List of Semiconductor Manufacturing Equipment products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.

• Other machine tools

H2 (Surface cleaning of various substrates using the reducing power of hydrogen plasma. Improved hydrophilicity and wettability due to the removal of surface oxide layers. A new surface cleaning techn...

• Ashing device
• Plasma surface treatment equipment
• Other surface treatment equipment

A rich lineup is available! Introducing electron beam deposition applicable to the deposition of organic molecules.

• Evaporation Equipment
• Other machine elements

Mass production manufacturing / lathe processing / mass production lathe processing

• Other semiconductor manufacturing equipment

The dedicated arm and small-diameter contact wheel allow for grinding on curved surfaces, curves, and concave areas!

• Wafer processing/polishing equipment

Equipped with a powerful motor, heavy grinding tasks such as spout grinding are easy and speedy!

• Wafer processing/polishing equipment

Can be mounted on a standard lathe! Recommended for grinding, polishing, and finishing small parts.

• Wafer processing/polishing equipment

Wheel type! Capable of scratch removal, primary removal, and welding bead grinding, etc.

• Wafer processing/polishing equipment

Available for use in applications such as scratch removal, bridges, shipbuilding, and construction! Wheel type focused on polishing and grinding tasks.

• Wafer processing/polishing equipment

Order-made machine that can be used for producing rolled steel, H-beams, and inner and outer surface beads of large-diameter steel pipes.

• Wafer processing/polishing equipment

Use case; EV battery development (online measurement of generated hydrogen) hydrogen jet turbine, ships. FC evaluation equipment, insulating oil, forklifts, nuclear power.

• Other process controls
• Analytical Equipment and Devices
• Annealing furnace

Reduction of working hours and labor-saving, standardization of work! Made-to-order machines equipped with standard dust covers.

• Wafer processing/polishing equipment

Width 1000 × Height 1200 × Depth 1600 mm! Wheel centerless custom production machine.

• Wafer processing/polishing equipment

Lightweight and easy to operate, effortlessly polish complex shapes! High-speed polishing also improves work efficiency.

• Wafer processing/polishing equipment

An excellent vision system equipped with continuous zoom magnification! A twin dicing device with two touch screens.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

This is a copper plate for low-temperature devices made of C1020, used in low-temperature environments.

• Sputtering Equipment
• Other semiconductor manufacturing equipment

This is an example of a heat sink that has been gold-plated.

• Sputtering Equipment

It is a backing plate used in a film-forming device.

• Sputtering Equipment
• Other semiconductor manufacturing equipment

No need for pre-sputtering aimed at preventing oxidation films, allowing for a reduction in labor! This is a sputtering target that also minimizes cracking due to thermal expansion.

• Sputtering Equipment

No more inefficient saw cutting machines! Please consider using our system at least once.

• Plastic processing machines (cutting and rolling)
• Wafer processing/polishing equipment

Why introduce the insulation material "Silsaam"? Here are its benefits explained.

• CVD Equipment
• Industrial Furnace
• Annealing furnace

With abundant experience and skilled craftsmanship, we will meet your company's needs.

• Other semiconductor manufacturing equipment

UV-Uniform(TM) uses a relatively small amount of UV-LEDs and can achieve uniform irradiance over an area of approximately φ80mm.

• Analytical Equipment and Devices
• Other semiconductor manufacturing equipment
• LED Module

【Product demo available】Paper size is φ150mm! It is compact and lightweight at 730g, has a long lifespan, and is easy to maintain.

• Wafer processing/polishing equipment
• Other machine elements

【Product demo available】Low failure rate and long lifespan, plus easy maintenance! Easy to operate and does not cause fatigue even with long hours of use.

• Wafer processing/polishing equipment
• Other machine elements

[Product demo available] Achieving high efficiency, durability, and flat grinding capability! A new mechanism has been adopted in the pad support section.

• Wafer processing/polishing equipment
• Other machine elements

Supports high-precision stacked packages such as NAND flash.

• Bonding Equipment

Ideal for bonding small pin ICs such as QFN.

• Bonding Equipment

Ideal for handling all types of LED packages.

• Other semiconductor manufacturing equipment

Ideal for bonding small pin ICs such as QFN.

• Other semiconductors
• Bonding Equipment

It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.

• Bonding Equipment

Annealing of various materials is possible with far infrared rays! It can accommodate complex shapes and different material compositions.

• Other machine elements
• Annealing furnace

We will introduce a case study that addresses the issue of "inspection after cleaning"!

• Other cleaning machines
• Other physicochemical equipment
• Photomask

We will introduce a case study that addresses the issue of "managing the aging deterioration of tension"!

• Other cleaning machines
• Other physicochemical equipment
• Photomask

Guaranteed precision at the micron level for processing tolerances. Comprehensive support from material procurement to surface treatment and assembly. We have a track record of transactions with major...

• Other semiconductor manufacturing equipment
• Processing Contract
• Surface treatment contract service

Detailed information on the assembly and bonding of multi-emitter modules.

• Other semiconductor manufacturing equipment

Detailed information on laser-assisted die bonding.

• Other semiconductor manufacturing equipment

Detailed information on the assembly of VCSELs and photodiodes.

• Other semiconductor manufacturing equipment

Detailed information on hot pressing bonding.

• Other semiconductor manufacturing equipment

We manufacture small, low-cost, and short-delivery roll-to-roll devices for die, gravure, and roll coating. Testing coating is available.

• Other polymer materials
• Coater
• Secondary Cells/Batteries

It is small, has a uniform film thickness, and can be coated. It is ideal for prototyping.

• Secondary Cells/Batteries
• Coater
• Other polymer materials

Ideal for prototypes! Compatible with small sizes! We provide suitable coaters with a variety of application methods in a short delivery time. We also showcase our production achievements.

• Coater
• Secondary Cells/Batteries
• Other polymer materials

We will create a coater tailored to your needs, including size, application method, tension control, and options! *Introducing past production case materials.

• Coater

Successfully achieved wafer bumping with a 180μm pitch! Established a mass production line using screen printing.

• Printing Machinery
• Other mounting machines
• Other semiconductor manufacturing equipment

Technical Handbook Giveaway! Introducing advantages of types, comparisons with other products, quality, implementation effects, and more.

• Other semiconductor manufacturing equipment

Like production silicon wafers, it is effective simply by being transported automatically.

• Other semiconductor manufacturing equipment