three types: CO2, YVO4, and UV, depending on the application! Equipped with a 3D laser marker that can mark large areas with high quality.
- Laser marker
By conducting a complete visual inspection of the chips before implementation, we can reduce losses in subsequent processes and improve yield! Ideal for acceptance inspection and screening in module a...
- Semiconductor inspection/test equipment
A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Coating functional ink on wafers, sheets, glass, resin substrates, etc.!
- Painting Machine
Reliable solder ball repairs are performed by a repair unit that has accumulated unique image processing and proven results.
- Semiconductor inspection/test equipment
Contributes to improving the durability of infrastructure facilities. Effectively removes foreign substances.
- Other mounting machines
- Piping Materials
- Other powder equipment
We will strongly eliminate foreign substances in the manufacturing of daily necessities and protect quality.
- Other mounting machines
- Piping Materials
- Other powder equipment
We will strongly remove foreign substances from agricultural materials to protect product quality.
- Other mounting machines
- Piping Materials
- Other powder equipment
Strongly eliminate foreign matter contamination in the manufacturing of medical devices.
- Other mounting machines
- Piping Materials
- Other powder equipment
Protecting the quality of home appliances! Strongly removing foreign substances.
- Other mounting machines
- Piping Materials
- Other powder equipment
Strongly remove foreign matter contamination in packaging material manufacturing.
- Other mounting machines
- Piping Materials
- Other powder equipment
Protecting toy safety! Strongly removing foreign substances.
- Other mounting machines
- Piping Materials
- Other powder equipment
Strongly remove foreign substances in the manufacturing process of cosmetics.
- Other mounting machines
- Piping Materials
- Other powder equipment
Contributes to improving the yield of electronic components. Effectively removes foreign substances.
- Other mounting machines
- Piping Materials
- Other powder equipment
Protecting the quality of automotive parts! Strongly removing foreign substances.
- Other mounting machines
- Piping Materials
- Other powder equipment
We strongly eliminate foreign matter contamination in pharmaceutical manufacturing to ensure quality.
- Other mounting machines
- Piping Materials
- Other powder equipment
Strongly remove foreign substances in food manufacturing and improve product safety.
- Other mounting machines
- Piping Materials
- Other powder equipment
A large stock of phosphor bronze round bars ideal for connectors and electrical contacts!
- Non-ferrous metals
- Processing Contract