List of Electronic Components products

  • classification:Electronic Components

4861~4905 item / All 26388 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

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  • Other safety and hygiene products

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The standard heat dissipation plate is made of aluminum measuring 160×160×3mm! The return spring torque is 0.0165 to 0.024 N·m.

  • Solenoid Actuators

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The total weight (X3・4・8・9) is approximately 250g. The standard heat sink is 190×190×3mm aluminum.

  • Solenoid Actuators

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The standard heat dissipation plate is made of aluminum measuring 190×190×3mm! The return spring torque is 0.026 to 0.035 N·m.

  • Solenoid Actuators

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The total weight (X3・4・8・9) is approximately 1,013g. The standard heat sink is 390×390×3mm aluminum.

  • Solenoid Actuators

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The standard heat dissipation plate is made of aluminum measuring 520×520×3mm! The return spring torque ranges from 0.09 to 0.14 N·m.

  • Solenoid Actuators

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The standard heat dissipation plate is made of aluminum measuring 90×90×3mm! The return spring torque is 0.0055 to 0.009 N·m.

  • Solenoid Actuators

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The total weight (X3·4·8·9) is approximately 97g. The standard heat sink is 120×120×3mm aluminum.

  • Solenoid Actuators

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The total weight (X3·4·8·9) is approximately 506g. The standard heat sink is 310×310×3mm aluminum.

  • Solenoid Actuators

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The standard heat dissipation plate is made of aluminum measuring 310×310×3mm! The return spring torque is 0.045 to 0.065 N·m.

  • Solenoid Actuators

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The total weight (X3·4·8·9) is approximately 3,056g. The standard heat sink is 520×520×3mm aluminum.

  • Solenoid Actuators

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No setup required! DALI switch ready to use Minimum configuration (1) DALI BUS (2) Switch (3) DALI-2 lighting fixtures can be dimmed.

  • Other lighting equipment
  • Piezoelectric Devices
  • LED lighting

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Outsourcing the entire process up to product delivery. Automation is possible even for high-difficulty mass production lines, such as high-speed production of tiny components.

  • Other electronic parts
  • Contract manufacturing

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We handle a wide range of terminals for electronic components made primarily from materials with a thickness of 30μm to 1.6mm.

  • Other electronic parts
  • Contract manufacturing

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Terminals for electronic components and electronic device assemblies! Contributing to the development of industries and culture in Japan and around the world.

  • Contract manufacturing
  • Other electronic parts
  • Connector Terminal Block

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Creative ingenuity and quality assurance in manufacturing that meets everyone's trust.

  • Hydraulic Equipment
  • Other electronic parts
  • Processing Contract

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Total manufacturer of hydraulic and motor control machinery, peripheral devices for robot control, and conveying equipment.

  • Hydraulic Equipment
  • Other electronic parts
  • Processing Contract

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Providing high-quality press-processed products with a low defect rate! 100% in-house mold design.

  • Other electronic parts

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Druck TERPS: Innovative vacuum pressure measurement technology supporting the semiconductor industry.

Overview and Features of TERPS • High Precision and Stability: Achieves a precision of ±0.01%FS and long-term stability of less than 0.01%FS per year, with temperature sensitivity significantly reduced through multi-point compensation. • Wide Measurement Range: Covers commonly used ranges from medium vacuum to atmospheric pressure for vacuum applications, providing a continuous measurement range from 10Pa to atmospheric pressure. • Excellent Linearity: Demonstrates very good linearity even in low-pressure regions, with positive/negative offset amounts stable at 21-23Pa in the range of 1Pa to 1000Pa. • Low Hysteresis: The single crystal silicon resonant beam exhibits negligible hysteresis in the range of 0 to 100Pa, providing high stability and reliability even in ultra-low pressure areas. • Robust Operating Temperature Range: Supports operating temperatures from -55℃ to 125℃. • High Media Compatibility: Depending on the measurement medium, options include direct exposure silicon elements, 316L stainless steel isolation diaphragms, or Hastelloy C276 specifications. • Easy System Integration: Compatible with frequency output or digital output (RS232/RS485, CANBus, USB), facilitating easy system integration.

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Cover.png

Druck TERPS: Innovative vacuum pressure measurement technology supporting the semiconductor industry.

Overview and Features of TERPS • High Precision and Stability: Achieves a precision of ±0.01%FS and long-term stability of less than 0.01%FS per year, with temperature sensitivity significantly reduced through multi-point compensation. • Wide Measurement Range: Covers commonly used ranges from medium vacuum to atmospheric pressure for vacuum applications, providing a continuous measurement range from 10Pa to atmospheric pressure. • Excellent Linearity: Demonstrates very good linearity even in low-pressure regions, with positive/negative offset amounts stable at 21-23Pa in the range of 1Pa to 1000Pa. • Low Hysteresis: The single crystal silicon resonant beam exhibits negligible hysteresis in the range of 0 to 100Pa, providing high stability and reliability even in ultra-low pressure areas. • Robust Operating Temperature Range: Supports operating temperatures from -55℃ to 125℃. • High Media Compatibility: Depending on the measurement medium, options include direct exposure silicon elements, 316L stainless steel isolation diaphragms, or Hastelloy C276 specifications. • Easy System Integration: Compatible with frequency output or digital output (RS232/RS485, CANBus, USB), facilitating easy system integration.

The "CHRocodile 2 IT sensor" can measure the thickness of wafers during work processing.

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  • Sensors

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Semicon Japan 2024

We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor

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