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Analysis Product List

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Destructive analysis | Package opening (decapping)

Destructive analysis | Package opening (decapping)

Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?

We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.

  • Other contract services
  • Contract Analysis
  • Microcomputer
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[Analysis Case] Simulation of Impurity Diffusion in Silicon Crystals

[Analysis Case] Simulation of Impurity Diffusion in Silicon Crystals

It is possible to determine the diffusion pathways and barriers through simulation.

The electrical, optical, and magnetic properties of semiconductors are strongly influenced by defects and impurities present in the system. Therefore, to achieve the desired material properties, it is necessary to understand and control the behavior of defects and impurities. However, evaluating atomic-level microscopic behavior through experimental methods is challenging, making approaches using computational simulations effective. This document presents a case study using first-principles calculations with the NEB (Nudged Elastic Band) method to evaluate the diffusion pathways and barriers of metal impurities (Fe) in silicon crystals.

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  • Contract Analysis
  • Contract measurement
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[Analysis Case] Evaluation of Crystal Structure by Micro XRD Analysis

[Analysis Case] Evaluation of Crystal Structure by Micro XRD Analysis

XRD measurements in micro areas are possible.

We will introduce a case where XRD measurements were conducted by narrowing the X-ray beam to Φ400μm, allowing us to obtain crystal information targeting a specific area rather than the entire surface. In the XRD measurement results of the printed circuit board sample, Cu and BaSO4 were detected at all measurement points (1) to (3), and a peak from Au was detected at the measurement point (1), which is the electrode. This aligns well with the results from XRF measurements. Thus, it is possible to identify crystal structures by targeting regions of several hundred micrometers with different compositions and crystallinities. Measurement methods: XRD, XRF Product fields: LSI, memory, electronic components Analysis purposes: Composition evaluation, identification, structural evaluation For more details, please download the materials or contact us.

  • Contract Analysis
  • Analysis

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Analysis of crystal grains below 30nm using the EBSD method.

Analysis of crystal grains below 30nm using the EBSD method.

EBSD: Electron Backscatter Diffraction

By conducting EBSD analysis on thinned samples, higher spatial resolution can be achieved compared to conventional bulk samples.

  • Contract Analysis
  • Analysis

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Extreme point measurement

Extreme point measurement

XRD: X-ray diffraction method

Pole figure measurement is a method that focuses on specific crystal planes and evaluates the distribution of crystal orientations by directing X-rays from various directions onto the sample. The detector is fixed at the diffraction angle (2θ) of the crystal plane of interest, and the two parameters, α (the tilt angle of the sample) and β (the in-plane rotation angle of the sample), are varied to measure crystal planes tilted in all directions. This indicates that the crystal orientations are concentrated in the directions where high diffraction intensity is observed. Additionally, the measurement results are represented in a pole figure as shown in the diagram at the bottom right.

  • Contract Analysis
  • Analysis

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Structural analysis using Xe-plasma FIB.

Structural analysis using Xe-plasma FIB.

Precision processing/structural evaluation is possible over a wide area of several hundred micrometers.

It achieves high positional accuracy and wide-area cross-section production, making it usable as a new large-capacity analysis application. Even small structures within a large area can be targeted for processing, enabling wide-area structural analysis.

  • Contract Analysis
  • Analysis

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[Analysis Case] Analysis of H termination on Si surface

[Analysis Case] Analysis of H termination on Si surface

Qualitative and relative comparison of SiH and states on the Si surface due to differences in processing.

We compared the states of the Si surface after HF treatment and after ozone treatment. In the positive ion spectrum, the peak intensity of Si was different. The weaker Si intensity after HF treatment is due to Si being metallic, while the stronger Si intensity after UV-ozone cleaning and in the As Received state is due to Si being oxide-based. From the negative ion spectrum, fragment ions reflecting the surface state were detected: SiF, SiH, and Six series after HF treatment, and SiO2 series after UV-ozone cleaning and in the As Received state.

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  • Contract Analysis
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[Analysis Case] Structural Analysis of Amorphous SiNx Films Using Molecular Dynamics Calculations

[Analysis Case] Structural Analysis of Amorphous SiNx Films Using Molecular Dynamics Calculations

Microscopic structural analysis of amorphous films is possible through simulation.

