List of Mounting Machine products

  • classification:Mounting Machine

1936~1980 item / All 2092 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

  • PRエリア.png
  • Other conveying machines

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Work can be done in narrow spaces, and with commercially available spanners and monkey wrenches! A highly convenient screw joint that minimizes tightening scratches.

  • Pipe Fittings
  • Piping Materials
  • valve

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A catalog of units suitable for supplying tiny and fine parts, as well as for conveying and aligning them, is available for free download!

  • Substrate transport device (loader/unloader)

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Processing capability: Fastest 0.075 seconds per unit, equipped with a 10-inch touch panel.

  • Taping Machine

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Perform various inspections and processes on the sub-index, automatically ejecting defective parts.

  • Taping Machine

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[Cost Performance Model] Compatible with Lens Type LEDs as well.

  • Taping Machine

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[Cost Performance Model] Processing capability achieves the fastest 0.1 seconds per unit.

  • Taping Machine

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This is a comprehensive catalog featuring a wide range of products, including semiconductor transport robots and aligners.

  • Substrate transport device (loader/unloader)
  • Transport and handling robots

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Rework for mobile devices!!

  • Soldering Equipment

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Compact space-saving tabletop ACF bonding device.

  • Circuit board processing machine
  • Other mounting machines

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Leave the delivery robots to JEL, with their proven track record and high quality.

  • Transport and handling robots
  • Substrate transport device (loader/unloader)

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Removal of BGA (CSP) without thermal load!!

  • Special Processing Machinery
  • Soldering Equipment

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This is an introduction to embossed carrier tape, taping machines, and LED sorting machines.

  • Other electronic parts
  • Analytical Equipment and Devices
  • Taping Machine

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Water-based ECO stencil cleaner

  • detergent
  • Cleaning agents
  • Soldering Equipment

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Improvement of precision in the consistent assembly production line. We will enhance the main equipment.

  • Other mounting machines

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The grip can be used permanently!

  • Circuit board processing machine
  • Other consumables

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Optimal for reducing defect rates and improving productivity on the implementation line!

  • Other image-related equipment
  • Visual Inspection Equipment
  • Substrate transport device (loader/unloader)

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Launched the compact and low-cost UV-LED irradiation device (ultraviolet irradiator) ULEDN-102CT series.

  • Other optical parts
  • Other mounting machines

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Introduced a processing machine equipped with IFRIT (Ifrit) from Cyber Laser Co. It enables high-precision micro-machining of difficult-to-process materials and achieves reduced friction.

  • Circuit board processing machine
  • Other processing machines
  • Processing Contract

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It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.

  • Vacuum Equipment
  • Wafer processing/polishing equipment
  • Reflow Equipment

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Air-free, hassle-free laminator

  • Other semiconductor manufacturing equipment
  • Circuit board processing machine
  • Vacuum Packaging Machine

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A fine coating device using a screw method. It has become possible to apply fine coatings of high-viscosity materials using a ceramic nozzle.

  • Soldering Equipment
  • Other semiconductor manufacturing equipment
  • LED Module

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Manual tape mounter is a tape application machine that combines a wafer mounter and a wafer laminator.

  • Mounter
  • Other semiconductor manufacturing equipment

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The dust prevention measures are different from previous exposure devices!

  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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Construction of implementation facilities tailored to various customer needs.

  • Other mounting machines
  • Other services

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Valve seat press-fitting device for simultaneously press-fitting the valve seat ring and valve guide.

  • Other machine tools
  • Soldering Equipment
  • Fuel system parts

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It is a high-frequency induction heating device for brazing the chip part and shank part of a gun drill.

  • Other machine tools
  • Soldering Equipment
  • Fuel system parts

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This is a brazing heating device that allows anyone to perform brazing using high-frequency heating.

  • Other machine tools
  • Soldering Equipment
  • Fuel system parts

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This is a sprocket hardening and tempering device that utilizes induction heating by high frequency.

  • Other machine tools
  • Soldering Equipment
  • Fuel system parts

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High-frequency soldering heating device.

  • Other machine tools
  • Soldering Equipment
  • Fuel system parts

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Processing technology that allows flexible responses tailored to customer needs, from a single prototype to mass production.

  • Circuit board processing machine

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It is possible to design a taping device optimized for the user!

  • Taping Machine

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It is capable and easy to use. There are few troubles and maintenance costs are low. AGH seed spraying machine.

  • Other mounting machines

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Seed blowing and dual use. Few troubles and low maintenance costs. AGD, AGPM soil-blowing machines.

  • Other mounting machines

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For greening substrate materials and chip materials. Available for supply with shovels or precast.

  • Other mounting machines

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High performance, high safety, excellent mobility, low running costs, AG-150II.

  • Other mounting machines

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A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 12-inch wafers, providing supply of wafer frames and frame mounting.

  • Other painting machines
  • Mounter

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This laminator supports wafers from 4 inches to 8 inches, has a compact design that can be placed on a tabletop, and is easy to operate even for beginners.

  • Other painting machines
  • Mounter

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Space reduction of 35% (compared to our company)! The inspection device is built into the main unit, allowing operations to be performed on the same control screen!

  • Other mounting machines

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High-performance flip chip bonder for multi-variety cell production lines.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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Tabletop semi-automatic machine for cell production purposes

  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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Tabletop semi-automatic machine for cell production with automatic ACF attachment.

  • Circuit board processing machine

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Elimination of coating unevenness and nozzle clogging with a unique nozzle.

  • spray
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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IC bonding device

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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Tabletop semi-automatic machine for cell production use.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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High-density plasma is generated over a large area by a unique reactor head!

  • Plasma surface treatment equipment
  • Molding Equipment
  • Circuit board processing machine

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air_plasma10_1(小).jpg

Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.

Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/

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