List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
406～450 item / All 1052 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
From Φ600mm circular samples to polishing large panels.
- Wafer processing/polishing equipment
Developing cylindrical polishing for SiC, which is expected to be the next-generation power semiconductor!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Built-in 10 types of polishing/etching conditions suitable for various materials! Short polishing time and high reproducibility.
- Wafer processing/polishing equipment
- Etching Equipment
Leave the high-difficulty double-sided grinding processing to us.
- Wafer processing/polishing equipment
High-speed, high-efficiency grinding, long lifespan, good grinding efficiency, minimal damage to the work surface, and excellent surface finish.
- Grindstone
- Wafer processing/polishing equipment
- Grinding Machine
Multiple machine handling and automation of other processes with robots! We propose suitable robot implementation.
- Wafer processing/polishing equipment
Introducing our lineup of dedicated rod polishers and pipe polishers!
- Wafer processing/polishing equipment
Reduce the burden on operators! Equipped with a copying device, automatic return device for processed materials, and automatic pad device as standard.
- Other processing machines
- Wafer processing/polishing equipment
Adopting a special sanding roll! You can easily position it with a single touch by entering the desired dimensions.
- Other processing machines
- Wafer processing/polishing equipment
Automatic elevation during connection is also possible! A special air tension device that makes attaching and detaching the sanding belt and adjusting tension easy.
- Other processing machines
- Wafer processing/polishing equipment
Minimum processing thickness 0.2mm! Suitable for grinding materials like veneer, with a height-adjustable flat surface.
- Wafer processing/polishing equipment
- Other processing machines
Grinding of metals and non-ferrous metals without dust scattering! High-quality deburring is possible.
- Wafer processing/polishing equipment
- Grinding Machine
- Other processing machines
We have considered ease of use with a simple design that is necessary and minimal.
- Wafer processing/polishing equipment
A larger indoor space than the SMAP-II type! The workspace is more than three times larger, and both rough and finished work can be done with this one machine.
- Wafer processing/polishing equipment
Shortening processing time with overwhelming projection power! Capable of handling large workpieces that other models cannot.
- Wafer processing/polishing equipment
By adopting a pencil-type nozzle, it is possible to precisely process fine details!
- Wafer processing/polishing equipment
Successfully developed a movable nozzle that leverages the characteristics of SMAP media! It accommodates polishing for sizes that cannot be held by hand.
- Wafer processing/polishing equipment
It's an entry-level model, but it has high versatility! It can handle both rough and finished work with just this one machine.
- Wafer processing/polishing equipment
We perform ultra-high precision inner surface polishing processing for nozzle components of injection molding machines!
- Hand polishing and filing
- Wafer processing/polishing equipment
- Processing Contract
If it's about mold mirror polishing, leave it to us.
- Wafer processing/polishing equipment
Vibration is not transmitted to the hand, and safety is further enhanced with high efficiency from circuit optimization and heat protection features!
- Wafer processing/polishing equipment
- Ultrasonic Oscillator
From badge processing in small baskets to deburring of large parts, we manufacture a variety of automatic machines!
- Wafer processing/polishing equipment
A lineup of polishing equipment that can automatically perform everything from micro deburring to mirror polishing!
- Wafer processing/polishing equipment
The high-quality shine polished by artisans! The elevator belt has been widened and the spray volume has been doubled.
- Wafer processing/polishing equipment
"High-precision microfabrication" is a new method that achieves a balanced total of processing accuracy, productivity, compatible materials, and cost!
- Wafer processing/polishing equipment
Excellent burr removal performance! It cleansly removes small gaps and burrs.
- Wafer processing/polishing equipment
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Beautifully finished and improved design! Suitable for precision instruments and parts that require durability.
- Wafer processing/polishing equipment
The cross-section of electronic components is simple and finishes beautifully!!
- Wafer processing/polishing equipment
- Other abrasives
Interlock covers are also available! We have achieved further efficiency in polishing operations.
- Wafer processing/polishing equipment
- Other processing machines
Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.
- Wafer processing/polishing equipment
- Other processing machines
High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.
- Wafer processing/polishing equipment
- Other processing machines
We offer a wide range of products, including vacuum chuck holders and adhesive holders!
- Wafer processing/polishing equipment
- Other processing machines
- Other machine elements
High-precision and high-efficiency polishing technology! A comprehensive catalog of precision polishing equipment is available as a gift.
