List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
406～450 item / All 1022 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Work can be done in narrow spaces, and with commercially available spanners and monkey wrenches! A highly convenient screw joint that minimizes tightening scratches.
- Pipe Fittings
- Piping Materials
- valve
Samples for cross-sectional observation can be created precisely and easily! There is no need to touch or hold the samples directly by hand.
- Wafer processing/polishing equipment
- Other processing machines
Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.
- Wafer processing/polishing equipment
- CMP Equipment
- Other processing machines
A must-see for those struggling with precision and delivery deadlines! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces.
- Wafer processing/polishing equipment
[Newsletter Distribution] "Manufacturing Coating Heads for the Film, LCD, and Battery Industries" / OKD Corporation
A must-see for those struggling with precision and delivery times! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces for fine precision and smooth surfaces required for coating heads used in FDP and various film and battery manufacturing equipment. Materials such as SUS can be manufactured. We guarantee the requested precision through our processing technology. For delivery times, we can accept partial contracts for each process. For example, we can shorten the time by focusing only on polishing or only on machining! 【Precision List】 ■ Total Length: 4000mm or less ■ Tip Straightness: 0.001mm to 0.010mm or less ■ Inner Surface Flatness: 0.001mm to 0.010mm or less ■ Tip Surface Roughness: 0.1S or less ■ Inner Surface Roughness: 0.05S to 0.2S or less We are currently offering a document summarizing key points to check when requesting coating heads (die coaters)! *For more details, please contact us or download the catalog.
With wrapping processing technology, high-precision finishing is possible. It has low polishing drive power and features an energy-saving design that also considers the environment. [Exhibited at the ...
- Processing Contract
- Wafer processing/polishing equipment
- Other machine tools
Starting from January 23, it will be featured in a precision machining special!
If you are experiencing issues such as "the grinding machine cannot achieve flatness" or "the surface roughness cannot be cleared," please contact us directly. 【Features of Lapping Processing】 ○ Wet processing minimizes thermal distortion to the workpiece, resulting in less machining distortion. ○ Since the workpiece is processed without being chucked, it is less likely to introduce machining stress, leading to minimal changes in precision over time after processing. ○ Flatness that could not be achieved through turning, machining, or grinding can be attained with lapping processing. ○ By performing lapping on the reference surface before precision finishing processes (grinding, machining), high-performance finishing can be achieved.
We will introduce a case study of a customer who is facing the issue of grinding processing delivery times taking over a month!
- Wafer processing/polishing equipment
[Grinding Processing Case Studies] Grinding of carbide cutters from other companies and overseas is also possible.
We would like to introduce a case study that addresses the concerns of customers who are experiencing delivery times of over a month for grinding processing. ■Concern In previous transactions, when requesting grinding processing, the delivery time took over a month, and in urgent situations, it was not possible to meet deadlines, necessitating the maintenance of a larger inventory. Even then, when it was still not possible to meet deadlines, the only option was to stop the production line, which was problematic. ■Proposal Shortening the delivery time for grinding processing. ■Result Three days after sending the urgent grinding processing request, we were able to receive the items back, allowing us to quickly restore the halted production line. The inventory also improved to the minimum necessary quantity, making management easier. ■Case Summary - Issue: Delivery times were over a month, and when deadlines were missed, it was necessary to stop the production line. - Key points of the proposed service: Quick response tailored to the customer's needs.
![[Equipment Introduction] Deburring ...](https://image.mono.ipros.com/public/product/image/e65/2000872322/IPROS00930159113461217929.png?w=280&h=280){kind=small}
It is possible to uniformly grind large quantities of workpieces up to 1000mm wide! It excels in R chamfering processing.
- Other processing machines
- Wafer processing/polishing equipment
Automating polishing operations with robots. By combining a 3D camera and automatic path generation software, let the robot handle the polishing tasks!
- Wafer processing/polishing equipment
Exhibition at Cobot Expo Japan hosted by Universal Robots.
We plan to mainly exhibit a presentation of Nordbo products at the online exhibition "Cobot Expo Japan Autumn" hosted by Universal Robots.
Buff polishing of the inner surface of pipes is also possible! With our unique polishing machine and years of experience, we can appropriately respond to niche needs.
- Surface treatment contract service
- Other surface treatment equipment
- Wafer processing/polishing equipment
Uniformly polish a large number of fine parts at once! Adopted in various fields such as precision components and kitchen equipment.
- Surface treatment contract service
- Other surface treatment equipment
- Wafer processing/polishing equipment
A 12-inch compatible wafer expander using a motor drive system. Support for up to 8 inches is also available.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
An air cylinder is used for driving the extension stage. The simple design achieves maintenance-free operation.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
A wafer expansion device equipped with an auto-cut function that can reduce operator workload and improve production efficiency.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
Semi-automatic tabletop type wafer mounter for up to 8 inches.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
Manual wafer mount for pre-cut tape.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
Auto-lamination without bubbles under preset pasting conditions.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
A device that can accommodate both pre-cut tape and normal tape.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
A wide variety of diamond files, whetstones, and ceramic sharpening tools are featured!
- Hand polishing and filing
- Wafer processing/polishing equipment
- Other abrasives
Starting with research and development, a wide range of equipment selection is possible according to the purpose, up to semi-production applications.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
It is possible to perform uniform UV irradiation over the entire area of the wafer by rotating the work while irradiating.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Ultraviolet irradiation equipment
Double ring structure with inner ring and outer ring to maintain an expanded state.
