List of Semiconductors and ICs products
- classification：Semiconductors and ICs
541～585 item / All 4596 items
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
Analysis of gas flow under low pressure conditions; analysis software compatible with rarefied gases (rarefied fluids).
- Vacuum pump
- Vacuum Equipment
- Wafer
July 3 (Wed) - July 5 (Fri) [Exhibition Participation] Announcement of ISSP2024 Corporate Exhibition Corner Participation
The International Symposium on Sputtering and Plasma Processes 2024 (ISSP2024) will be held from July 3 (Wednesday) to July 5 (Friday), 2024, organized by the Surface Vacuum Society. Our company will be exhibiting at the corporate exhibition corner. ■ Exhibition Homepage https://www.issp-jvss.org/ ISSP is an international exhibition focused on sputtering and plasma process technology. This will be the first event in five years since ISSP2019 was held in 2019. Please be sure to stop by our exhibition corner. We will also be holding consultation sessions with our technical staff and demonstrating our developed software, such as Particle-PLUS and DSMC-Neutrals!! We sincerely look forward to your visit.
High-performance heat sink suitable for forced air cooling (rivet type) W300mm x H83.5mm
- Other semiconductors
W15 mm x H25 mm Transistor clip compatible aluminum heat sink
- Other semiconductors
Aluminum heat sink for board mounting that can secure a transistor without screws (W20 mm x H50 mm)
- Other semiconductors
Bending processing tailored to usage is also available! It is also possible to combine various functional materials for punching processing.
- Other semiconductors
- Processing Contract
Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W165mm x H84mm
- Other semiconductors
Width 47.8mm Height 33mm Length 50mm Extruded heat sink for PCB mounting Compatible with transistor clips
- Other semiconductors
Aluminum heat sink for mounting on a board, capable of securing a transistor with a clip, measuring 35 mm wide x 30 mm high.
- Other semiconductors
Aluminum heat sink for mounting on a circuit board, capable of securing a transistor with a clip, dimensions 46 mm wide x 33 mm high.
- Other semiconductors
You can arrange and secure two transistors to the heat sink.
- Other semiconductors
You can arrange and secure three transistors to the heat sink.
- Other semiconductors
Modular capacitive displacement sensor Easy connection with Ethernet interface!
- Other semiconductors
- Testing Equipment and Devices
A system that makes everything possible with just one device.
- Circuit Board Inspection Equipment
- Wafer
- Testing Equipment and Devices
If you're looking for industrial flash memory, choose the large-capacity, low-cost industrial flash memory from UDInfo!
- Memory
Supporting the quality of power semiconductors from the downstream process.
- Other semiconductors
Industry-leading 32-bit MCU Renesas RA family
- Microcomputer
Based on years of experience in handling industrial memory, we deliver high-reliability flash memory at low prices!
- Memory
pSLC is a flash memory that combines three features: large capacity, high performance, and low cost!
- Memory
The pSLC technology achieves high performance by innovating control circuits based on MLC, which allows for miniaturization and high integration!
- Memory
We deliver high-performance flash memory with high reliability at a low price!
- Memory
A socket that can be used under the same conditions as implementation without soldering IC devices, "Solderless."
- Other semiconductors
- socket
Wiring correction connector and package conversion service
- Other semiconductors
Guaranteed 100 trillion write cycles! Achieving high-speed, low-power data logging for FA.
- Memory
Developed 8M-bit FeRAM that guarantees 100 trillion write cycles! Achieves high-speed operation and low power consumption.
- Memory
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
- Analytical Equipment and Devices
- Wafer
- Semiconductor inspection/test equipment
For medical devices and industrial PCs! pSLC is a flash memory that combines three features: large capacity, high performance, and low cost.
- Memory
Industrial and medical use! Excellent reliability and performance.
- Memory