Amorphous SiNx (a-SiNx) films exhibit significant changes in physical properties from semiconductors to insulators due to compositional variations such as the N/Si ratio, making them suitable for a wide range of applications, including gate insulating films for transistors. On the other hand, experimental methods capable of atomic-level microscopic structural analysis for materials with non-crystalline amorphous structures are limited. Therefore, creating and analyzing amorphous structures with various compositions and densities through simulation becomes an effective tool. This document presents examples of structural analysis of a-SiNx films using molecular dynamics calculations.

  • Contract Analysis
  • Memory
  • Analysis

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Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

  • Contract Analysis
  • Other semiconductors
  • Other contract services
  • Analysis

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Power product electrical analysis services

Power product electrical analysis services

Design and development support considering the transmission line characteristics of power products.

Our company provides design support based on a wide range of experience in semiconductor application products, from LSI to power electronics. In the field of power electronics, represented by inverters, which has gained attention in recent years, solving challenges during switching is a key point. We can offer comprehensive design support, from transmission line analysis using electromagnetic field analysis simulators to product evaluation, and further to analysis and verification of circuit simulations.

  • Calibration and repair
  • Analysis

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Extrusion Resin Analysis (CAE)

Extrusion Resin Analysis (CAE)

The entire process from design to the creation of a 3D flow model, flow analysis, and molding is testable!

At Axmolding, specialists handle the process, and we can take on everything from consulting for development and design to execution as a whole. Our company can test a complete flow from design to creating 3D models of flow paths, flow analysis, and actual molding. We are capable of creating 3D models of extrusion flow paths that are complex and have many curved surfaces. Additionally, we use Japanese-made software from HASL for analysis. 【Analysis Software】 ■ Materialfi - Resin calculation formula definition ■ FLATSimulator - For T-die analysis ■ SpiralSimulator - For round die analysis ■ SingleSrewSimulator - For single screw analysis ■ FlowSimulator3D - For 3D, irregular shapes, and multilayer analysis For more details, please refer to our catalog or feel free to contact us.

  • Extrusion Machine
  • Contract Analysis
  • Other analyses
  • Analysis

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Numerical analysis solution

Numerical analysis solution

Supporting your product development and problem-solving with fluid analysis and structural analysis using 3D CAE!

Our company supports model-based development, which is increasingly in demand in the automotive industry, by providing necessary CAE for requirement analysis, control design (control target models), and verification tools (MILS, HILS). Leveraging this know-how, we conduct analysis work that concretizes the physical phenomena required for products in the upstream stages of product development using 1D CAE. In model-based development, we advance the development while verifying based on the "model" created on the computer. We assist in addressing challenges (efficiency, quality assurance) in the development process by developing tools tailored to our customers' needs. 【Features】 - Development of tools for 1D simulation used in the requirement analysis stage of products and conducting analysis work using 1D simulation. - Conducting model-based development, including the creation of control target models (plant models) using MATLAB/Simulink. - Development and verification of necessary verification tools (MILS, HILS) in the downstream part of model-based development. *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract Analysis
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Surface and thin film analysis of semiconductors

Surface and thin film analysis of semiconductors

Detailed investigation of surface chemical composition, bonding states, and impurity distribution!

We would like to introduce our "Surface and Thin Film Analysis of Semiconductors." We propose effective analyses for material evaluation and failure mode identification in the process development, process management, and failure analysis of semiconductor devices. We provide detailed information that is useful for research and development, manufacturing processes, and failure analysis by examining the chemical composition, bonding states, and impurity distribution of surfaces. Please feel free to contact us when you need our services. 【Top Surface】 ■Composition: XPS ■Bonding State: XPS ■Contamination: TOF-SIMS, ICP-MS ■Roughness: AFM, SEM *For more details, please download the PDF or feel free to contact us.

  • Contract Analysis
  • Analysis

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Migration service "VB Quick Shift"

Migration service "VB Quick Shift"

Are there any Visual Basic systems struggling with obsolescence? Windows 10 will end support in October 2025!

