Leave the machining of various large sputtering targets such as silver, copper (6N), and tin (6N) to us!
Our "gantry machining center" equipment has a gate width of 2100mm, allowing for the processing of large sputtering targets for semiconductors (over Φ660mm) and for LCD manufacturing (up to 2000x4000mm). Additionally, it features NC control with multi-axis AI correction capabilities, ensuring high repeatability and enabling the use of 3D measurement functions on the machine to guarantee the precision of processed products for all units. It is suitable for processing lots of approximately 1000 pieces per month. Furthermore, we have built a track record of processing various materials such as tin, aluminum, and copper in collaboration with multiple partner factories. 【Examples of Implementation】 ■ Silver sputtering target cutting processing ■ Copper sputtering target cutting processing (6N) ■ Tin sputtering target cutting processing (6N) - All measurement data attached - Mass production support - Degreasing, packaging, and nationwide transportation support *For more details, please visit our website or feel free to contact us.
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basic information
【Equipment and Systems】 【Machining Equipment】 ■ Gantry Machining Center: 2000mm×4000mm (Okuma) Main spindle 6000rpm ■ Gantry Machining Center: 2000mm×3000mm (Okuma) Main spindle 6000rpm ■ Gantry Machining Center: 1600mm×3000mm (Okuma) ■ Planomiller: 2500mm×4000mm (Mone) ■ Combined Planer: 2300mm×6000mm (Marufuku) ■ Horizontal Boring Machine: BFT-11C (Toshiba) ■ Radial Drill: 1600mm (Okuma) ■ Surface Grinding Machine: 500mm×700mm (Nagase) 【CAD/CAM】 ・2D naska ・3D go2cam ・3D cimatron 【Measuring Instruments】 ・Image Dimension Measuring Instrument KEYENCE IM7500
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Applications/Examples of results
■Possible production size: 2000mm x 4000mm ■Processing achievements □ High purity sputtering target materials Copper (Cu) ~ 6N Tin (Sn) ~ 6N □ Sputtering target materials Silver (Ag) Copper (Cu) ~ φ660mm Tin (Sn) Molybdenum (Mo) Zinc (Zn) Aluminum (AL) Titanium (Ti) Hastelloy Inconel ■Special support for sputtering target materials Heat treatment Distortion correction Dry cutting and grinding (without cutting oil or grinding oil) Surface roughness measurement Corrosion prevention measures Non-contact measurement Laser engraving (individual numbering, etc.) Establishment of product traceability based on measurement data High-efficiency chip recovery Degreasing Planning of packaging and delivery methods considering scratches, abrasions, etc. during transportation ■Traceability Non-contact measuring instrument: KEYENCE IM-7500 Our company measures "high purity (up to 6N)" sputtering target materials completely non-contact. We thoroughly eliminate potential scratches, dents, rust, etc. that may occur during measurement. We provide delivery with traceability such as "full measurement" and "data attachment" using a program-controlled image dimension measuring instrument.
Detailed information
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Mass production processing of large sputtering targets - For semiconductors (Φ660mm or larger) - For LCDs and FPDs (2000 x 4000mm) We are equipped with multiple gantry machining centers and perform medium-volume processing of large sputtering targets. Additionally, due to the NC control and multi-axis AI correction function, we achieve high repeatability and ensure precision guarantee and traceability of processed products using 3D measurement functions on the machine tools. ■ Improvement of chip recovery rate By dedicating the processing machines, we have improved the chip recovery rate for precious metal sputtering target materials and high-purity sputtering target materials. □ High-purity sputtering target materials - Copper (Cu) up to 6N - Tin (Sn) up to 6N □ Precious metal sputtering target materials - Silver (Ag)
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Company information
Saitama Planer Industry Co., Ltd. was established as a metal processing company specializing in the finishing of castings. It started with planer processing of SS400 and S45C, which are the basics of cutting, and has now expanded its processing capabilities to various metals such as copper, tin, Hastelloy, Inconel, and SUS304 using gantry machining centers. We specialize in precision processing of bases (pedestals) for machine tools and paper-making machines, as well as large components used in them, semiconductor materials, and parts for LCD manufacturing equipment.
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