- Wafer processing/polishing equipment
- Other machine elements
- Other semiconductor manufacturing equipment
Long lifespan with LED light source! Emits ultraviolet (UV) light at a wavelength of 365nm.
- Ultraviolet irradiation equipment
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
SEMICON TAIWAN 2012 (September 5 - September 7) Participation Confirmed
The fully automatic model of the UV curing device (UVC-300A) featuring next-generation technology that achieves energy savings and long lifespan will make its debut at an overseas exhibition, thanks to the cooperation of our distributors! In order to respond to the achievements and feedback received domestically, we must also reach out to international markets, which is why we will be exhibiting at "Semicon Taiwan 2012" to be held in September 2012. During the exhibition period, we will operate the device, so if you bring samples, we can conduct tests on the spot! Please come and see the capabilities of our LED light source UV irradiation technology at the venue!
It demonstrates sufficient curing performance (cured state, curing speed) compared to high-pressure mercury lamps and metal halide light sources.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Ultraviolet irradiation equipment
SEMICON TAIWAN 2012 (September 5 - September 7) Participation Confirmed
The fully automatic model of the UV curing device (UVC-300A) featuring next-generation technology that achieves energy savings and long lifespan will make its debut at an overseas exhibition, thanks to the cooperation of our distributors! In order to respond to the achievements and feedback received domestically, we must also reach out to international markets, which is why we will be exhibiting at "Semicon Taiwan 2012" to be held in September 2012. During the exhibition period, we will operate the device, so if you bring samples, we can conduct tests on the spot! Please come and see the capabilities of our LED light source UV irradiation technology at the venue!
A cleaning device designed for the precision cleaning of wafer cassettes, carriers, boxes, and other items used in the manufacturing process of high-end, high-value-added products.
- Other cleaning machines
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
A comprehensive lineup of particle sizes that can handle everything from "rough polishing" to "finishing" with blast processing! Automatic polishing is also possible. *Demo machine available.
- Wafer processing/polishing equipment
High-quality film polishing material ideal for mirror polishing, with a proven track record in precision polishing of automotive parts and optical fibers, produced safely and securely in Japan! Automa...
- Wafer processing/polishing equipment
Achieve energy savings and cost reduction with automatic polishing for long metal items and complex shapes, as well as polishing and fine burr removal to improve work efficiency! Demo machines availab...
- Wafer processing/polishing equipment
Achieve all materials from rough polishing to finishing polishing! Automatic polishing machines can also be customized to suit your needs!
- Wafer processing/polishing equipment
From grinding to painting! Primarily focusing on sheet metal, we accommodate various processes such as feather cloth, painting, and plating.
- Wafer processing/polishing equipment
A simple and effective hand tool to enhance the flexibility of FANUC collaborative robots CRX!
- Other industrial robots
- Wafer processing/polishing equipment
- Sensors
We have equipment such as cleaning devices and image dimension measuring instruments! We accept polishing processing of ceramics and other materials.
- Processing Contract
- Wafer processing/polishing equipment
Introducing a single-axis dicing saw with a maximum size of 9 inches by 12 inches and two configurations!
- Plastic processing machines (cutting and rolling)
- Other processing machines
- Wafer processing/polishing equipment
Ideal for line production due to its fixed base design! It performs the work of two sanders with one machine.
- Other processing machines
- Wafer processing/polishing equipment
- Other cutting tools
Ideal for line integration due to its fixed base design! Suitable for a wide range of applications from intermediate grinding to finishing paint polishing.
- Other processing machines
- Wafer processing/polishing equipment
The pass line is constant and suitable for lining! Equipped with a reverse prevention roll that prevents material rebound and improves safety.
- Other processing machines
- Wafer processing/polishing equipment
Each head can be raised and lowered independently! It enables efficient and high-precision processing from thickness regulation to finishing.
- Other processing machines
- Wafer processing/polishing equipment
- Other cutting tools
Ideal for polishing wooden materials such as furniture components and fittings! Easy operation with a color graphic control panel.
- Other processing machines
- Wafer processing/polishing equipment
Introducing the lineup of "SFC20 (dry type)" with a minimum processing length of 90mm, and the "SS series" metal surface grinding and polishing machines!
- Other processing machines
- Wafer processing/polishing equipment
Ideal for line integration due to its fixed base design! The sanding roll can be eccentrically adjusted using a ratchet handle.
- Other processing machines
- Wafer processing/polishing equipment
With One Pass, rough grinding to finishing polishing is possible! The thickness display device makes it easy to see the thickness settings at a glance.
- Other processing machines
- Wafer processing/polishing equipment
By controlling the "polishing droop" of the hole circumference, flat polishing can be achieved.
- Wafer processing/polishing equipment
Adoption of diamond electroplated rolls for grinding rolls significantly increases the lifespan of grinding tools and reduces setup time.
- Wafer processing/polishing equipment
A lineup of lens polishing machines that can accommodate various optical surfaces and interferometers that can measure flat shapes without being affected by the back surface.
- Wafer processing/polishing equipment
Highly versatile UV, green, and IR picosecond lasers: The new standard in picosecond micromachining.
- Wafer processing/polishing equipment
High-output UV and femtosecond lasers enable high-quality, high-precision processing of difficult materials at high speed.
- Wafer processing/polishing equipment
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By manufacturing pin gauges in-house, we achieve speed and high quality!
- Processing Contract
- Contract manufacturing
- Wafer processing/polishing equipment