Revitalize your aging Visual Basic system with low cost and short delivery time while keeping operations the same! If you continue to use it as is... The security risks and failure risks will remain very high. Do you have any of these concerns? - Not prepared for the upgrade to Windows 11 - Unable to refresh the old VB system due to a lack of personnel - Using the same computer and server for years - Not taking measures against information leaks or unauthorized access - System processing speed has slowed down, reducing work efficiency We will solve these issues with our "VB Quick Shift"! 【Service Features】 1. Free consultation! 2. We can accommodate even from one function 3. We achieve high quality with our accumulated know-how 4. We support the latest OS *For more details, please check the related links or feel free to contact us.

  • Other information systems
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Power semiconductor analysis service

Power semiconductor analysis service

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu office in 1993, we have cultivated our own unique analysis and evaluation techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 ■ OBIRCH analysis supports not only Si but also SiC and GaN devices ■ FIB processing is possible from either side ■ Visualization of the depletion layer formed at the PN junction ■ Elemental analysis such as EDS and EELS is also supported *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services
  • Contract Analysis
  • Semiconductor inspection/test equipment
  • Analysis

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Contracted analysis service

Contracted analysis service

Support for synchronizing design and analysis with the necessary analysis items for the product design process unit!

Our company supports the synchronization of design and analysis from the early stages of design through static analysis, eigenvalue analysis, contact analysis, buckling eigenvalue analysis, and time history response analysis. We provide the necessary analysis items tailored to your product design process. Additionally, we have extensive experience in contract analysis using general commercial tools. Please feel free to consult us if you have any requests. 【Software We Use】 ■ Creo Parametric, Simulate ■ ProTOp ■ FloEFD ■ Abaqus ■ I-sight ■ Ls-DYNA ■ Transmission3D *For more details, please download the PDF or feel free to contact us.

  • Contract Analysis
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Report: Detailed Structural Analysis of Application Processor Logic

Report: Detailed Structural Analysis of Application Processor Logic

This is a detailed structural analysis of the Mediatek MT6592 octa-core (8-core).

This report is a detailed structural analysis of the Mediatek MT6592 octa-core (8-core) application processor. The MT6592 features an ARM Cortex-A7 processor and is marketed as a "true octa-core" SoC, equipped with a 4-core ARM MaliTM GPU, supporting Full HD displays, cameras up to 16 million pixels, multi-mode cellular modems, and dual-band 802.11n Wi-Fi, among other features. The MT6592 is manufactured using TSMC's HPM CMOS process with an 8-layer metal (7 Cu, 1 Al) structure, high-k metal gate (HKMG), and a gate length of 28nm. 【Features】 ○ Crystal orientation of the transistor channel <110> ○ Hafnium oxide (HfO2) material for the gate insulating film ○ Dual work function metal gate ○ nMOS (NiSi) and pMOS (NiSiGe) source/drain regions, and low-k interlayer insulating film For more details, please contact us or download the catalog.

  • Analysis Services
  • Analysis

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[Data] Optimization Methods in Nonlinear Domains

[Data] Optimization Methods in Nonlinear Domains

Implemented using three methods, including DOE optimization! An explanation of our optimization techniques in the nonlinear domain.

This document introduces the optimization of nonlinear areas, such as collisions, conducted by GRM Consulting. It explains the comparison of flows for each optimization method, model conversion, creation of load conditions, and verification through linear analysis. By utilizing optimization up to the nonlinear area, significant labor reduction effects can be achieved. 【Contents (partial)】 ■ Introduction ■ Benefit ■ Comparison of flows for each optimization method ■ Comparison of optimization flows (1) vs (2) ■ Summary of nonlinear optimization methods *For more details, please refer to the PDF document or feel free to contact us.

  • Other analyses
  • Analysis

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Technical Information Magazine 201905-01 Crystal Orientation Analysis with High Spatial Resolution

Technical Information Magazine 201905-01 Crystal Orientation Analysis with High Spatial Resolution

The technical information magazine The TRC News provides the latest information on analytical techniques that are useful for research and development, solving production troubles, and quality control.

