Wafer processing/polishing equipmentの製品一覧
- 分類：Wafer processing/polishing equipment
451～495 件を表示 ／ 全 1022 件
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Work can be done in narrow spaces, and with commercially available spanners and monkey wrenches! A highly convenient screw joint that minimizes tightening scratches.
- Pipe Fittings
- Piping Materials
- valve
Compatible with various optical surfaces! A lens polishing machine that can also be automated!
- Wafer processing/polishing equipment
Polishing process using the synchro-speed method! The grinding wheel spindle rotation speed is Max 2,700 rpm!
- Wafer processing/polishing equipment
The compatible diameter ranges from φ5mm to φ50mm! Introducing polishing machines for optical lenses in small to medium sizes!
- Wafer processing/polishing equipment
With dressing function! The target work is lens polishing machines with a diameter of φ10 to 125mm!
- Wafer processing/polishing equipment
Adopts a mechanism that discharges exhaust upward. It picks up and transfers surrounding chips non-contact without blowing them away with the ejected gas.
- Wafer
- CVD Equipment
- Wafer processing/polishing equipment
We provide high productivity film formation systems.
- Wafer processing/polishing equipment
- Circuit board processing machine
- others
A Bernoulli chuck for non-contact transport of ultra-thin, long workpieces measuring 1.4 mm in width and 55 mm in length.
- Wafer processing/polishing equipment
- Wafer
- Separation device
Compatible with a wide range of materials! It adapts to endless belts, improving work efficiency.
- Wafer processing/polishing equipment
No secondary burrs! We would like to introduce products for customers troubled by burrs and rust!
- Wafer processing/polishing equipment
Compact, easy, safe, and suitable for tight spaces! Introducing the φ50 rubber disc!
- Wafer processing/polishing equipment
Lightweight yet powerful! It can grind reliably at 7000 RPM, and the polished surface will also have a shine.
- Wafer processing/polishing equipment
Complete automation of the grinding and polishing process! Reducing human errors and ensuring very high reproducibility.
- Testing Equipment and Devices
- Wafer processing/polishing equipment
Reduce complexity with a complete surface finishing solution featuring fast and easy setup!
- Wafer processing/polishing equipment
- Other industrial robots
Resolving issues such as 'the grinding machine cannot achieve flatness accuracy' and 'the surface roughness cannot be cleared' *Providing a document with points to check before making a request.
- Processing Contract
- Wafer processing/polishing equipment
Making the manufacturing of electronic components smoother with innovative technology that connects to the world.
- Wafer processing/polishing equipment
It performs chuck surface cleaning, rough grinding, finishing grinding, and polishing fully automatically with one machine!
- Wafer processing/polishing equipment
How about cutting processing that can accurately cut not only width/depth/height but also right angles?
- Fine Ceramics
- Wafer processing/polishing equipment
- Contract manufacturing
Top-class precision polishing! Obtain excellent processing quality with a superior 5-axis polishing machine that excels in detail.
- Wafer processing/polishing equipment
End-pump type semiconductor laser with AOQ switch for third harmonic generation (THG).
- Laser Components
- Laser marker
- Wafer processing/polishing equipment
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Up to a blade length of 2000mm! A clean and functional edge alignment is required for both appearance and performance!
- Wafer processing/polishing equipment
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A jack-of-all-trades for factory machinery and equipment parts! We will introduce our areas of expertise and production achievements!
- Other processing machines
- Other machine tools
- Wafer processing/polishing equipment
It employs a high-rigidity, high-precision barrel cam that demonstrates excellent indexing characteristics.
- Wafer processing/polishing equipment
We are confident that we can provide a suitable polishing line for users due to our extensive track record.
- Wafer processing/polishing equipment
The polishing device that will become the mainstream of buff racing from now on! Various polishing materials can be used.
- Wafer processing/polishing equipment
Multi-stage grinding is possible with a cylindrical grinding machine! High-precision processing can be achieved with centerless grinding!
- Grinding Machine
- Wafer processing/polishing equipment
- Processing Contract
High-precision grinding is possible! It is mainly used for automotive parts such as gears and bearings!
- Wafer processing/polishing equipment
It's not just about making the surface clean! There are various uses depending on the material's properties and purpose!
- Wafer processing/polishing equipment
It is possible to apply the whetstone to the entire grinding area of the product! It is often used for products with large surfaces!
- Wafer processing/polishing equipment
Just press the workpiece against the high-speed rotating grinding wheel! A well-finished product will be completed overall!
- Wafer processing/polishing equipment
The finished appearance looks beautiful! The surface is free of bumps, and we introduce effective processing for deburring!
- Wafer processing/polishing equipment
A device that cleans and removes tape adhesive marks and fingerprints attached to the dicing frame using a unique jet nozzle with high cleaning capability!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- High pressure cleaner
A prototype sheet-type resist stripping and lift-off device for wafer surface treatment using the lift-off resist stripping process!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- High pressure cleaner
A production-type sheet resist strip and lift-off device for wafer surface treatment using a lift-off resist stripping process!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- High pressure cleaner
Surface grinding is possible without removing the roll! It keeps the roll surface in optimal condition.
- Wafer processing/polishing equipment
IPA steam cleaning and drying equipment! Achieving clean drying for devices, wafers, glass, and parts!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- High pressure cleaner
Batch cleaning equipment utilizing cleaning technology and transport/control technology, compatible with various chemical solutions!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- High pressure cleaner
Contributing to the reduction of environmental impact and total cost down in the barrel polishing process.
- Wafer processing/polishing equipment
Equipped with fully automatic and enhanced device functions, as well as remote monitoring capabilities! Contributing to increased productivity in the dicing process!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
The metallic luster is restored with a polished mirror finish; let's regain a like-new shine through polishing!
- Wafer processing/polishing equipment
We offer a lineup of CMP equipment ranging from tabletop models to those compatible with 300mm wafers! Customization and new designs are possible, including features like Dry-in/Dry-out!
- Wafer processing/polishing equipment
By performing "cutting" and "polishing" in one process, we achieve a significant reduction in cross-section cutting work time and high-quality cuts! It can be easily operated by anyone without any ski...
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Achieving high-quality and high-efficiency cutting of various materials, from difficult-to-cut materials like SiC and LTCC to composite materials such as glass and resin!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Dissipates heat and reduces wrap surface friction! Effective when high precision flatness and surface finish are required.
- Wafer processing/polishing equipment
- Other processing machines
The 1 light band represents a flatness of 0.00029mm! The surface is finished through various polishing processes.
- Other measurement, recording and measuring instruments
- Wafer processing/polishing equipment