- Wafer processing/polishing equipment
We will introduce a wide variety of grinding wheels, from fixed abrasive wheels to free abrasive wheels and polishing cloths.
- CMP Equipment
- Wafer processing/polishing equipment
- Other processing machines
More economical than manually spraying diamond liquid onto the grinding wheel! Introducing the automatic spraying device.
- Wafer processing/polishing equipment
- Other processing machines
- Other physicochemical equipment
There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!
- Wafer processing/polishing equipment
- Other processing machines
Samples for cross-sectional observation can be created precisely and easily! There is no need to touch or hold the samples directly by hand.
- Wafer processing/polishing equipment
- Other processing machines
Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.
- Wafer processing/polishing equipment
- CMP Equipment
- Other processing machines
A must-see for those struggling with precision and delivery deadlines! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces.
- Wafer processing/polishing equipment
[Newsletter Distribution] "Manufacturing Coating Heads for the Film, LCD, and Battery Industries" / OKD Corporation
A must-see for those struggling with precision and delivery times! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces for fine precision and smooth surfaces required for coating heads used in FDP and various film and battery manufacturing equipment. Materials such as SUS can be manufactured. We guarantee the requested precision through our processing technology. For delivery times, we can accept partial contracts for each process. For example, we can shorten the time by focusing only on polishing or only on machining! 【Precision List】 ■ Total Length: 4000mm or less ■ Tip Straightness: 0.001mm to 0.010mm or less ■ Inner Surface Flatness: 0.001mm to 0.010mm or less ■ Tip Surface Roughness: 0.1S or less ■ Inner Surface Roughness: 0.05S to 0.2S or less We are currently offering a document summarizing key points to check when requesting coating heads (die coaters)! *For more details, please contact us or download the catalog.
With wrapping processing technology, high-precision finishing is possible. It has low polishing drive power and features an energy-saving design that also considers the environment. [Exhibited at the ...
- Processing Contract
- Wafer processing/polishing equipment
- Other machine tools
Starting from January 23, it will be featured in a precision machining special!
If you are experiencing issues such as "the grinding machine cannot achieve flatness" or "the surface roughness cannot be cleared," please contact us directly. 【Features of Lapping Processing】 ○ Wet processing minimizes thermal distortion to the workpiece, resulting in less machining distortion. ○ Since the workpiece is processed without being chucked, it is less likely to introduce machining stress, leading to minimal changes in precision over time after processing. ○ Flatness that could not be achieved through turning, machining, or grinding can be attained with lapping processing. ○ By performing lapping on the reference surface before precision finishing processes (grinding, machining), high-performance finishing can be achieved.
We will introduce a case study of a customer who is facing the issue of grinding processing delivery times taking over a month!
- Wafer processing/polishing equipment
[Grinding Processing Case Studies] Grinding of carbide cutters from other companies and overseas is also possible.
We would like to introduce a case study that addresses the concerns of customers who are experiencing delivery times of over a month for grinding processing. ■Concern In previous transactions, when requesting grinding processing, the delivery time took over a month, and in urgent situations, it was not possible to meet deadlines, necessitating the maintenance of a larger inventory. Even then, when it was still not possible to meet deadlines, the only option was to stop the production line, which was problematic. ■Proposal Shortening the delivery time for grinding processing. ■Result Three days after sending the urgent grinding processing request, we were able to receive the items back, allowing us to quickly restore the halted production line. The inventory also improved to the minimum necessary quantity, making management easier. ■Case Summary - Issue: Delivery times were over a month, and when deadlines were missed, it was necessary to stop the production line. - Key points of the proposed service: Quick response tailored to the customer's needs.
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It is possible to uniformly grind large quantities of workpieces up to 1000mm wide! It excels in R chamfering processing.
- Other processing machines
- Wafer processing/polishing equipment
Automating polishing operations with robots. By combining a 3D camera and automatic path generation software, let the robot handle the polishing tasks!
- Wafer processing/polishing equipment
Exhibition at Cobot Expo Japan hosted by Universal Robots.
We plan to mainly exhibit a presentation of Nordbo products at the online exhibition "Cobot Expo Japan Autumn" hosted by Universal Robots.
Buff polishing of the inner surface of pipes is also possible! With our unique polishing machine and years of experience, we can appropriately respond to niche needs.
- Surface treatment contract service
- Other surface treatment equipment
- Wafer processing/polishing equipment