**Abstract** Using the TEM-based crystal orientation analysis system "ASTAR," it is possible to achieve higher spatial resolution than that of SEM-based EBSD (with spatial resolution of various EBSD methods being around tens of nanometers, while the ACOM-TEM method using ASTAR achieves 2 to 5 nm). Additionally, it is characterized by the ability to identify a greater variety of crystal structures. By obtaining crystal orientation maps, crystal phase maps, and grain size distributions that are difficult to acquire through conventional TEM analysis, quantitative interpretation becomes possible. Furthermore, since measurements can be taken in the same field of view as TEM observations, it allows for complex analyses combined with (S)TEM-EDX/EELS and the use of in-situ TEM. **Table of Contents** 1. Introduction 2. ACOM-TEM Method Using ASTAR 3. Examples of Analysis Using ASTAR 4. Conclusion

  • Contract Analysis
  • Contract measurement
  • Technical and Reference Books
  • Analysis

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Coupled analysis with 3D simulation (VPS)

Coupled analysis with 3D simulation (VPS)

Introduction to the current situation regarding updates on coupled analysis with VPS.

I would like to introduce the current situation regarding updates on coupled analysis with VPS (Virtual Performance Solution). In the GUI, we create models for coupled analysis using ESI Group's integrated GUI environment, VE (Visual Environment), specifically Visual-Systems. With the release of VE 13.5, the number of available components has increased. Specifically, in the previous version, the outputs from the VPS model were limited to position, displacement, angle, and angular velocity. However, in the current version, it now supports displacement and load, and the outputs to the VPS model have expanded to include not only load and pressure sensors but also displacement, velocity, and moment. This significantly broadens the range of cases for conducting coupled analysis. *For more details, please feel free to contact us.*

  • Other analyses
  • simulator
  • Analysis

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Cooling analysis of motors with 'Simerics MP+'

Cooling analysis of motors with 'Simerics MP+'

Not only applicable to hydraulic circuits such as engines and transmissions, but there are also numerous achievements in the analysis of oil cooling, water cooling, and air cooling circuits for motors and batteries!

PumpLinx is a fluid analysis software designed to calculate the transient characteristics of various volumetric pumps, compressors, and valves. It is developed based on the thermal fluid analysis software Simerics MP and utilizes all the features of Simerics MP. 【The following fluid analyses are possible】 ■ Free surface flow ■ Flow considering the compressibility of air contained in liquids ■ Pressure pulsation and water hammer effects ■ Coupling of pump flow with the rigid body motion of valves and cam rings ■ Flow in low to medium vacuum conditions ■ Compressible flow (subsonic) ■ Cavitation ■ Time variation of flow field (velocity vectors, pressure), flow rate, fluid forces, and torque The biggest strength is the ability to automatically create meshes with clearances in the µm range, which is difficult with other general-purpose fluid analysis software!! Recently, there have been increasing inquiries about SimericsMP+ due to difficulties in VOF analysis with other CFD software. SimericsMP+ has strengths in VOF and is well-regarded for its support. *There is a lot of information that cannot be posted online. Especially, the actual mesh creation and movement should definitely be demonstrated in a demo!

  • Thermo-fluid analysis
  • Contract Analysis
  • simulator
  • Analysis

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Fluid analysis for automotive oil lubrication, "Simerics MP+"

Fluid analysis for automotive oil lubrication, "Simerics MP+"

Fluid analysis software for positive displacement pumps such as gear pumps and vane pumps! A CFD software specialized for pumps that other CFD software struggles with!

PumpLinx is a fluid analysis software designed to calculate the transient characteristics of various volumetric pumps, compressors, and valves. It is developed based on the thermal fluid analysis software Simerics MP and utilizes all the features of Simerics MP. 【The following fluid analyses are possible】 ■ Free surface flow ■ Flow considering the compressibility of air contained in liquids ■ Pressure pulsation and water hammer effects ■ Coupling of pump flow with the rigid body motion of valves and cam rings ■ Flow in low to medium vacuum conditions ■ Compressible flow (subsonic) ■ Cavitation ■ Time variation of flow field (velocity vector, pressure), flow rate, fluid forces, and torque The biggest strength is the ability to automatically create meshes with clearances in the µm range, which is difficult for other general-purpose fluid analysis software!! Recently, there has been an increase in applications for automotive and construction machinery oil pumps, with examples such as vane pumps for power steering and CVTs, as well as trochoidal pumps for engine lubrication. *There is a lot of information that cannot be posted online. Especially, we encourage you to see the actual mesh creation and movement through a demo presentation!

