List of Other electronic parts products
- classification：Other electronic parts
1396～1440 item / All 8034 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
It can be used as an additive for coatings and inks in food packaging, providing design features, texture, and anti-blocking properties.
- plastic
- Other optical parts
- Other electronic parts
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[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!
- Printed Circuit Board
- Other electronic parts
- Other cable related products
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
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Supports micron-level precision! Enables more complex and high-precision machining.
- Other electronic parts
- Analytical Equipment and Devices
We provide heater units tailored to specifications such as Cantal wire and Pt wire!
- Analytical Equipment and Devices
- Other electronic parts
Adopted by the supercomputer "Fugaku"! Introducing a high-performance thermal paste that is "silicone-free" and does not generate low molecular weight siloxanes!
- Other electronic parts
Leave it to us for all your inorganic EL devices and solution systems!
- Other electronic parts
Shining and washable! Achieving a glowing wearable that serves as a safety and security tool during nighttime and other situations.
- Other electronic parts
Long-distance wireless communication IEEE 802.11ah is finally permitted in Japan; a new wireless network expands with IEEE 802.11ah.
- Other electronic parts
Exhibiting Wi-Fi HaLow products and presenting at a seminar at Wireless Japan 2025.
Silex will be exhibiting at "Wireless Japan 2025," one of Japan's largest wireless communication events, held from May 28 (Wednesday) to May 30 (Friday) at Tokyo Big Sight, South Hall 3 and 4. We plan to showcase our 802.11ah (Wi-Fi HaLowTM) products, dynamic demonstrations, and participate in seminars. We sincerely invite you to attend Wireless Japan 2025, where the latest technologies of 802.11ah will be gathered.
Mesh your equipment with minimal investment! Achieve stable communication at all times through redundancy in communication paths.
- Other electronic parts
Highly versatile USB model, combo module compatible with IEEE 802.11ac and Bluetooth(R).
- Other electronic parts
Mesh your equipment with minimal investment! Achieve stable communication at all times through redundant communication paths.
- Other electronic parts
Equipped with Qualcomm's QCA9379-3 chipset. Supports 2x2 MU-MIMO for high-speed transmission of large volumes of data.
- Other electronic parts
Compact, low power consumption, high stability, high frequency, high precision. Continuing to pursue superior crystal devices.
- Other electronic parts
We will propose options tailored to your needs regarding resolution, viewing angle, brightness, and more, depending on the application and usage environment!
- Other electronic parts
Mainly develops, designs, and produces small to medium-sized LCD modules (such as STN, VATN, TFT LCM, touch panels, etc.)!
- Other electronic parts
Complex acceleration and deceleration control, such as S-curve acceleration and deceleration, can be implemented in a short period of time. This contributes to a reduction in development time and cost...
- Other electronic parts
Easy and affordable replacement! Compatible models for Microstat (TY7601A, TY7600A)
- controller
- Other electronic parts
We cover a wide range of technical areas from FPGA design to electronic circuit design, set design, and battery control design!
- Other electronic parts
- Secondary Cells/Batteries
PC full mode excitation type! Custom specifications with different connectors are also available.
- Other electronic parts
The material is SS! We will introduce a variety of products in the V-block type.
- Other electronic parts
The material is SS! We will introduce a variety of angle-type products.
- Other electronic parts
Processed and used for workpiece positioning! A diverse lineup of products.
- Other electronic parts
The material is SS, with a maximum load of 100kg! It makes it easy to quickly remove the workpiece.
- Other electronic parts