  • Thermo-fluid analysis
  • Contract Analysis
  • simulator
  • Analysis

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Moving Boundary: Analysis of Wind Pressure Acting on a Running Train

Moving Boundary: Analysis of Wind Pressure Acting on a Running Train

We analyzed the aerodynamic pressure acting on a moving train.

Moving Boundary: The analysis of wind pressure acting on a moving train was conducted using numerical simulations that take into account the moving boundary. There are concerns that strong winds, such as those caused by typhoons, can overturn moving trains. Therefore, understanding the wind pressure acting on a moving train is crucial. For more details, please download the catalog.

  • simulator
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  • Structural Analysis
  • Analysis

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Contracted services, contracted analysis

Contracted services, contracted analysis

This is a contract analysis utilizing the three-dimensional structure of proteins. The technical staff of the Waals development team will support optimal results.

■ Contract Analysis We offer contract analysis using three-dimensional structures. We will conduct analyses tailored to your specific requests. To date, we have received requests from universities, national and public research institutes, and companies, and our services have been useful for paper submissions and patent applications. Examples of Analysis - Analysis of the impact of genetic mutations on protein three-dimensional structures - Analysis of interactions between proteins and substrates, small molecules, etc. - Analysis of interactions between proteins (antigen-antibody, ligand-receptor, between subunits, etc.) - Analysis of disease-causing mutations and SNPs in three-dimensional structures If you are unsure how to utilize three-dimensional structures in your research, please feel free to consult with us. We will consider what analyses are possible based on your experimental data and information from the Protein Data Bank (PDB). We welcome your inquiries. We look forward to hearing from you. info@altif-labs.com https://altif-labs.com/site/Service.html

  • Protein Analysis Software
  • Analysis

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SIMCA for Cosmetics: Sensory Evaluation Data Analysis

SIMCA for Cosmetics: Sensory Evaluation Data Analysis

Analyze sensory evaluation data with a click! Supporting quality improvement.

In the cosmetics industry, product quality evaluation is a crucial factor that influences consumer satisfaction. In particular, sensory evaluation is essential for assessing subjective elements such as product fragrance, texture, and usability. However, sensory evaluation data is complex and requires multifaceted analysis. SIMCA provides solutions to address these challenges by using multivariate analysis to thoroughly analyze sensory evaluation data, aiding in product development and quality management. 【Use Cases】 * Analysis of sensory evaluation data such as fragrance assessment, texture evaluation, and usability evaluation * Quality management of products and comparison with competing products * Consideration of optimal formulations in new product development 【Benefits of Implementation】 * Visualization and enhanced understanding of sensory evaluation data * Improvement of product quality and increase in customer satisfaction * Support for objective decision-making based on data

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  • Other analysis software
  • Statistical analysis
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Fluid analysis for hydraulic circuits of construction machinery, "Simerics MP+"

Fluid analysis for hydraulic circuits of construction machinery, "Simerics MP+"

Fluid analysis software for positive displacement pumps such as gear pumps and vane pumps! CFD software specialized for pumps that other CFD software struggles with!

PumpLinx is a fluid analysis software designed to calculate the transient characteristics of various volumetric pumps, compressors, and valves. It is developed based on the thermal fluid analysis software Simerics MP and utilizes all the features of Simerics MP. 【The following fluid analyses are possible】 ■ Free surface flow ■ Flow considering the compressibility of air contained in liquids ■ Pressure pulsation and water hammer effects ■ Coupling of pump flow with the rigid body motion of valves and cam rings ■ Flow in low to medium vacuum conditions ■ Compressible flow (subsonic) ■ Cavitation ■ Time variation of flow field (velocity vectors, pressure), flow rate, fluid forces, and torque The biggest strength is the ability to automatically create meshes with clearances in the µm range, which is difficult with other general-purpose fluid analysis software!! Recently, there has been an increase in achievements for oil pumps used in automobiles and construction machinery, with examples such as vane pumps for power steering and CVTs, and trochoidal pumps for engine lubrication. *There is a lot of information that cannot be posted online. Especially, please see a demo for the actual mesh creation and movement!

  • Thermo-fluid analysis
  • Analysis

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